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公开(公告)号：JP6227130B2
公开(公告)日：2017-11-08
申请号：JP2016520875
申请日：2014-05-22
Applicant: 三菱電機株式会社
CPC classification number: H02K5/24 , H02K11/21 , H02K11/25 , H02K11/33 , H05K1/0201 , H05K1/0216 , H05K1/181 , H05K1/115 , H05K2201/062 , H05K2201/09063 , H05K2201/09972 , H05K2201/1009 , H05K2201/10507
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42.发明专利Method for incorporating at least one electronic component in printed circuit board, and printed circuit board 审中-公开在印刷电路板和印刷电路板上加入至少一个电子元件的方法
公开(公告)号：JP2014090201A
公开(公告)日：2014-05-15
申请号：JP2014000092
申请日：2014-01-06
Applicant: At & S Austria Technologie & Systemtechnik Aktiengesellschaft , アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフトAt & S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventor： GUENTHER WEICHSLBERGER , ARNO KRIECHBAUM , MIKE MORIANZ , NIKOLAI HASLEBNER , JOHANNES STAHR , FRITZ HARING , GERHARD FREYDL , ANDREA KOERTVELYESSY , MARK BEESLEY , ANDREAS ZLUC , WOLFGANG SCHRITTWIESER
CPC classification number: H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/24137 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15174 , H01L2924/351 , H05K1/0206 , H05K1/185 , H05K3/305 , H05K3/4652 , H05K2201/0355 , H05K2201/09845 , H05K2201/10507 , H05K2201/10674 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To enhance reliability in the arrangement and fixing of an electronic component, the contact with a printed circuit board, and the heat dissipation by a simplified process.SOLUTION: A method for incorporating at least one electronic component in a printed circuit board includes a step for preparing a layer of a printed circuit board for supporting electronic components 1, 2, 3, a step for applying an adhesive 5 onto the surface of the layer, and fixing the electronic components 1, 2, 3 onto the layer by the adhesive 5, a step for sticking or arranging at least one electrical conductor layer to or on the electronic components 1, 2, 3, on a side face or a surface separated from the adhesive 5, and a step for patterning the electrical conductor layer according to the contacts of the electronic components 1, 2, 3 and/or the conductor track formed on the printed circuit board.
Abstract translation: 要解决的问题：提高电子部件的布置和固定的可靠性，与印刷电路板的接触以及通过简化的工艺的散热。解决方案：一种在印刷电路中并入至少一个电子部件的方法 板包括制备用于支撑电子部件1,2,3的印刷电路板层的步骤，将粘合剂5施加到该层的表面上并将电子部件1,2,3固定到该层上的步骤 通过粘合剂5，在与粘合剂5分离的侧面或表面上的电子部件1,2,3上或之上粘贴或布置至少一个电导体层的步骤，以及用于将电导体图案化的步骤 层和/或形成在印刷电路板上的导体轨迹。
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公开(公告)号：JPWO2013054625A1
公开(公告)日：2015-03-30
申请号：JP2013538478
申请日：2012-09-12
Applicant: 株式会社村田製作所
CPC classification number: H05K1/183 , H01L23/49822 , H01L23/50 , H01L24/95 , H01L2224/16225 , H01L2924/12042 , H01L2924/19105 , H05K1/0298 , H05K1/0306 , H05K1/186 , H05K3/4614 , H05K3/4697 , H05K2201/0195 , H05K2201/09027 , H05K2201/10507 , H05K2201/10636 , Y02P70/611 , H01L2924/00
Abstract: 部品内蔵樹脂基板(101)は、複数の樹脂層が互いに積層されることによって形成され、外周を取り巻く端面を有する樹脂構造体(1)と、樹脂構造体(1)に埋め込まれて配置された複数の内蔵部品(3)とを備える。複数の内蔵部品(3)は、第1の内蔵部品(31)と第2の内蔵部品(32)とを含む。平面的に見て、第1の内蔵部品(31)は、第1の内蔵部品(31)にとって最も近い端面5に沿う第1外側辺(61)を有している。平面的に見て、第2の内蔵部品(32)は、第2の内蔵部品(32)にとって最も近い端面(5)に沿う第2外側辺(62)を有している。平面的に見て、第1外側辺(61)は、第2外側辺(62)に対して斜めとなっている。
Abstract translation: 是由多个树脂层形成的元器件内置树脂基板（101）层压在一起，具有围绕外周（1），其设置嵌入在树脂结构体的端面的树脂结构体（1） 和多个内部部件（3）。 多个内置的部分（3）包括第一内部部分（31）和第二内部部分（32）。 在平面图中，第一内置部分（31）具有第一内部部分（31）沿着最近的端面5为（61）延伸的第一外边缘。 在平面图中，第二内置部分（32）包括一个第二外边缘沿着最近的端面到第二内置部（32）延伸的（5）（62）。 在平面图中，所述第一外边缘（61）具有相对于所述第二外边缘（62）的倾斜。
