公开(公告)号：FR2857952B1

公开(公告)日：2005-12-16

申请号：FR0309106

申请日：2003-07-25

Applicant: ST MICROELECTRONICS SA

Inventor： MONFRAY STEPHANE ,  ANCEY PASCAL ,  SKOTNICKI THOMAS ,  SEGUENI KARIM

IPC: B81B3/00 ,  H03H9/24 ,  H03H3/007

Abstract: The resonator has a monocrystalline silicon substrate provided with an active zone surrounded by a shallow trench isolation region (STI). A vibrating beam is anchored on the region by one of free ends (14, 16) and comprises a monocrystalline silicon median part (12). A control electrode (E) is placed above the beam and is supported on the active zone. The median part is separated from the active zone and the electrode. An independent claim is also included for a method of manufacturing an electromechanical resonator.

公开(公告)号：FR2863789A1

公开(公告)日：2005-06-17

申请号：FR0314567

申请日：2003-12-12

Applicant: ST MICROELECTRONICS SA

Inventor： BOUCHE GUILLAUME ,  CARUYER GREGORY ,  ANCEY PASCAL

IPC: H03H3/02 ,  H03H9/17 ,  H03H9/56 ,  H03H9/58 ,  H03H9/15 ,  H01L41/083

Abstract: An acoustic resonator device (1) comprises an active element (6) and a support. The support includes a membrane (5) and the active element provided with at least one piezoelectric layer (10) is surmounted by a multi-layer assembly (12) provided with at least three layers (13, 14, 15) of which at least one has a strong acoustic impedance and at least one a low acoustic impedance.

公开(公告)号：FR2848339A1

公开(公告)日：2004-06-11

申请号：FR0215370

申请日：2002-12-05

Applicant: ST MICROELECTRONICS SA

Inventor： BOUCHE GUILLAUME ,  ANCEY PASCAL ,  FROMENT BENOIT

IPC: B81B7/00 ,  H01S5/022 ,  H01L23/31 ,  B81C3/00

Abstract: The adhesion of a first element (1), of which at least a part of the surface is coated with silicon, on a second element (2), of which at least a part of the surface is coated with nickel, incorporates an adhesion stage effected by NiSi welding at greater than 250degreesC, the rugosity between the two parts of the surface of the two elements being less than 1 micron. An Independent claim is also included for an integrated circuit incorporating two elements joined by NiSi welding.

公开(公告)号：FR2848036A1

公开(公告)日：2004-06-04

申请号：FR0214967

申请日：2002-11-28

Applicant: ST MICROELECTRONICS SA

Inventor： BOUCHE GUILLAUME ,  CARUYER GREGORY ,  ANCEY PASCAL

IPC: H01L23/14 ,  H01L27/20 ,  H01L41/04 ,  H03H9/05 ,  H03H9/17 ,  H03H9/58

公开(公告)号：FR2929774A1

公开(公告)日：2009-10-09

申请号：FR0852316

申请日：2008-04-07

Applicant: ST MICROELECTRONICS SA ,  CENTRE NAT RECH SCIENT

Inventor： CARUYER GREGORY ,  SEGUENI KARIM ,  ANCEY PASCAL ,  DUBUS BERTRAND

IPC: H03H3/007 ,  H03H9/24

Abstract: L'invention concerne un dispositif de résonance micro électromécanique (MEMS) comprenant :un substrat,une électrode d'entrée (EE), reliée à une source de courant alternatif de fréquence d'entrée (fi),une électrode de sortie (ES),au moins une structure d'ancrage, liée au substrat, etune structure vibratile, reliée à une structure d'ancrage par au moins une jonction, possédant une fréquence propre (fp) de résonance acoustique, et dont la vibration sous l'effet de l'électrode d'entrée (EE) lorsqu'elle est alimentée génère sur l'électrode de sortie (ES) un courant alternatif dont la fréquence de sortie est égale à la fréquence propre (fp),caractérisé en ce que la structure vibratile et/ou la structure d'ancrage comprennent une structure périodique, ladite structure périodique comprenant au moins des première (M1) et deuxième (M2) zones différentes l'une de l'autre, correspondant respectivement à des première et deuxième propriétés de propagation acoustique.

公开(公告)号：FR2905208B1

公开(公告)日：2008-12-19

申请号：FR0653488

申请日：2006-08-28

Applicant: ST MICROELECTRONICS SA

Inventor： VOLATIER ALEXANDRE ,  ANCEY PASCAL ,  DUBUS BERTRAND

IPC: H03H9/58

公开(公告)号：DE602004015526D1

公开(公告)日：2008-09-18

申请号：DE602004015526

申请日：2004-04-01

Applicant: ST MICROELECTRONICS SA

Inventor： BOUCHE GUILLAUME ,  ANCEY PASCAL ,  CARUYER GREGORY

IPC: B81B3/00 ,  H01H61/06 ,  H03H3/00 ,  H03H3/02 ,  H03H3/10 ,  H03H9/00 ,  H03H9/02 ,  H03H9/17 ,  H03H9/46 ,  H03H9/54

Abstract: The tunable micro resonator (1) has a piezoelectric layer (3) sandwiched between two metallic electrodes (4,5). The resonator is mounted on a suspension beam which is formed as a bimetallic material which has controllable deformability. The beam can have heating inserts (22,23) and one or more inserted blocks (20,21) formed of a material with a different thermal expansion characteristic than the beam.

公开(公告)号：DE602006002007D1

公开(公告)日：2008-09-11

申请号：DE602006002007

申请日：2006-08-31

Applicant: ST MICROELECTRONICS SA

Inventor： BOUCHE GUILLAUME ,  CASSET FABRICE ,  ANCEY PASCAL

IPC: H01G5/16 ,  H01L21/822 ,  H01L27/04 ,  H05K3/00

公开(公告)号：DE60306196T2

公开(公告)日：2007-04-19

申请号：DE60306196

申请日：2003-11-27

Applicant: ST MICROELECTRONICS SA

Inventor： BOUCHE GUILLAUME ,  CARUYER GREGORY ,  ANCEY PASCAL

IPC: H03H9/05 ,  H01L23/14 ,  H01L27/20 ,  H01L41/04 ,  H03H9/17 ,  H03H9/58

公开(公告)号：FR2863789B1

公开(公告)日：2006-09-29

申请号：FR0314567

申请日：2003-12-12

Applicant: ST MICROELECTRONICS SA

Inventor： BOUCHE GUILLAUME ,  CARUYER GREGORY ,  ANCEY PASCAL

IPC: H03H9/15 ,  H01L41/083 ,  H03H3/02 ,  H03H9/17 ,  H03H9/56 ,  H03H9/58

Abstract: An acoustic resonator device (1) comprises an active element (6) and a support. The support includes a membrane (5) and the active element provided with at least one piezoelectric layer (10) is surmounted by a multi-layer assembly (12) provided with at least three layers (13, 14, 15) of which at least one has a strong acoustic impedance and at least one a low acoustic impedance.