公开(公告)号：CN106102313A

公开(公告)日：2016-11-09

申请号：CN201610503840.9

申请日：2016-06-28

Applicant: 广东欧珀移动通信有限公司

Inventor： 但唯

IPC: H05K1/11 ,  H05K9/00

CPC classification number: H05K1/11 ,  H05K9/00 ,  H05K1/117 ,  H05K9/0024 ,  H05K2201/09372 ,  H05K2201/10371

Abstract: 本发明公开了一种PCB板和具有其的移动终端，PCB板包括：板体和屏蔽罩，板体具有第一表面和环绕在第一表面外周的侧壁，侧壁上设有多个间隔开的侧边焊盘；屏蔽罩罩设在第一表面上且与侧边焊盘焊接。根据本发明的PCB板，通过将用于焊接屏蔽罩的焊盘设在PCB板的侧壁上，节省了传统的焊盘在PCB的上表面的占用空间，从而可以使得PCB板的布局更加紧凑，使得PCB板的布局更加合理，有效地减小了PCB板的面积。

公开(公告)号：CN105873423A

公开(公告)日：2016-08-17

申请号：CN201610355196.5

申请日：2016-05-25

Applicant: 努比亚技术有限公司

Inventor： 刘文武

IPC: H05K9/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K9/0032 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09372 ,  H05K2201/10371 ,  H05K2203/04

Abstract: 本发明公开了一种屏蔽组件，该屏蔽组件包括屏蔽框及侧面焊盘，其中，该屏蔽框指定位置的焊接引脚为加长型焊接引脚，侧面焊盘设置在PCB的侧面，且对应加长型焊接引脚在PCB侧面的焊接位置进行设置，使得侧面焊盘能够与对应的加长型焊接引脚的内侧焊接在一起，以实现屏蔽框与PCB的焊接。本发明还公开了一种该屏蔽组件的焊接工艺，通过将屏蔽框的加长型焊接引脚与侧面焊盘焊接，能够避免焊盘及屏蔽框对PCB的布局空间的占用，便于在PCB进行电子器件的布局。

公开(公告)号：CN105828522A

公开(公告)日：2016-08-03

申请号：CN201610301849.1

申请日：2016-05-06

Applicant: 鹤山市中富兴业电路有限公司

Inventor： 张志龙

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/24

CPC classification number: H05K1/11 ,  H05K3/244 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/09372 ,  H05K2203/0723

Abstract: 本发明公开了一种镀铂电路板及其制作工艺，一种镀铂电路板，所述电路板上设有镀铂焊盘，所述镀铂焊盘包括由下至上依次设置的铜层、镍层、铂层或者由下至上依次设置的铜层、镍层、金层、铂层。本发明的镀铂电路板，主要作为测试电路板用于为血气分析仪中，使用时，电路板上的镀铂焊盘裸露于测试液路中，当液体经测试液路流经焊盘时，液体在焊盘上发生反应，而铂能起到催化剂的作用，加快反应进行，解决了现有技术中由于反应缓慢导致个别元素无法检测到的问题，使血气分析仪能同时检测更多的项目，提升了血气分析仪性能。

公开(公告)号：CN105818542A

公开(公告)日：2016-08-03

申请号：CN201610328667.3

申请日：2012-04-30

Applicant: 惠普发展公司 ,  有限责任合伙企业

Inventor： I.坎贝尔-布朗 ,  M.沃尔什 ,  J.奥利弗 ,  J.P.沃德 ,  A.施普曼

IPC: B41J2/175 ,  H05K1/11 ,  H05K1/18 ,  H05K7/02

CPC classification number: B41J2/17503 ,  H05K1/118 ,  H05K1/189 ,  H05K7/02 ,  H05K2201/05 ,  H05K2201/09372

Abstract: 描述了涉及液体墨盒的柔性基板的示例电路和方法，包括连接至柔性基板的集成电路，和被布置在柔性基板上以用于连接至集成电路的电连接器焊盘。

公开(公告)号：EP3386375A1

公开(公告)日：2018-10-17

申请号：EP16813045.8

申请日：2016-11-21

Applicant: The Charles Stark Draper Laboratory, Inc.

Inventor： KARPMAN, Maurice S. ,  MEULLER, Andrew

IPC: A61B5/00 ,  A61B5/04

CPC classification number: A61N1/0502 ,  A61B5/04001 ,  A61B5/685 ,  A61B2562/043 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/36139 ,  H05K1/028 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/40 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/05 ,  H05K2201/09372 ,  H05K2203/107

Abstract: The present disclosure describes a closely spaced array of penetrating electrodes. In some implementations, the electrodes of the array are spaced less than 50 μm apart. The present disclosure also describes methods for manufacturing the closely spaced array of penetrating electrodes. In some implementations, each row of electrode of the array is manufactured in-plane and then coupled to other rows of electrodes to form an array.

公开(公告)号：WO2017099986A1

公开(公告)日：2017-06-15

申请号：PCT/US2016/063102

申请日：2016-11-21

Applicant: THE CHARLES STARK DRAPER LABORATORY, INC.

Inventor： KARPMAN, Maurice S. ,  MEULLER, Andrew

IPC: A61B5/00 ,  A61B5/04

CPC classification number: A61N1/0502 ,  A61B5/04001 ,  A61B5/685 ,  A61B2562/043 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/36139 ,  H05K1/028 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/40 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/05 ,  H05K2201/09372 ,  H05K2203/107

Abstract: The present disclosure describes a closely spaced array of penetrating electrodes. In some implementations, the electrodes of the array are spaced less than 50 µm apart. The present disclosure also describes methods for manufacturing the closely spaced array of penetrating electrodes. In some implementations, each row of electrode of the array is manufactured in-plane and then coupled to other rows of electrodes to form an array.