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公开(公告)号：JP2015035497A
公开(公告)日：2015-02-19
申请号：JP2013165662
申请日：2013-08-09
Applicant: イビデン株式会社 , Ibiden Co Ltd
Inventor： ISHIGURO NAOTO , INAGAKI YASUSHI
IPC: H05K3/46
CPC classification number: H05K1/185 , H05K3/4602 , H05K3/4644 , H05K2201/10 , H05K2201/10015 , H05K2201/10507 , H05K2203/0156
Abstract: 【課題】電子部品を収容した部品収容層上の積層数を表裏で異なる積層数とした多層構造の電子部品内蔵配線板を提供すること。【解決手段】本発明の電子部品内蔵配線板は,内層配線層と心材を含む絶縁樹脂からなる内層絶縁層とを複数積層してなるコア基板と,コア基板に内蔵された表面電極を有する電子部品と,コア基板の表裏にそれぞれ設けられた上層配線層と上層絶縁層とを積層してなる上層部とを有する。コア基板は,部品収容層の表裏にそれぞれ,第1接続層と,第1接続層よりも多くの内層配線層と内層絶縁層とが積層されている第2接続層とを有している。また,第1接続層の内層絶縁層と第1接続層の側の上層部の上層絶縁層とのいずれにも,電子部品の表面電極に導通するビア導体が形成されている。【選択図】図1
Abstract translation: 要解决的问题：提供一种具有多层结构的电子部件内置布线板，该多层结构在容纳电子部件的部件壳体层的前侧和后侧具有不同数量的层。解决方案：电子部件内置布线 包括：通过层叠多个内部布线层和各自由包括芯的绝缘树脂制成的内部绝缘层而形成的芯基板; 电子部件，其具有内置于所述芯基板的表面电极; 以及通过层压分别设置在芯基板的前侧和后侧上的上布线层和上绝缘层而形成的上层部分。 核心基板具有：在部件容纳层的前侧上的第一连接层; 以及在所述部件收容层的后侧，与所述第一连接层相比，层叠了所述内部配线层和所述内部绝缘层的数量较多的第二连接层。 此外，分别在第一连接层的内绝缘层和第一连接层侧的上层部分的上绝缘层上分别形成与电子部件的表面电极导通的通孔导体。
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公开(公告)号：US09699909B2
公开(公告)日：2017-07-04
申请号：US14455012
申请日：2014-08-08
Applicant: IBIDEN CO., LTD.
Inventor： Naohito Ishiguro , Yasushi Inagaki
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2924/15311 , H05K3/4602 , H05K3/4644 , H05K2201/10 , H05K2201/10015 , H05K2201/10507 , H05K2203/0156
Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.
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Patent Agency Ranking
公开(公告)号：US20150342055A1
公开(公告)日：2015-11-26
申请号：US14709605
申请日：2015-05-12
Applicant: Infineon Technologies AG
Inventor： Andre Arens
IPC: H05K1/18 , H01L23/495
CPC classification number: H05K1/185 , H01L23/4952 , H01L23/49541 , H01L23/49575 , H01L23/49844 , H01L23/5386 , H01L23/5389 , H01L25/072 , H01L2924/0002 , H05K2201/10507 , H01L2924/00
Abstract: A semiconductor module includes a printed circuit board, and first and second embedded semiconductor chips. The first and second semiconductor chips each have a first load connection and a second load connection. The printed circuit board further includes a structured first metalization layer, which has a first section and a second section, and a structured second metalization layer, which has a first section, a second section and a third section. The first section of the second metalization layer and the second section of the first metalization layer have comb shaped structures having first and second protrusions. These first and second sections are electrically conductively connected to one another by a number of first plated-through holes each of which is permanently electrically conductively connected both at first protrusions to the first section of the second metalization layer and at second protrusions to the second section of the first metalization layer.
Abstract translation: 半导体模块包括印刷电路板，以及第一和第二嵌入式半导体芯片。 第一和第二半导体芯片各自具有第一负载连接和第二负载连接。 印刷电路板还包括具有第一部分和第二部分的结构化的第一金属化层和具有第一部分，第二部分和第三部分的结构化的第二金属化层。 第二金属化层的第一部分和第一金属化层的第二部分具有具有第一和第二突起的梳状结构。 这些第一和第二部分通过多个第一电镀通孔彼此导电连接，每个第一电镀通孔在第一突起处与第二金属化层的第一部分永久地导电连接，并且在第二突起处连接到第二部分 的第一金属化层。
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47.发明申请Manufacturing a Semiconductor Package Including an Embedded Circuit Component within a Support Structure of the Package 审中-公开在封装的支持结构内制造包含嵌入式电路元件的半导体封装公开(公告)号：US20150342053A1
公开(公告)日：2015-11-26
申请号：US14815184
申请日：2015-07-31
Applicant: Cisco Technology, Inc.
