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1.发明专利
公开(公告)号：JP2002124597A
公开(公告)日：2002-04-26
申请号：JP2001287531
申请日：2001-09-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor： PAULUS STEFAN , AUBURGER ALBERT , HAINZ OSWALD , LANG DIETMAR , PETZ MARTIN , WEBER MICHAEL
Abstract: PROBLEM TO BE SOLVED: To provide a component, which can be produced by a known production method as easily as possible, composed of a little external contacts. SOLUTION: A contact pad 11 of at least one integrated circuit 1 is connected with a conductive projection 2 directly attached on a basic substrate.
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2.发明专利Manufacturing method for semiconductor constituent element having contact section on lower side 审中-公开下部接触部分的半导体器件元件的制造方法
公开(公告)号：JP2005252278A
公开(公告)日：2005-09-15
申请号：JP2005095685
申请日：2005-03-29
Applicant: Infineon Technologies Ag , インフィネオン テクノロジーズ アクチエンゲゼルシャフト
Inventor： HAINZ OSWALD , PAULUS STEFAN , LEHNER RUDOLF , AUBURGER ALBERT , LANG DIETMAN , PETZ MARTIN , WEBER MICHAEL
CPC classification number: H01L21/568 , H01L23/3107 , H01L23/482 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/50 , H01L2224/05599 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/49171 , H01L2224/73265 , H01L2224/85001 , H01L2224/85051 , H01L2224/854 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive packaging method having a simple production process for realizing short signal path and a compact structure. SOLUTION: The housing includes a primary principal plane and a secondary principal plane that counters the primary principal plane, with most of them surrounding at least one semiconductor chip. The semiconductor chip includes a first metallization on the first principal plane side. The second principal planar side of the semiconductor chip reaches the second principal plane of the semiconductor structure element. The first metallizing of the semiconductor chip is also surrounded by the housing through a conductive material and connected with the contact section that reaches the second principal plane. Furthermore, the semiconductor chip includes a secondary metallization to pass signals to the second principal plane side. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 解决的问题：提供一种廉价的包装方法，其具有用于实现短信号路径和紧凑结构的简单制造工艺。 解决方案：壳体包括主要主平面和与主要主平面对准的次要主平面，其大部分围绕至少一个半导体芯片。 半导体芯片包括在第一主平面侧上的第一金属化。 半导体芯片的第二主平面侧到达半导体结构元件的第二主平面。 半导体芯片的第一金属化也被壳体通过导电材料包围并与到达第二主平面的接触部分连接。 此外，半导体芯片包括用于将信号传递到第二主平面侧的二次金属化。 版权所有（C）2005，JPO＆NCIPI
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3.发明申请
公开(公告)号：WO0036498A3
公开(公告)日：2000-09-28
申请号：PCT/DE9903830
申请日：1999-12-01
Applicant: INFINEON TECHNOLOGIES AG , WEBER MICHAEL , STEGER JOHANN
Inventor： WEBER MICHAEL , STEGER JOHANN
CPC classification number: G06F9/4426 , G06F8/66
Abstract: The invention relates to a method for changing the flow of a program stored in a read-only memory. To this end, the program has a plurality of program routines and to any program routine a sub-program is assigned which is stored in a first read-write memory. Storage locations of a second read-write memory are assigned to each program routine. A program routine calls the sub-program irrespective of the content of the assigned storage locations, provided a sub-program is allocated to said program routine.
Abstract translation: 本发明涉及一种用于改变存储在只读存储器程序中的序列的方法。 为此目的，程序具有多个程序例程，并且每个程序例程是存储在第一随机存取存储器中的子例程。 每个程序例程还与第二读取/写入存储器的存储器位置相关联。 然后程序例程调用，如果这个程序例程被分配了一个子例程，则子例程取决于相关存储单元的内容。
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4.发明专利
公开(公告)号：DE102018003133A1
公开(公告)日：2019-10-17
申请号：DE102018003133
申请日：2018-04-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHINDLER MANFRED , WEBER MICHAEL
Abstract: Die vorliegende Beschreibung betrifft ein Sensormodul, sowie eine Sensorvorrichtung und ein Spritzgusswerkzeug, wobei Sensorvorrichtung und/oder Spritzgusswerkzeug eine Alignierungsstruktur aufweisen, um die Sensorvorrichtung während des Einlassens von Spritzgussmaterial in das Spritzgusswerkzeug in einer vorbestimmten Position zu halten.
