公开(公告)号：EP2582217A3

公开(公告)日：2017-04-19

申请号：EP12186296.5

申请日：2012-09-27

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Lashbrook, Joseph M.

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/34 ,  H01L23/36

CPC classification number: H05K7/20927 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20872 ,  H01L2924/00

Abstract: An assembly (10) for liquid cooling electronics by direct submersion into circulated engine coolant that includes an epoxy material (48) dispensed around leads (42,44) of electronics devices (combination of 34, 36, 38) in a manner effective to mechanically secure the electronics devices to the assembly (10) and prevent engine coolant leakage around the leads, and a Parylene™ coating layer (50) deposited in a manner effective to protect the electronic device (34) from electrically conductive engine coolant such as ethylene glycol. Such an assembly (10) is useful in hybrid electric vehicles that have engine coolant available from the vehicle's internal combustion engine.

公开(公告)号：EP2789822B1

公开(公告)日：2016-06-08

申请号：EP14163084.8

申请日：2014-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Eltom, Khalid M. ,  Myers, Bruce A. ,  Eesley, Gary L. ,  Moor, Bruce

IPC: F01N5/02 ,  F01N13/16

CPC classification number: H01L35/30 ,  F01N5/025 ,  F01N2240/02 ,  Y02T10/16

公开(公告)号：EP2582217A2

公开(公告)日：2013-04-17

申请号：EP12186296.5

申请日：2012-09-27

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Lashbrook, Joseph M.

IPC: H05K7/20 ,  H01L23/34

CPC classification number: H05K7/20927 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20872 ,  H01L2924/00

Abstract: An assembly (10) for liquid cooling electronics by direct submersion into circulated engine coolant that includes an epoxy material (48) dispensed around leads (42,44) of electronics devices (combination of 34, 36, 38) in a manner effective to mechanically secure the electronics devices to the assembly (10) and prevent engine coolant leakage around the leads, and a Parylene™ coating layer (50) deposited in a manner effective to protect the electronic device (34) from electrically conductive engine coolant such as ethylene glycol. Such an assembly (10) is useful in hybrid electric vehicles that have engine coolant available from the vehicle's internal combustion engine.

Abstract translation: 用于液体冷却的电子组件（10）通过浸没入循环到直接做发动机冷却剂包括以一种方式的电子设备的环氧树脂材料（48），配发的周围引线（42,44）（34组合，36，38）有效地机械 确保电子设备的组件（10），并防止所述引线围绕发动机冷却剂泄漏，和帕利灵“¢涂料层（50）沉积在有效地保护该电子装置（34）由导电的发动机冷却剂的方式：如乙烯 乙二醇。 上组件（10）的搜索是在混合电动车辆有用thathave可从车辆的内燃机的发动机冷却剂。

公开(公告)号：EP1351562B1

公开(公告)日：2010-09-01

申请号：EP03075806.4

申请日：2003-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A. ,  Tsai, Jeenhuei ,  Chengalva, Suresh K.

IPC: H05K9/00

CPC classification number: H05K5/065 ,  H05K1/0203 ,  H05K3/284 ,  H05K9/0045 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172

公开(公告)号：EP1740027A3

公开(公告)日：2009-06-03

申请号：EP06076193.9

申请日：2006-06-08

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Degenkolb, Thomas A. ,  Walsh, Matthew R. ,  Tsai, Jeenhuei S.

IPC: H05K3/28

CPC classification number: H01L23/4334 ,  B29C45/14065 ,  B29C45/14467 ,  B29C45/14655 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A technique for manufacturing an electronic assembly uses a mold (40) that has a first mold portion (44) and a second mold portion (42). The first mold portion (44) includes a plurality of spaced mold pins (46) extending from an inner surface. A cavity of the first and second mold portions (44,42) provides a mold cavity (111), when joined. A backplate (110) is also provided that includes a plurality of support pedestals (112) and an integrated heatsink (114) extending from a first side of the backplate (110). A substrate (102) includes a first side of an integrated circuit (IC) die (106A) mounted to a first side of the substrate (102). The backplate (110) and the substrate (102) are placed within the cavity of the second mold portion and the support pedestals (112) are in contact with the first side of the substrate (102). The first and second mold portions (44,42) are joined and the mold pins (46) contact a second surface of the substrate (102) during an overmolding process.