Inventor： Jovica Savic , Zhiping Yang , Jie Xue , Li Li
IPC: H05K1/18 , H05K1/11 , H01L23/498
CPC classification number: H05K1/183 , H01L23/24 , H01L23/3107 , H01L23/49838 , H01L2224/16225 , H01L2924/0002 , H05K1/115 , H05K1/181 , H05K2201/095 , H05K2201/10492 , H05K2201/10507 , H01L2924/00
Abstract: An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
Abstract translation: 一种装置包括形成在支撑结构中的空腔，所述支撑结构可操作以支撑半导体器件。 电路元件设置在支撑结构中的空腔中，并且支撑结构中的空腔填充有不导电的填充材料，以便至少部分地围绕电路元件与非导电填充材料。 半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。
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公开(公告)号：US20150245491A1
公开(公告)日：2015-08-27
申请号：US14708755
申请日：2015-05-11
Applicant: International Business Machines Corporation
Inventor： Mark C. Lamorey , Janak G. Patel , Peter Slota, JR. , David B. Stone
CPC classification number: H05K1/183 , H05K1/0231 , H05K1/11 , H05K1/181 , H05K1/184 , H05K2201/09645 , H05K2201/10015 , H05K2201/10507 , Y02P70/611 , Y10T29/49135
Abstract: Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (IC) structure includes: a substrate layer having an upper surface; an IC chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the IC chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the IC chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the IC chip.
Abstract translation: 各种实施例包括具有离轴孔内电容器的集成电路结构。 在一些实施例中，集成电路（IC）结构包括：具有上表面的基底层; 至少部分地包含在所述衬底层内并与垂直于所述衬底层的上表面的短轴对准的IC芯片; 所述基板层中的孔，所述孔与所述IC芯片物理分离; 以及孔中的电容器，并且至少部分地包含在所述衬底层内，所述电容器与所述IC芯片物理隔离，其中所述电容器与垂直于所述衬底层的上表面的轴线对准，并且偏离所述衬底层的短轴 IC芯片。
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公开(公告)号：US20150043183A1
公开(公告)日：2015-02-12
申请号：US14455012
申请日：2014-08-08
Applicant: IBIDEN CO., LTD.
Inventor： Naohito ISHIGURO , Yasushi Inagaki
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2924/15311 , H05K3/4602 , H05K3/4644 , H05K2201/10 , H05K2201/10015 , H05K2201/10507 , H05K2203/0156
Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.
Abstract translation: 具有内置电子部件的布线基板包括芯基板，基板中的电子部件，基板第一面上的第一上层结构，基板的第二面上的第二上层结构以及基板的第二表面的通路 衬底中的导体和第一上层结构，使得通孔导体连接到部件的电极。 所述基板具有容纳层，在所述容纳层的第一表面上的第一连接层和在所述容纳层的第二表面上的第二连接层，所述容纳层包括内部布线和绝缘层，并且具有容纳所述部件的空腔，所述第一 连接层包括内部布线和绝缘层，并且第二连接层包括内部布线和绝缘层，使得第二连接层包括比第一连接层更多数量的内部布线和绝缘层。
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50.发明授权Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution 有权具有中心触点和改进的接地或功率分配的增强堆叠微电子组件公开(公告)号：US08885356B2
公开(公告)日：2014-11-11
申请号：US13278514
申请日：2011-10-21
Applicant: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
Inventor： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC: H05K7/00 , H01L25/065 , H01L23/50 , H01L23/498 , H01L23/13 , H05K1/14 , H05K7/02 , H01L23/00 , H01L23/31
CPC classification number: H05K1/11 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49111 , H01L2224/49175 , H01L2224/49427 , H01L2224/73215 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1434 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19107 , H01L2924/30107 , H05K1/115 , H05K1/181 , H05K2201/10507 , H05K2201/10628 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.
Abstract translation: 微电子组件包括介电元件，第一和第二微电子元件，信号引线和一个或多个跳线。 电介质元件具有相对的第一和第二表面，并且第一和第二孔在表面之间延伸。 多个导电元件位于其上。 信号引线连接到一个或多个微电子元件并且延伸通过第一或第二孔中的一个或多个到介电元件上的一些导电元件。 一个或多个跳线引线延伸穿过第一孔并且连接到第一微电子元件的触点。 一个或多个跨接线跨越第二孔并且连接到电介质元件上的导电元件。
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