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41.发明公开DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 审中-公开根据上述制造嵌入的表面添加剂和加工设备零部件
公开(公告)号：EP2601688A4
公开(公告)日：2017-03-29
申请号：EP11816885
申请日：2011-08-08
Applicant: TPK HOLDING CO LTD
IPC: H01L31/048 , H01L31/05 , H01L31/055
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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42.发明公开
公开(公告)号：EP3005847A4
公开(公告)日：2017-03-01
申请号：EP14801666
申请日：2014-04-11
Applicant: NOKIA TECHNOLOGIES OY
Inventor： ALLEN MARK LEE , BOWER CHRIS , COTTON DARRYL
IPC: H05K3/10
CPC classification number: H05K1/0272 , H01L23/52 , H01L24/00 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2224/24101 , H01L2224/24226 , H01L2224/24997 , H01L2224/25171 , H01L2224/25175 , H01L2224/2919 , H01L2224/82101 , H01L2224/82138 , H01L2224/8284 , H01L2224/82862 , H01L2224/82874 , H01L2224/82877 , H01L2224/82986 , H01L2224/8385 , H01L2224/92144 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H05K1/092 , H05K1/097 , H05K3/101 , H05K3/107 , H05K2201/0257 , H05K2201/0302 , H05K2201/09036 , H05K2201/09227 , H05K2201/10674 , H05K2203/1469 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
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43.发明申请公开(公告)号：US20190059153A1
公开(公告)日：2019-02-21
申请号：US15826692
申请日：2017-11-30
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Chin-Kuan Liu , Chao-Lung Wang , Shuo-Hsun Chang , Yu-Te Lu , Chin-Hsi Chang
CPC classification number: H05K1/0268 , H05K1/09 , H05K3/064 , H05K3/4644 , H05K3/4661 , H05K3/467 , H05K2201/0302 , H05K2203/072 , H05K2203/0723
Abstract: A multi-layer circuit board capable of being applied with electrical testing includes a patterned metal-interface layer, a metallic delivery loading plate, an electrical connection layer, a conductive corrosion-barrier layer, a bottom dielectric layer, and a multi-layer circuit structure. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. The delivery loading plate and the patterned metal-interface layer expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally. Hence, costs for figuring out reasons of the unqualified electronic component can be reduced, and responsibilities for the unqualified electrical testing result of the electronic component can be clarified.
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公开(公告)号：US09736947B1
公开(公告)日：2017-08-15
申请号：US14572636
申请日：2014-12-16
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis , Michael James Glickman
CPC classification number: H05K3/42 , G01M5/0041 , G01M5/0083 , G06F1/16 , G08B21/182 , G08B23/00 , H05K1/0201 , H05K1/115 , H05K2201/0302 , H05K2203/0338 , H05K2203/0723
Abstract: A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.
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公开(公告)号：US09713254B2
公开(公告)日：2017-07-18
申请号：US14873567
申请日：2015-10-02
Applicant: TPK HOLDING CO., LTD.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
IPC: H01L33/00 , H01L31/00 , H01B1/06 , H01M4/02 , H05K1/09 , H01L31/048 , H01L31/055 , H01L31/0216 , H05K1/02 , H05K1/11 , H05K1/03 , H01L31/05
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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Patent Agency Ranking
46.发明申请DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 有权具有表面嵌入式添加剂的器件组件及相关制造方法公开(公告)号：US20160029482A1
公开(公告)日：2016-01-28
申请号：US14873567
申请日：2015-10-02
Applicant: INNOVA DYNAMICS, INC.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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47.发明授权Device components with surface-embedded additives and related manufacturing methods 有权具有表面嵌入添加剂的器件组件及相关制造方法公开(公告)号：US09185798B2
公开(公告)日：2015-11-10
申请号：US14299938
申请日：2014-06-09
Applicant: INNOVA DYNAMICS, INC.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
IPC: H01L31/00 , H01L31/048 , H01L31/0216 , H05K1/02 , H01L31/055 , H05K1/09 , H05K1/11
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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48.发明申请BASE MATERIAL FOR FORMING CONDUCTIVE PATTERN AND CONDUCTIVE PATTERN FORMED USING SAME 审中-公开用于形成导电图案的基材和使用其形成的导电图案公开(公告)号：US20150129290A1
公开(公告)日：2015-05-14
申请号：US14383812
申请日：2013-04-22
Applicant: LG CHEM, LTD.
