公开(公告)号：WO0102468A9

公开(公告)日：2002-07-25

申请号：PCT/US0018038

申请日：2000-07-01

Applicant: HOLL TECHNOLOGIES COMPANY ,  HOLL RICHARD A

Inventor： HOLL RICHARD A

IPC: C08J3/20 ,  B01F13/10 ,  B22F3/20 ,  B22F3/22 ,  B29B7/40 ,  B29B7/90 ,  B29C47/00 ,  B29C47/50 ,  B29C67/24 ,  B29C70/58 ,  C08J5/00 ,  C08K3/00 ,  C08K7/24 ,  C08L71/12 ,  C22C32/00 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K3/02 ,  C08K3/08 ,  C08K3/22 ,  C08K5/00 ,  C08K7/22 ,  C08K9/10 ,  H01B3/30

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressively weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particles size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐变弱，因此必须限制这些内容。 在获得尽可能完整的组分分散体的方法中，它们单独分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每种混合物被研磨以获得所需的颗粒尺寸，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

公开(公告)号：EP3138873A1

公开(公告)日：2017-03-08

申请号：EP15785251.8

申请日：2015-04-16

Applicant: LG Innotek Co., Ltd.

Inventor： GU, Jina ,  GIL, Gun Young ,  PARK, Jae Man ,  YUN, Sung Jin

IPC: C08K3/38 ,  C08L63/00 ,  C08K9/02 ,  C08K3/22

CPC classification number: C08K9/02 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/382 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227

Abstract: An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.

Abstract translation: 根据本发明的一个实施方案的环氧树脂组合物包含环氧树脂，固化剂和无机填料，无机填料包括其上形成有金属氧化物膜的氮化硼。

公开(公告)号：EP2784808B8

公开(公告)日：2016-08-24

申请号：EP12851940.2

申请日：2012-10-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MINAMIO, Masanori ,  IKEUCHI, Hiroki

IPC: H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K3/46 ,  H01L23/498 ,  H01L23/427 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K3/28 ,  H01L23/00 ,  H05K1/18

CPC classification number: H05K1/0306 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/4275 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0224 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/186 ,  H05K3/284 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0227 ,  H05K2201/0376 ,  H05K2201/0723 ,  H05K2201/1056 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

公开(公告)号：EP2860219A4

公开(公告)日：2015-12-09

申请号：EP13804513

申请日：2013-06-06

Applicant: MITSUBISHI GAS CHEMICAL CO

Inventor： KOBAYASHI HIROAKI ,  SOGAME MASANOBU ,  NOMIZU KENTARO ,  MABUCHI YOSHINORI ,  KATO YOSHIHIRO

IPC: C08L63/00 ,  B32B5/02 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  C08G59/40 ,  C08J5/24 ,  C08K3/14 ,  C08K9/02 ,  H05K1/03 ,  H05K1/05

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/5825 ,  B32B2307/726 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/04 ,  C08K3/14 ,  C08K9/02 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/24893 ,  Y10T442/2721 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L79/04

Abstract: A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin (A), a cyanate ester compound (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises at least a surface-treated silicon carbide (C-1) of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

公开(公告)号：EP2554561A1

公开(公告)日：2013-02-06

申请号：EP11759389.7

申请日：2011-03-22

Applicant: Panasonic Corporation

Inventor： IWAMI Tomoaki ,  MATSUMOTO Masaaki ,  ABE Tomoyuki ,  YONEMOTO Tatsuo ,  FUJIWARA Hiroaki

IPC: C08G59/40 ,  C08J5/24 ,  C08K3/22 ,  C08K3/24 ,  C08L63/00 ,  H05K1/03 ,  H05K3/46

CPC classification number: C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Abstract translation: 本发明要解决的问题是提供一种预浸料用环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物是通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚性优异，孔位精度优异 在燃烧时不产生有害物质，使用使用了预浸料的环氧树脂组合物的预浸料，以及使用该预浸料的多层印刷电路板。

