Abstract:
PROBLEM TO BE SOLVED: To realize a single transistor memory cell having the characteristics of a conventional SRAM and a flash memory. SOLUTION: In the memory circuit including at least one memory cell made of a single transistor, an insulating layer is formed between the gate and the channel regions of the transistor so that the insulating layer is parallel with each of the surfaces of the regions; a continuum of potential wells which are arranged with certain distances separated from the gate and the channel region, is formed in the insulating layer. Since the potential wells can include charges, two memory states concerning the memory cell state, i.e. "0"state, and "1" state can be defined by moving the charges to a first entrapping region direction next to the source region, or a second entrapping region direction next to the drain region. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a transistor with a germanium-rich channel and fully-depleted type architecture that can be easily manufactured on an arbitrary substrate and that can easily control the formation of the channel. SOLUTION: The manufacturing method for a MOS transistor comprises (a) a step to form a half-conductive interlayer 6 containing alloy of silicon and germanium on a substrate 2, (b) step to manufacture the source region, drain region and insulating gate regions 11, 12 and 9 of the transistor on the interlayer 6, and (c) step to oxidize the interlayer 6 starting with the bottom surface of the interlayer 6 to raise the concentration of germanium within the channel of the transistor. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an integrated semiconductor memory device having hybrid performance. SOLUTION: The integrated semiconductor memory device is provided with an integrated memory structure CH2 provided with a semiconductor layer surrounded by an isolation layer, lying between the source region S and the drain region D of a transistor and inserted between the channel region of the transistor and its control gate. The semiconductor layer included two potential well zones Z1 and Z3 separated by a potential barrier zone Z2 lying beneath the control gate of the transistor. Write means Vg and Vds bias the memory structure so as to confine charge carriers selectively in one or other of the two potential well zones, and read means Vg and Vd bias the memory structure so as to detect, for example by measuring the drain current of the transistor, the presence of charge carriers in one or other of the potential wells.
Abstract:
The invention concerns a method which consists in forming on a substrate (1) coated with a dielectric material layer (3) provided with a window (3a), a stack of successive layers alternately of germanium or SiGe alloy (4, 6, 8) and polycrystalline silicon (5, 7, 9); selective partial elimination of the germanium or SiGe alloy layers, to form an tree-like structure; forming a thin layer of dielectric material (10) on the tree-like structure; and coating the tree-like structure with polycrystalline silicon (11). The invention is useful for making dynamic random-access memories.
Abstract:
The production of an electronic component consists of: (a) covering the surface (S) of a substrate (100) with a portion (P) delimiting with the substrate a volume (V) filled at least partially with a temporary material; (b) evacuating the temporary material from the volume by a shaft (C) extending between the volume and an access surface; (c) introducing an electrical conducting filling material (7) into the volume from some precursors fed via the shaft. Independent claims are also included for: (1) a field effect transistor with a gate produced by this method; (2) an electronic device incorporating such a transistor.
Abstract:
An electronic device, such as an opto-electronic device and an integrated semiconductor memory device, includes at least one integrated memory point structure including a quantum well semiconductor area buried in the substrate of the structure and disposed under the insulated gate of a transistor. A biasing voltage source is adapted to bias the structure to enable charging or discharging of charges in the quantum well or outside the quantum well.
Abstract:
Production of a vertical transistor having an insulated gate with four-channel conduction comprises forming a vertical semiconductor column on a semiconductor substrate, and forming a dielectrically insulated semiconductor gate on the sides of the column and on the upper surface of the substrate. Formation of the column (PIL) comprises forming a first semiconductor column on the substrate, and forming a cavity in the primary column. Formation of the insulated gate comprises coating the internal walls of the cavity with a dielectric insulating material and filling the insulated cavity with gate material (14), so as to form, between the part of the insulated gate located in the cavity and the part of the insulated grid located on the sides of the column, two semiconductor connection regions (PL1, PL2) extending between the source and the drain of the transistor. An Independent claim is given for an integrated circuit comprising the vertical transistor.
Abstract:
A method for making a MOS transistor includes forming a first gate within a silicon-on-insulator substrate, forming a semiconductor channel region transversely surmounting the first gate, and forming semiconductor drain and source regions on each side of the channel region. The semiconductor channel region and drain and source regions may be produced by epitaxy on an upper surface of the first gate. The channel region may be isolated from the upper surface of the first gate by forming a tunnel under the channel region and at least partially filling the tunnel with a first dielectric. The second gate is formed on the channel region and transverse to the channel region. The second gate may be separated from an upper surface of the channel region by a second dielectric.
Abstract:
The invention concerns a magnetic sensor comprising a thin deformable membrane (3) made of conductive material forming a first armature of a capacitor and traversed by an electric current, a second armature of a capacitor consisting of a doped zone of a semiconductor substrate (1), and a gaseous dielectric layer (6) separating the two armatures. The membrane is deformed under the effect of the Lorentz force generated by a magnetic field located in the plane of the membrane and perpendicular to the current lines. The invention also concerns a method for making said magnetic sensor and a device for measuring magnetic field.