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公开(公告)号：DE102018106560A1
公开(公告)日：2019-04-18
申请号：DE102018106560
申请日：2018-03-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor： STOICESCU EMANUEL , BÖHM MATTHIAS , WEIDENAUER JANIS , JAHN STEFAN , LANDGRAF ERHARD , WEBER MICHAEL
Abstract: Ein Drucksensorbauelement (2000) umfasst einen Halbleiter-Die (120) des Drucksensorbauelements (2000) und einen Bonddraht (110) des Drucksensorbauelements (2000). Eine maximale vertikale Distanz (2012) zwischen einem Teil des Bonddrahts (110) und dem Halbleiter-Die (120) ist größer als eine minimale vertikale Distanz (2014) zwischen dem Halbleiter-Die (120) und einer Oberfläche eines Gels, das den Halbleiter-Die (2010) bedeckt.
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Patent Agency Ranking
公开(公告)号：DE102013104103A1
公开(公告)日：2013-10-24
申请号：DE102013104103
申请日：2013-04-23
Applicant: INFINEON TECHNOLOGIES AG
Inventor： STEGERER FRANZ , ELIAN KLAUS , WEBER MICHAEL
IPC: H01F7/02
Abstract: Ein Vormagnetisierungs-Feldgenerator stellt ein Vormagnetisierungs-Magnetfeld für einen Magnetsensor bereit. Der Vormagnetisierungs-Feldgenerator enthält einen Körper mit einem magnetischen oder einem magnetisierbaren Material. In dem Körper ist eine Aussparung ausgebildet. Die Aussparung ist an ein Gehäuse des Magnetsensors angepasst.
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公开(公告)号：DE102004042941B3
公开(公告)日：2006-04-06
申请号：DE102004042941
申请日：2004-09-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THEUSS HORST , WEBER MICHAEL
Abstract: The invention relates to a high-frequency module (10) comprising filter structures (1) and a method for the production thereof. Said high-frequency module (10) that is provided with a filter structure (1) encompasses at least one module component (2) having a piezoelectric surface structure (4). A cavity resonator zone (5) which ensures that the piezoelectric elements of the surface structure can oscillate freely is spatially coupled to said piezoelectric surface structure. The cavity resonator zone (5) is placed between two module components (2, 3) that are stacked on top of each other, are electrically interconnected, and are connected to a higher-level circuit support (7).
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公开(公告)号：DE10256116B4
公开(公告)日：2005-12-22
申请号：DE10256116
申请日：2002-11-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THEUS HORST , WEBER MICHAEL , MECKES ANDREAS
Abstract: The method involves producing an active area (5) in the positions of semiconductor chips on an active top side (4) of the wafer, and applying contact surfaces (6) outside the active area. A sacrificial layer comprising insulating material is applied to the active area, leaving openings in the sacrificial layer at the edges of the active area. A conductive material is applied, the sacrificial layer removed, and a plastics layer applied before applying external contacts and separating the wafer into individual electronic devices. Independent claims are included for an electronic device; and a semiconductor wafer.
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公开(公告)号：DE102004025269A1
公开(公告)日：2005-09-15
申请号：DE102004025269
申请日：2004-05-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor： WEBER MICHAEL , DANGELMAIER JOCHEN , THEUSS HORST , HAGEN ROBERT
IPC: C12Q1/68
Abstract: A biochip cell (A) comprises a biochip substrate (1) and a cover (2), for reception and analysis of biological samples. A biochip cell (A) comprises: (a) a biochip substrate (1) having, on its upper surface, many spatially separated and uniformly distributed analytical islands (6) and at least one analytical region (7) for receiving the sample material; (b) at least one plastic frame (9), made of rubber-like material, that is arranged on the upper surface and defines a region (7) containing a limited number of (6); and (c) a cover (2), adhesive on one side and having an area that matches that of (1) or (7), to provide hermetic sealing of (7). An independent claim is also included for a method for preparing (A).
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公开(公告)号：DE10111206C2
公开(公告)日：2003-04-03
申请号：DE10111206
申请日：2001-03-08
Applicant: INFINEON TECHNOLOGIES AG
Inventor： YANG BIN , WEBER MICHAEL
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