Inventor： Jiehyun Seong , Seung Heon Lee , Young Chang Byun , Jung Hyun Seo , Jooyeon Kim , In-Seok Hwang , Yong Goo Son , Beom Mo Koo
CPC classification number: H05K1/092 , C09J7/10 , C09J2201/28 , C09J2201/602 , C09J2203/326 , G06F3/044 , G06F2203/04103 , H05K1/09 , H05K3/046 , H05K3/105 , H05K2201/0302 , H05K2201/0326 , H05K2203/0522 , Y10T156/10
Abstract: The present invention relates to an adhesive substrate for forming a conductive pattern, which includes an adhesive substrate, and a precursor pattern of a conductive pattern, or a conductive pattern, provided on one side of the adhesive substrate, a method for preparing a conductive pattern using the adhesive substrate, a conductive pattern prepared using the adhesive substrate, and an electronic device including the conductive pattern.
Abstract translation: 本发明涉及一种用于形成导电图案的粘合剂基底，其包括粘合剂基底和设置在粘合剂基底的一侧上的导电图案或导电图案的前体图案，制备导电图案的方法 使用粘合剂基材，使用粘合剂基材制备的导电图案和包括导电图案的电子装置。
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49.发明申请Transparent conductive electrodes comprising surface functionalized metal nanowires, their structure design, and method of making such structures 有权包括表面官能化金属纳米线的透明导电电极，其结构设计和制造这种结构的方法公开(公告)号：US20150008016A1
公开(公告)日：2015-01-08
申请号：US14360904
申请日：2014-04-03
Applicant: Nuovo Film, Inc.
Inventor： Hakfei Poon
CPC classification number: H01B13/30 , G06F3/041 , G06F2203/04103 , G06F2203/04112 , H01B1/02 , H01B1/22 , H01L31/022466 , H01L31/1884 , H05K1/0274 , H05K1/0298 , H05K1/03 , H05K1/09 , H05K2201/0302 , H05K2201/032
Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region comprising a network of silver nanowires and means for protecting the nanowire from surface oxidation; and a second region, comprising a plurality of metal nanowires and means for protecting nanowire from surface oxidation, and metal oxide nanowires.
Abstract translation: 本发明公开了一种图案化的透明导电电极，其包含衬底和在衬底顶部上的基本单个导电层。 单个导电层包括包含银纳米线网络的第一区域和用于保护纳米线免受表面氧化的装置; 以及包括多个金属纳米线的第二区域和用于保护纳米线免受表面氧化的装置和金属氧化物纳米线。
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公开(公告)号：US20180027649A1
公开(公告)日：2018-01-25
申请号：US15718507
申请日：2017-09-28
Applicant: TAI-SAW Technology Co., Ltd.
Inventor： Yu-Tung Huang , Ming-Hung Chang , Szu-Heng Liu , You-Jen Cho
IPC: H05K1/02 , G01N33/487 , G01N31/00 , H05K3/10 , G01N33/18
CPC classification number: H05K1/0272 , G01N31/00 , G01N33/18 , G01N33/48707 , H01L23/15 , H01L23/49811 , H01L23/49827 , H01L24/13 , H01L24/81 , H01L2224/1319 , H01L2224/16237 , H01L2224/81192 , H01L2224/81385 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H05K1/111 , H05K3/10 , H05K3/305 , H05K2201/0302 , H05K2201/0373 , H05K2201/09781 , Y02P70/613 , Y10T156/10 , H01L2924/00014
Abstract: A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.
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