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    42.
    发明专利
    未知

    公开(公告)号：DE10340608A1

    公开(公告)日：2005-03-24

    申请号：DE10340608

    申请日：2003-08-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： HALIK MARCUS ,  WALTER ANDREAS ,  KLAUK HAGEN ,  SCHMID GUENTER ,  ZSCHIESCHANG UTE

    IPC: G03F1/90 ,  H01B3/18 ,  H01B3/44 ,  H01L51/05 ,  C09D5/25 ,  C08L33/10 ,  H01L51/30

    Abstract: An embodiment of the invention provides an integrated circuit having an organic field effect transistor (OFET) with a dielectric layer. The dielectric layer is prepared from a polymer formulation comprising: about 100 parts of at least one crosslinkable base polymer, from about 10 to about 20 parts of at least one di- or tribenzyl alcohol compound as an electrophilic crosslinking component, from about 0.2 to about 10 parts of at least one photo acid generator, and at least one solvent. Another embodiment provides a semiconductor fabrication method. The method comprises applying the polymer formulation to a surface of a substrate, drying the polymer formulation, crosslinking the polymer formulation after drying, and baking the polymer formulation after crosslinking.

    44.
    发明专利
    未知

    公开(公告)号：DE10228763A1

    公开(公告)日：2004-01-29

    申请号：DE10228763

    申请日：2002-06-27

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： WALTER ANDREAS ,  GNUECHTEL INGO ,  MALTENBERGER ANNA ,  SEZI RECAI ,  HARTMANN HORST

    IPC: C07C215/82 ,  C07B61/00 ,  C07C213/02 ,  C07C215/80 ,  C07C217/90

    Abstract: Bis-aminophenols are new. Bis-aminophenols of formula (I) are new. G = oxgyen or sulfur; M = formula (II)-(IX); R1, R2 = phenyl, -(CH2)nCH3, -G-(CH2)nCH3, -C(CH3)3, -GC(CH3)3, -(CF2)nCF3, -G-(CF2)nCF3, -G-CH(CH3)2, -CH(CH3)2, -CF(CF3)2, -C(CF3)3, -N(CH3)2, -N(CF3)2, -C(R1)(R2)-, -C(O)-, -O-, -S- or -N(R1)-; n = 0-5. An Independent claim is included for a process for the preparation of bis-aminophenols (I) by reaction of a diol (II) to form a nitroso compound followed by reduction to form the bis-aminophenol (I).

    Use of polybenzoxazole polymers for adhesive bonding, especially for bonding chips and-or wafers, e.g. silicon wafers with titanium nitride-coated silicon chips
    46.
    发明专利
    Use of polybenzoxazole polymers for adhesive bonding, especially for bonding chips and-or wafers, e.g. silicon wafers with titanium nitride-coated silicon chips 未知

    公开(公告)号：DE10137375A1

    公开(公告)日：2003-02-27

    申请号：DE10137375

    申请日：2001-07-31

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： WALTER ANDREAS ,  SEZI RECAI ,  MALTENBERGER ANNA

    IPC: C09J179/06 ,  C09J5/04

    Abstract: The use of polybenzoxazoles for adhesive bonding. The use of polybenzoxazoles (PBO) of formula (I) for adhesive bonding. a, d = 0 or 1; a = d; b, c = 0-100; X = H, optionally substituted alkyl, alkenyl, cycloalkenyl, aryl, aralkyl, aralkenyl, aralkynyl or heterocycloalkyl (if a = d = 0), or hydroxy, optionally substituted alkoxy, alkenoxy, aryloxy, cycloalkenoxy, amino, alkylamino, alkenylamino, arylamino, arylalkenoxy or arylalkylamino (if a = d = 1); Y1-Y4 = arylene, polynuclear aromatic hydrocarbylene, a condensed ring system, alkylene, alkenylene, alkynylene, aralkylene, aralkenylene, aralkynylene, heterocyclo- or cyclo-alkylene (all optionally substituted); Z1-Z3 = aryl, aralkyl, aralkenyl, aralkynyl, heteroaryl, polynuclear aromatic hydrocarbon groups or condensed ring systems (all optionally substituted) Independent claims are also included for (1) a method for bonding materials or components by coating the surface(s) with (I), bringing the joint halves together, crosslinking (I) and possibly heating; (2) objects or components with at least two parts bonded together with (I) by this method; and (3) adhesive compositions containing 5-40 wt% (I), 60-95 wt% organic solvent and 0.1-10 wt% crosslinker

    Preparation of highly crosslinked temperature stable polymers from polyhydroxyamide useful in microelectronics, e.g. for multi-chip modules, and in the automobile, machine tool, aircraft, and space shuttle industries.
    47.
    发明专利
    Preparation of highly crosslinked temperature stable polymers from polyhydroxyamide useful in microelectronics, e.g. for multi-chip modules, and in the automobile, machine tool, aircraft, and space shuttle industries. 未知

    公开(公告)号：DE10126572A1

    公开(公告)日：2003-01-23

    申请号：DE10126572

    申请日：2001-05-31

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： WALTER ANDREAS ,  HALIK MARCUS ,  HOESCH HOLGER ,  SEZI RECAI

    IPC: C08G69/04 ,  C08G69/26 ,  C08G69/28 ,  C08G69/46 ,  C08G69/48 ,  C08G73/22

    Abstract: A new polyhydroxyamide (A) for preparation of highly crosslinked, temperature stabile polymers, based on a benzenetricarboxylic acid to which side chains are bonded via an amide bond and which has terminal reactive groups through which highly crosslinked polymers can be obtained by direct polymerization. Polyhydroxyamides of formula (I): a, f, k = 0 or 1; b, g, l = 0-100; c, h, m = 0 or 1; d, i, n = 0 or 1; e, j, o = 0 or 1; and when a (f, k) = 0, b (g, l) = c (h,m) or = 0; when c (h, m) =o, d (i, n) = 0; when d (i, n) = 1, e (j, o) = 1, and when a (f, k) = 1 and b (g, l) = c (h, m) =0, d (i, n) = 0; Z = an up to 100C 4-bond residue; Y = a 2-bond residue with two carbonyl groups, which forms an amide bond with the adjacent nitrogen, which includes up to 100C atoms; and X = H or an up to 30C single bond residue with at least one reactive group which can form a bond with another reaction center. Independent claims are included for: (1) a three-dimensionally crosslinked polymer obtainable from a monomer, oligomer or polymer with at least one reactive group which can react with group X to form a chemical bond, by reaction with a polyhydroxyamide (A); and (2) a three-dimensionally crosslinked polymer in which the group X has a polymerizable double or triple bond, and the reactive group which can react with the group X to form a chemical bond is a polymerizable double or triple bond.

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