公开(公告)号：EP1739741A3

公开(公告)日：2008-12-31

申请号：EP06076225.9

申请日：2006-06-14

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A.

IPC: H01L23/367 ,  H01L23/492

CPC classification number: H01L23/3675 ,  H01L23/3677 ,  H01L23/492 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate (102A) with a cavity (110) formed into a first side of the backplate (102A) is provided. Next, an insert (106C) is inserted within the cavity (110). Then, a substrate (204), with a first side of an integrated circuit (IC) die (208) mounted to a first side of the substrate (204), is provided. The IC die (208) is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate (204). The first side of the substrate (204) is positioned in contact with the first side of the backplate (102A) and a second side of the IC die (208) is soldered to the insert (106C), acts as a heatsink.

公开(公告)号：EP1951013A3

公开(公告)日：2008-10-15

申请号：EP08100444.2

申请日：2008-01-14

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Delheimer, Charles I.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/305 ,  H01R12/7041 ,  H01R43/00 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K2203/1105 ,  Y02P70/613

Abstract: Processes for reliably and durably mounting a connector body to a surface of a circuit board without using conventional underfill and overmolding techniques are provided. These processes involve preparation of a self adhering connector subassembly (30) comprising a connector body (12) and an activatable solid adhesive (24) disposed on a mounting surface (32) of the connector body (12), positioning of the subassembly (30) on a circuit board, and activation of the adhesive (24) to securely attach the connector body (12) to the circuit board. The activable solid adhesive (24) has a pattern of openings in which the solder balls (18) project.

公开(公告)号：EP1291912B1

公开(公告)日：2008-07-30

申请号：EP02078469.0

申请日：2002-08-21

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Brandenburg, Scott D. ,  Tsai, Jeenhuei S.

IPC: H01L23/31 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L23/3107 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15151

公开(公告)号：EP1583160A3

公开(公告)日：2008-07-02

申请号：EP05075731.9

申请日：2005-03-29

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Tsai, Jeehuei S. ,  Burns, Jeffrey H.

IPC: H01L33/00

CPC classification number: H01L23/3185 ,  H01L23/293 ,  H01L23/315 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/54 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2224/05599

Abstract: A microelectronic assembly includes an integrated circuit die spaced apart from a substrate and connected by bump interconnections, and an polymeric encapsulant molded about the die. The encapsulant extends into the gap about the interconnections, but is confined to the perimeter so as to define an underchip optical window adjacent the central region of the die. The window allows optical access to the active face of the die, including to optical sensors thereon. During manufacture of the assembly, following attachment of the die on the substrate, a molding cavity is positioned about the die on the substrate. Polymeric material is injected into the cavity at a pressure effective to initiate flow into the gap about the solder bump interconnections. The pressure is then reduced to prevent flow of the polymeric material into the central region.

公开(公告)号：EP1873866A2

公开(公告)日：2008-01-02

申请号：EP07075492.4

申请日：2007-06-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A.

IPC: H01R12/04

CPC classification number: H01R4/2404 ,  H01R12/58 ,  H01R13/405 ,  H01R43/24

Abstract: An electrical connector assembly (15) and method of connecting an electrical connector (20) to a substrate (12) are provided. The electrical connector assembly (15) includes a substrate (12) having electrical circuitry (16), a shroud (30), and a plurality of conductive pins (20). The conductive pins (20) are pressed into contact with contact pads (16) of the electrical circuitry. The electrical connector assembly (15) also includes an overmolding material (36) securing the shroud (30) such that the conductive pins (20) contact the electrical circuitry (16).

Abstract translation: 提供了电连接器组件（15）和将电连接器（20）连接到基板（12）的方法。 电连接器组件（15）包括具有电路（16），护罩（30）和多个导电销（20）的基板（12）。 导电引脚（20）被压接成与电路的接触焊盘（16）接触。 电连接器组件（15）还包括固定护罩（30）的包覆模制材料（36），使得导电销（20）接触电路（16）。