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    Method for Producing a Micromechanical Component, and Corresponding Micromechanical Component
    46.
    发明申请
    Method for Producing a Micromechanical Component, and Corresponding Micromechanical Component 有权
    微机械部件的生产方法和相应的微机械部件

    公开(公告)号：US20160023895A1

    公开(公告)日：2016-01-28

    申请号：US14774799

    申请日：2014-03-12

    Applicant: ROBERT BOSCH GMBH

    Inventor： Friedjof Heuck ,  Christoph Schelling

    IPC: B81C1/00

    CPC classification number: B81C1/00619 ,  B81C1/00412 ,  B81C2201/0177 ,  B81C2201/0188

    Abstract: A method for producing a micromechanical component includes providing a substrate with a monocrystalline starting layer which is exposed in structured regions. The structured regions have an upper face and lateral flanks, wherein a catalyst layer, which is suitable for promoting a silicon epitaxial growth of the exposed upper face of the structured monocrystalline starting layer, is provided on the upper face, and no catalyst layers are provided on the flanks. The method also includes carrying out a selective epitaxial growth process on the upper face of the monocrystalline starting layer using the catalyst layer in a reactive gas atmosphere in order to form a micromechanical functional layer.

    Abstract translation: 微机械部件的制造方法包括向基板提供暴露在结构化区域中的单晶起始层。 结构化区域具有上表面和侧面，其中在上表面上设置适合于促进结构单晶起始层暴露的上表面的硅外延生长的催化剂层，并且不提供催化剂层 在侧面。 该方法还包括在反应气体气氛中使用催化剂层在单晶起始层的上表面上进行选择性外延生长工艺，以形成微机械功能层。

    METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE
    47.
    发明申请
    METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE 有权
    在表面形成沉积图案的方法

    公开(公告)号：US20150162479A1

    公开(公告)日：2015-06-11

    申请号：US14100048

    申请日：2013-12-09

    Applicant: Raytheon Company

    Inventor： Roland Gooch ,  Thomas Allan Kocian ,  Buu Diep ,  Adam M. Kennedy ,  Stephen H. Black

    IPC: H01L31/18 ,  H01L31/0232

    CPC classification number: H01L31/18 ,  B81C1/00373 ,  B81C2201/0188 ,  H01L31/02327

    Abstract: A method for forming a coating of material on selected portions of a surface of a substrate having a plurality of cavities, each cavity having outer, peripheral sidewalls extending outwardly from the surface. The method includes: providing a structure having a release agent thereon; contacting top surface of the wafer with the release agent to transfer portions of the release agent to the top surface of the wafer while bottom portions of the cavities remain spaced from the release agent to produce an intermediate structure; the release agent disposed on the top surface of the wafer and with the bottom portions of the cavities void of the release agent; exposing the intermediate structure to the material to blanket coat the material on both the release agent and the bottom portions of the cavities; and selectively removing the release agent together with the coating material while leaving the coating material on the bottom portions of the cavities.

    Abstract translation: 一种用于在具有多个空腔的基板的表面的选定部分上形成材料涂层的方法，每个空腔具有从表面向外延伸的外部周边侧壁。 该方法包括：提供其上具有脱模剂的结构; 使所述晶片的顶表面与所述脱模剂接触以将所述脱模剂的部分转移到所述晶片的顶表面，同时所述空腔的底部保持与所述脱模剂间隔开以产生中间结构; 所述脱模剂设置在所述晶片的顶表面上，并且所述空腔的底部部分脱离所述脱模剂; 将所述中间结构暴露于所述材料以在所述空腔的所述脱模剂和所述底部两者上均匀地涂覆所述材料; 并且与涂料一起选择性地除去脱模剂，同时将涂料留在空腔的底部。

    Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
    50.
    发明授权
    Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures 有权
    具有电介质或活性碱的电化学制造结构以及用于制造这种结构的方法和装置

    公开(公告)号：US07250101B2

    公开(公告)日：2007-07-31

    申请号：US10434493

    申请日：2003-05-07

    Applicant: Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    Inventor： Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: C25D1/00 ,  C25D5/02 ,  C25D5/48 ,  C25D5/52

    CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B33Y70/00 ,  B81C2201/0181 ,  B81C2201/0188 ,  B81C2201/019

    Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

    Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构是从底层到顶层形成的，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而在结构的一部分附近凝固的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

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