公开(公告)号：KR1020110084343A

公开(公告)日：2011-07-22

申请号：KR1020100002384

申请日：2010-01-11

Applicant: 삼성전자주식회사

Inventor： 이주한 ,  김정훈 ,  한성찬

IPC: H01L23/373 ,  H01L23/367 ,  G06F1/20 ,  G06F1/18 ,  H05K7/14

CPC classification number: G06F1/20 ,  G06F1/183 ,  H05K7/1431 ,  H01L23/373 ,  H01L23/3677

Abstract: PURPOSE: A socket device of a semiconductor module is provided to install a heat emitting unit in a socket main body, thereby preventing heat generated in the semiconductor module from being transferred to the main body thereof. CONSTITUTION: A socket main body(11) comprises a socket groove corresponding to a semiconductor module. A socket pin(13) is installed in the socket groove of the socket main body to be electrically connected to a module pin of the semiconductor module. A heat emitting unit(12) is installed in the socket main body. The heat emitting unit includes a heat emitting plate which is exposed to one side of the socket main body. A socket pin is electrically connected to the main board of a computer. A ratchet is installed on both sides of the socket groove of the socket main body and has teeth engaged with a tooth groove of the semiconductor module.

Abstract translation: 目的：提供一种半导体模块的插座装置，用于将发热单元安装在插座主体中，从而防止半导体模块中产生的热量转移到其主体。 构成：插座主体（11）包括对应于半导体模块的插槽。 插座主体（13）安装在插座主体的插座槽中，以与半导体模块的模块引脚电连接。 发热单元（12）安装在插座主体中。 发热单元包括暴露于插座主体的一侧的散热板。 插座引脚电连接到计算机的主板。 棘轮安装在插座主体的插座槽的两侧，并且具有与半导体模块的齿槽啮合的齿。

公开(公告)号：KR1020110037402A

公开(公告)日：2011-04-13

申请号：KR1020090094833

申请日：2009-10-06

Applicant: 삼성전자주식회사

Inventor： 한성찬 ,  양진규 ,  김재영 ,  유광수

IPC: H01L27/04 ,  H01L23/48

CPC classification number: H05K1/023 ,  H01L24/16 ,  H01L29/86 ,  H01L2224/16 ,  H01L2924/01077 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19015 ,  H05K1/0269 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09181 ,  H05K2201/09781 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: PURPOSE: A passive device, a semiconductor module, an electronic circuit board, and an electronic system having the same and method of fabricating and inspecting the semiconductor module are provided to improve productivity by inspecting a electrical connection state and a physical fixed state through a visual inspection. CONSTITUTION: In a passive device, a semiconductor module, an electronic circuit board, and an electronic system having the same and method of fabricating and inspecting the semiconductor module, at least two real electrodes(120a) are formed in one side of a main body(110a). Real electrodes are used for transmitting the electrical signal. The real electrodes are electrically connected to each other in the main body. The main body has At least one first dummy electrode(130a). The first dummy electrode is electrically connected to the real electrodes.

Abstract translation: 目的：提供一种无源器件，半导体模块，电子电路板和具有该半导体模块的电子系统及其制造和检查方法，以通过视觉检测电气连接状态和物理固定状态来提高生产率 检查。 构成：在无源器件中，半导体模块，电子电路板和具有该半导体模块的电子系统以及制造和检查半导体模块的方法，至少两个实际电极（120a）形成在主体的一侧 （110A）。 实电极用于传输电信号。 实际电极在主体中彼此电连接。 主体具有至少一个第一虚拟电极（130a）。 第一虚拟电极电连接到实际电极。

公开(公告)号：KR1020110032492A

公开(公告)日：2011-03-30

申请号：KR1020090090006

申请日：2009-09-23

Applicant: 삼성전자주식회사

Inventor： 오남용 ,  한성찬 ,  김재영 ,  최재훈

IPC: H01L23/00 ,  H05K3/34 ,  H01L21/48 ,  H05K3/22 ,  H01L23/13 ,  B23K1/00 ,  B23K3/06

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  H01L21/4853 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13186 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81232 ,  H01L2224/81359 ,  H01L2224/81399 ,  H01L2224/8192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/1163 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01083

Abstract: PURPOSE: A method of jointing a solder ball and a method of repairing a memory module are provided to prevent a crack of a semiconductor chip included in a package by selectively heating a junction area of a solder ball. CONSTITUTION: In a method of jointing a solder ball and a method of repairing a memory module, a solder paste is coated at least one of a solder ball(115) and a pad(121). A first material is coated in the solder ball. A second material capable of being reacted with the first material is coated on the pad of a substrate for the solder ball. The solder ball and the pad are bonded by heat which is generated in the reaction between the first and second materials.