Abstract translation: 本公开描述了紧密间隔的穿透电极阵列。 在一些实施方式中，阵列的电极间隔小于50微米。 本公开还描述了用于制造紧密间隔的穿透电极阵列的方法。 在一些实施方式中，阵列的每一行电极在面内制造，然后耦合到其他行电极以形成阵列。

公开(公告)号：US20240098912A1

公开(公告)日：2024-03-21

申请号：US18373776

申请日：2023-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhwan JEON ,  Kwangho Jung ,  Chihyun Cho ,  Sangwon Ha

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/341 ,  H05K5/0086 ,  H05K2201/09372 ,  H05K2201/10007

Abstract: An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.

公开(公告)号：US20240028134A1

公开(公告)日：2024-01-25

申请号：US18224606

申请日：2023-07-21

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： SHAN-HUI CHEN ,  PO-JUI LIN ,  CHANG-HUNG HSIEH ,  PO-CHENG HSU

IPC: G06F3/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F3/0202 ,  H05K1/18 ,  H05K1/111 ,  H05K2201/10083 ,  H05K2201/09372 ,  H05K2201/09909 ,  H05K2201/2054 ,  G06F2203/01 ,  H05K2201/10121

Abstract: A light emitting device and a keyboard structure are provided. The light emitting device includes a circuit board and multiple light emitting units. The circuit board includes a substrate, a first conductive pad, multiple second conductive pads, and multiple third conductive pads. The first conductive pad and the second conductive pads are disposed on a first board surface of the substrate. The first conductive pad has a symmetrical shape and a symmetrical axis. The symmetrical axis passes through the second conductive pads. The third conductive pads are disposed on a second board surface of the substrate. Each of the third conductive pads is electrically coupled to the first conductive pad and the second conductive pads by multiple conductive columns. Each of the light emitting units is connected to the first conductive pad and one of the second conductive pads.

公开(公告)号：US20160014898A1

公开(公告)日：2016-01-14

申请号：US14798550

申请日：2015-07-14

Applicant: IBIDEN CO., LTD.

Inventor： Takema Adachi ,  Wataru Nakamura ,  Tomoyoshi Hirabayashi

IPC: H05K1/14 ,  H05K1/09 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H05K1/09 ,  H05K1/185 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/09372 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/0723

Abstract: A printed wiring board includes a first circuit substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first circuit substrate and that the second pads are positioned to electrically connect the first circuit substrate to a second circuit substrate, and metal posts including plating material and formed on the second pads respectively such that the metal posts are positioned to mount the second circuit substrate on the first circuit substrate. Each of the metal posts has a height h1 and a thickness b such that the metal posts have a value h1/b which is greater than 0.1 and smaller than 1.0 where the value h1/b is obtained by dividing the height h1 by the thickness b.

Abstract translation: 印刷布线板包括具有第一焊盘和第二焊盘的第一电路基板，使得第一焊盘被定位成将电子部件安装在第一电路基板上，并且第二焊盘被定位成将第一电路基板电连接到第二电路 基板和包括电镀材料的金属柱并分别形成在第二焊盘上，使得金属柱被定位成将第二电路基板安装在第一电路基板上。 每个金属柱具有高度h1和厚度b，使得金属柱具有大于0.1且小于1.0的值h1 / b，其中通过将高度h1除以厚度b获得值h1 / b 。

公开(公告)号：US20150102835A1

公开(公告)日：2015-04-16

申请号：US14512105

申请日：2014-10-10

Applicant: OCE-TECHNOLOGIES B.V.

Inventor： Maikel A.J. HUYGENS ,  René J. VAN DER MEER ,  Reinier PANNEKOEK ,  Alex N. WESTLAND

IPC: B81C99/00 ,  G01R31/02 ,  G01R31/26 ,  B81C1/00 ,  H05K1/11

CPC classification number: B81C99/004 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2002/14241 ,  B41J2002/14459 ,  B41J2002/14491 ,  B81B7/007 ,  B81B2201/052 ,  B81B2207/03 ,  B81C1/00301 ,  G01R31/02 ,  G01R31/2601 ,  H05K1/0268 ,  H05K1/111 ,  H05K2201/09372

Abstract: A substrate plate is provided for at least one MEMS device to be mounted thereon. The MEMS device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the MEMS device. The pattern forms contact pads within the footprint of the MEMS device and includes at least one lead structure that extends on the substrate plate outside of the footprint of the MEMS device and connects a number of the contact pads to an extra contact pad. The lead structure is a shunt bar that interconnects a plurality of contact pads of the MEMS device and is arranged to be removed by means of a dicing cut separating the substrate plate into a plurality of chip-sized units. At least a major part of the extra contact pad is formed within the footprint of one of the MEMS devices.

Abstract translation: 为安装在其上的至少一个MEMS装置提供基板。 MEMS器件在衬底板上具有一定的占地面积，并且衬底板具有连接到MEMS器件的电气部件的导电引线的图案。 该图案形成MEMS器件的覆盖区内的接触焊盘，并且包括至少一个引线结构，该引线结构在MEMS器件的覆盖区外部的衬底板上延伸，并将多个接触焊盘连接到额外的接触焊盘。 引线结构是将MEMS器件的多个接触焊盘互连的分流棒，并且被布置成通过将衬底板分成多个芯片尺寸的单元的切割切割来去除。 额外接触焊盘的至少主要部分形成在MEMS器件之一的覆盖区内。