公开(公告)号：DE10235332A1

公开(公告)日：2004-02-19

申请号：DE10235332

申请日：2002-08-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  STADLER BERND ,  WEBER MICHAEL ,  THEUS HORST ,  DANGELMAIER JOCHEN ,  DAECHE FRANK

IPC: H01L21/48 ,  H01L23/055 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L27/146 ,  H01L31/0203 ,  H05K1/11 ,  H05K3/20 ,  H05K3/46 ,  H01L23/50 ,  H05K1/18

Abstract: Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. An anchoring layer (12) is arranged between the rewiring layer and the insulating layer and contains metallic plates (13) for fixing the through-structures in the switch support. The outer contact surfaces and the metallic plates are electrically connected to the rewiring structure. Independent claims are also included for processes for the production of the switch support.

公开(公告)号：DE59906716D1

公开(公告)日：2003-09-25

申请号：DE59906716

申请日：1999-12-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEBER MICHAEL ,  STEGER JOHANN

IPC: G06F9/40 ,  G06F8/65 ,  G06F9/42 ,  G06F9/44 ,  G06F9/445 ,  G06F9/448 ,  G06F11/00

Abstract: A method for changing the execution of a program stored in a read only memory is described. For this purpose, the program has a multiplicity of program routines, and each program routine can be allocated a subprogram that is stored in a first read/write memory. In addition, each program routine has associated memory locations in a second read/write memory. If a program routine has an associated subprogram, the program routine then calls the subprogram on the basis of the content of the associated memory locations.

公开(公告)号：DE10063078A1

公开(公告)日：2002-07-11

申请号：DE10063078

申请日：2000-12-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STEGER JOHANN ,  WEBER MICHAEL ,  HEIN WERNER

IPC: H04L27/22 ,  H04B1/16 ,  H04L1/16 ,  H04L1/18 ,  H04L27/00 ,  H04L1/12

Abstract: The receiver has a data frame separation circuit (11), which separates signaling data from information data of a data frame. A switching unit (20) switches through signaling data and information data provided at first and second data inputs (22,19) respectively. The switched through data are decoded by a channel decoding circuit (35), which generates signals indicating error-free decoding. A first indication signal indicates the error-free decoding of signaling data and a control circuit (52) stores the information data, the decoding instruction and the data frame identifier in a memory. The control circuit provides a control signal to the switching unit for switching through stored information data to the channel decoding circuit when receiving the first indication signal. A second indication signal indicates the error-free decoding of information data and the control circuit provides the information data to a data processing unit when receiving the second display signal.

公开(公告)号：DE10004410A1

公开(公告)日：2001-08-16

申请号：DE10004410

申请日：2000-02-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  LEHNER RUDOLF ,  PETZ MARTIN ,  WEBER MICHAEL ,  AUBURGER ALBERT ,  HAINZ OSWALD ,  LANG DIETMAR

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L21/98 ,  H01L23/31 ,  H01L23/482 ,  H01L25/04 ,  H01L25/18 ,  H01L23/48 ,  H01L21/60

Abstract: The semiconductor device has a package enclosing a semiconductor chip having a first metallisation (7) on a first main side (5) of the chip. The first metallisation is connected via electrical conductors (9) to contacts (10) extending to the second main surface (3) of the chip, and being enclosed in the package. A second metallisation is provided on the second main side (6) of the chip for carrying signals. The second metallisation and the contacts lie flush with the second main surface. The package is formed from a plastics compound.