公开(公告)号：US09107308B2

公开(公告)日：2015-08-11

申请号：US14380981

申请日：2013-02-26

Applicant: Nan Jiang ,  Zvi Yaniv

Inventor： Nan Jiang ,  Zvi Yaniv

IPC: H05K1/03 ,  H05K1/05 ,  C04B41/90 ,  C04B41/00 ,  C04B41/52 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H01L23/373 ,  H05K1/18 ,  C04B111/00

CPC classification number: H05K1/053 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01L23/373 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/181 ,  H05K3/12 ,  H05K2201/0104 ,  H05K2201/0137 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/10106 ,  H01L2924/00 ,  C04B35/522 ,  C04B41/4539 ,  C04B41/5001 ,  C04B41/5031 ,  C04B41/5089 ,  C04B41/5059 ,  C04B41/5092 ,  C04B41/522 ,  C04B41/5063 ,  C04B41/5064 ,  C04B41/4535 ,  C04B41/4572 ,  C04B41/5127

Abstract: Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder.

Abstract translation: 不同种类的印刷浆料或油墨被用于各种组合以在石墨基材上形成多个陶瓷电介质层，以便产生有效的介电陶瓷层，其与石墨基材和印刷的铜迹线具有良好的粘合性，并具有很强的绝缘性能。 糊剂或油墨可以包含高导热性粉末。

公开(公告)号：US20180265699A1

公开(公告)日：2018-09-20

申请号：US15871141

申请日：2018-01-15

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  MAO-FENG HSU ,  MING-JAAN HO

IPC: C08L79/08 ,  C08L51/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03

CPC classification number: C08L79/08 ,  C08J3/246 ,  C08J5/18 ,  C08J2351/00 ,  C08J2351/04 ,  C08J2351/06 ,  C08J2351/08 ,  C08J2379/08 ,  C08J2447/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08L51/003 ,  C08L51/006 ,  C08L51/08 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2312/00 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0104 ,  H05K2201/0154 ,  C08L71/12 ,  C08L51/04

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

公开(公告)号：US09867288B2

公开(公告)日：2018-01-09

申请号：US14386637

申请日：2013-03-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Seol Hee Lim

IPC: H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/24 ,  C25D3/14 ,  C25D3/16 ,  C25D5/02 ,  C25D5/12

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

公开(公告)号：US20170367192A1

公开(公告)日：2017-12-21

申请号：US15612357

申请日：2017-06-02

Applicant: Nanoshield Technology Co. Ltd.

Inventor： James Cheng LEE

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/284 ,  H05K1/185 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0257 ,  H05K2203/1333

Abstract: A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

公开(公告)号：US09826623B2

公开(公告)日：2017-11-21

申请号：US14893255

申请日：2013-12-12

Applicant: KANEKA CORPORATION

Inventor： Aki Koukami ,  Kazuo Hagiwara ,  Keisuke Oguma ,  Kazuhide Fujimoto

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/29 ,  H01L23/373 ,  H05K3/28 ,  H05K1/18 ,  H01L23/31

CPC classification number: H05K1/0209 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/06 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

公开(公告)号：US20170208682A1

公开(公告)日：2017-07-20

申请号：US15394831

申请日：2016-12-30

Applicant: Industrial Technology Research Institute

Inventor： Chao-Jen Wang ,  Jia-Chong Ho

IPC: H05K1/02 ,  H05K13/08 ,  H05K3/22 ,  H05K3/28

CPC classification number: H05K1/0281 ,  B29C37/0082 ,  B29C73/02 ,  B29K2995/0092 ,  H05K1/0269 ,  H05K3/22 ,  H05K3/28 ,  H05K13/08 ,  H05K2201/0104 ,  H05K2203/16

Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.

公开(公告)号：US20170021604A1

公开(公告)日：2017-01-26

申请号：US15285445

申请日：2016-10-04

Applicant: IMEC ,  St. Petersburg Electrotechnical University

Inventor： Victor Luchinin ,  Svetlana Goloudina ,  Vyacheslav Pasyuta ,  Alexey Ivanov ,  Mikhail Baklanov ,  Mikhail Krishtab