公开(公告)号：KR1020150125330A

公开(公告)日：2015-11-09

申请号：KR1020140052527

申请日：2014-04-30

Applicant: 엘지이노텍 주식회사

Inventor： 구진아 ,  길건영 ,  박재만 ,  윤성진

IPC: C08L63/00 ,  C08K3/38 ,  C08K9/02 ,  C08K3/22 ,  C08G59/00 ,  H05K1/03

CPC classification number: C08K9/02 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/382 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227

Abstract: 본발명의한 실시예에따른에폭시수지조성물은결정성에폭시화합물을포함하는에폭시수지 3 내지 60wt%, 경화제 0.1 내지 5wt%, 금속산화막이형성된질화붕소를포함하는무기충전재 35 내지 96.9wt%를포함한다.

Abstract translation: 根据本发明实施方案的环氧树脂组合物包含3-60重量％的包含结晶环氧化合物的环氧树脂，0.1-5重量％的固化剂和35.0-96.9重量％的包含硼的无机填料 具有金属氧化物膜的氮化物。

公开(公告)号：JP6423418B2

公开(公告)日：2018-11-14

申请号：JP2016512243

申请日：2014-05-05

Applicant: メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング ,  Merck Patent Gesellschaft mit beschraenkter Haftung

Inventor： ニース、 ヘルゲ ベティーナ ,  クイットマン、 ウルリッヒ ,  ピーニク、 オリバー ロベルト ,  ローゼンバーガー、 シルヴィア

IPC: C08K9/02 ,  C08L101/00 ,  C09C1/62 ,  C09D201/00 ,  C09D7/40 ,  C08K3/22

CPC classification number: H05K1/0373 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2241 ,  H05K1/0284 ,  H05K3/105 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/09118 ,  C08L101/00

公开(公告)号：JP2016520139A

公开(公告)日：2016-07-11

申请号：JP2016512243

申请日：2014-05-05

Applicant: メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung ,  メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung

Inventor： ヘルゲ ベティーナ ニース、 ,  ヘルゲ ベティーナ ニース、 ,  ウルリッヒ クイットマン、 ,  ウルリッヒ クイットマン、 ,  オリバー ロベルト ピーニク、 ,  オリバー ロベルト ピーニク、 ,  シルヴィア ローゼンバーガー、 ,  シルヴィア ローゼンバーガー、

IPC: C08K3/22 ,  C08K9/02 ,  C08L101/00 ,  C09C1/62 ,  C09D7/12 ,  C09D201/00

CPC classification number: H05K1/0373 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2241 ,  H05K1/0284 ,  H05K3/105 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/09118 ,  C08L101/00

Abstract: 本発明は、LDSプラスチック用LDS活性添加剤に関し、このタイプの添加剤を含むポリマー組成物に関し、メタライズ導体トラックを有する物品であって物品のポリマー基体もしくは基体上のポリマーコーティングが前記タイプのLDS添加剤を含む物品に関する。

Abstract translation: 本发明涉及到LDS活性添加剂LDS塑料，涉及包含添加剂的类型的聚合物组合物，该制品是由聚合物基材或具有金属化的导体轨迹的文章LDS添加型的衬底上的聚合物涂层 剂在制品包括：a。

公开(公告)号：US20180168036A1

公开(公告)日：2018-06-14

申请号：US15878398

申请日：2018-01-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. BAHL ,  Konstantine KARAVAKIS

IPC: H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/42 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US09832870B2

公开(公告)日：2017-11-28

申请号：US14407190

申请日：2013-06-06

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Hiroaki Kobayashi ,  Masanobu Sogame ,  Kentaro Nomizu ,  Yoshinori Mabuchi ,  Yoshihiro Kato

IPC: B32B3/10 ,  H05K1/03 ,  C08J5/24 ,  C08L63/00 ,  C08G59/40 ,  B32B15/14 ,  B32B15/20 ,  C08K9/02 ,  B32B5/02 ,  H05K1/05 ,  C08K3/14

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/5825 ,  B32B2307/726 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/04 ,  C08K3/14 ,  C08K9/02 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/24893 ,  Y10T442/2721 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L79/04

Abstract: A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.