IPC: B32B37/15 ,  B05D1/20 ,  B32B27/28

CPC classification number: C08J5/18 ,  B05D1/20 ,  B05D1/204 ,  B05D1/208 ,  B05D2505/50 ,  B32B18/00 ,  B32B27/04 ,  B32B27/281 ,  B32B37/15 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2305/07 ,  B32B2307/00 ,  B32B2307/204 ,  B32B2379/08 ,  B32B2457/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08G73/1067 ,  C08J2379/08 ,  C08J2483/02 ,  C09D179/08 ,  H01L21/02285 ,  H01L21/02318 ,  H01L23/5329 ,  H05K1/03 ,  H05K3/143 ,  H05K2201/01 ,  H05K2201/0104 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10T428/249979 ,  Y10T428/249991 ,  C08K5/175

Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

Abstract translation: 用于孔密封多孔基材的方法，包括：在液体表面上形成聚酰亚胺前体的连续单层，使用Langmuir-Blodgett技术将所述聚酰亚胺前体单层转移到多孔基材上，并将转移的聚酰亚胺前体单层酰亚胺化，从而形成 多孔基材上的聚酰亚胺密封层。 具有至少一个表面的多孔基材，其上设有密封层以密封基材的孔，其中密封层是具有几个单层厚度的聚酰亚胺，并且其中聚酰亚胺不渗透到孔中。

公开(公告)号：US20150287707A1

公开(公告)日：2015-10-08

申请号：US14679306

申请日：2015-04-06

Applicant: Japan Display Inc.

Inventor： Tsuneyuki ASAKA

IPC: H01L25/18 ,  H01L23/538 ,  H01L27/12

CPC classification number: H01L25/18 ,  G02F1/1345 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3248 ,  H01L27/3253 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0104 ,  H05K2201/0326 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display device includes a substrate on which a plurality of pixels are arranged and a circuit for displaying images with respect to each pixel is formed, a substrate terminal as a terminal formed on the substrate, and an electronic component terminal as a terminal of an electronic component electrically connected to the terminal via an anisotropic conductive film. A conductive region that conducts to the anisotropic conductive film in the substrate terminal has a light transmissive part in which a material having light transmissivity penetrates the substrate surface in a perpendicular direction.

Abstract translation: 一种显示装置，其特征在于，具备：配置有多个像素的基板，形成相对于各像素显示图像的电路，形成在所述基板上的作为端子的基板端子和作为电子端子的电子部件端子 部件通过各向异性导电膜电连接到端子。 在基板端子中向各向异性导电膜导通的导电区域具有透光性部分，其中具有透光性的材料在垂直方向上穿透基板表面。

公开(公告)号：US20150016049A1

公开(公告)日：2015-01-15

申请号：US14386637

申请日：2013-03-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Seol Hee Lim

IPC: H05K1/05

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

Abstract translation: 用于存储卡的印刷电路板包括绝缘层; 绝缘层的第一表面上的安装部分，所述安装部分电连接到存储装置; 以及在所述绝缘层的第二表面上的端子部分，所述端子部分电连接到外部电子设备，其中在所述安装部分和所述端子部分的暴露表面上形成具有相同特性的相同金属层。

公开(公告)号：US20130251978A1

公开(公告)日：2013-09-26

申请号：US13847457

申请日：2013-03-19

Applicant: IMEC ,  ST. PETERSBURG ELECTROTECHNICAL UNIVERSITY

Inventor： Victor Luchinin ,  Svetlana Goloudina ,  Vyacheslav Pasyuta ,  Alexey Ivanov ,  Mikhail Baklanov ,  Mikhail Krishtab

IPC: B32B37/15

CPC classification number: B32B37/15 ,  B05D1/20 ,  B05D1/208 ,  B32B18/00 ,  B32B27/04 ,  B32B27/281 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2305/07 ,  B32B2307/00 ,  B32B2307/204 ,  B32B2379/08 ,  B32B2457/00 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/02285 ,  H01L21/02318 ,  H05K1/03 ,  H05K3/143 ,  H05K2201/01 ,  H05K2201/0104 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10T428/249979 ,  Y10T428/249991 ,  C08K5/175

Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

Abstract translation: 用于孔密封多孔基材的方法，包括：在液体表面上形成聚酰亚胺前体的连续单层，使用Langmuir-Blodgett技术将所述聚酰亚胺前体单层转移到多孔基材上，并将转移的聚酰亚胺前体单层酰亚胺化，从而形成 多孔基材上的聚酰亚胺密封层。 具有至少一个表面的多孔基材，其上设有密封层以密封基材的孔，其中密封层是具有几个单层厚度的聚酰亚胺，并且其中聚酰亚胺不渗透到孔中。