Abstract translation: 目的：提供一种接合焊球的方法和修复存储器模块的方法，以通过选择性地加热焊球的接合区域来防止包装在包装中的半导体芯片的裂纹。 构成：在焊接球的方法和修复存储器模块的方法中，焊膏涂覆有焊球（115）和焊盘（121）中的至少一个。 第一种材料被涂覆在焊球中。 能够与第一材料反应的第二材料涂覆在用于焊球的基板的焊盘上。 焊球和焊盘通过在第一和第二材料之间的反应中产生的热结合。

公开(公告)号：KR1020100093359A

公开(公告)日：2010-08-25

申请号：KR1020090012508

申请日：2009-02-16

Applicant: 삼성전자주식회사

Inventor： 오현종 ,  한성찬 ,  최재훈 ,  윤찬형

IPC: H01L23/02

CPC classification number: H05K3/303 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2203/302 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/0401

Abstract: PURPOSE: A manufacturing method of a semiconductor module is provided to increase aspect ratio of a connection pattern formed between the semiconductor package and the module PCB by adding heat to a plate having double metal layers of different coefficient of thermal expansion. CONSTITUTION: A substrate(110) comprises a body part(112), a first plate part(114), and a fixing unit(116) connecting the body part and the first plate part. A semiconductor chip(130) is arranged on the top of a substrate. The semiconductor chip is electrically connected with the substrate by a connecting member. A mold(132) is formed to protect the semiconductor chip and the connecting member in the top of the substrate. The mold is formed into EMC(Epoxy Molding Compound).

Abstract translation: 目的：提供一种半导体模块的制造方法，通过向具有不同热膨胀系数的双金属层的板加热来增加形成在半导体封装和模块PCB之间的连接图案的纵横比。 构成：衬底（110）包括主体部分（112），第一板部分（114）和连接主体部分和第一板部分的固定单元（116）。 半导体芯片（130）设置在基板的顶部。 半导体芯片通过连接部件与基板电连接。 形成模具（132）以保护半导体芯片和连接构件在基板的顶部。 模具成型为EMC（环氧树脂模塑料）。

公开(公告)号：KR1020090107800A

公开(公告)日：2009-10-14

申请号：KR1020080033273

申请日：2008-04-10

Applicant: 삼성전자주식회사

Inventor： 이주한 ,  이동춘 ,  김용현 ,  한성찬

IPC: H01L21/60

CPC classification number: H01L2224/11

Abstract: PURPOSE: A semiconductor package and a manufacturing method of the same are provided to reduce damage to a connection terminal from an external impact due to temperature change by installing the connection terminal with a filling member. CONSTITUTION: A semiconductor package includes a connection terminal(130a) including a solder(132) and a filling material(134). The filling material is arranged inside a solder, and a plurality of air layers are formed inside in the filling material. The filling material is composed of an aerosol particle, a conductive material, and a carbon. The filling material is distributed inside the solder and it is included in a connection terminal by 0.5wt%~1.5Wt%.

Abstract translation: 目的：提供一种半导体封装及其制造方法，以通过将连接端子与填充构件相连来减少由于温度变化而导致的连接端子与外部冲击的损坏。 构成：半导体封装包括包括焊料（132）和填充材料（134）的连接端子（130a）。 填充材料布置在焊料内部，并且在填充材料内部形成多个空气层。 填充材料由气溶胶颗粒，导电材料和碳组成。 填充材料分布在焊料内部，连接端子包含0.5wt％〜1.5Wt％。

公开(公告)号：KR100819554B1

公开(公告)日：2008-04-07

申请号：KR1020060121572

申请日：2006-12-04

Applicant: 삼성전자주식회사

Inventor： 한성찬 ,  신동우 ,  이영수 ,  방효재 ,  한훈

IPC: H05K3/40

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/98 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/225 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/176 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53274 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic device having reproducible electronic components, a method for manufacturing the same, and a method for reproducing electronic components are provided to detect an error of a connection pattern by exposing the connection pattern to the outside. An electronic device having reproducible electronic components includes a substrate body(203), a first cavity(205a), a first metal pattern(210a), a first electronic component, and a first conductive connection pattern. The first cavity is provided to the substrate body. The first metal pattern is provided to the substrate body and is close to the first cavity. The first electronic component is inserted into the first cavity, and has a ball pad which is provided to the first body and an upper edge part of the first body. The first conductive connection pattern is located on an upper edge of the first electronic component, and is expanded to the first metal pattern. The first conductive connection pattern is contacted with the ball pad and the first metal pattern.

Abstract translation: 提供具有可再生电子元件的电子设备，其制造方法以及再现电子元件的方法，用于通过将连接图案暴露于外部来检测连接图案的错误。 具有可再现电子部件的电子设备包括基板主体（203），第一空腔（205a），第一金属图案（210a），第一电子部件和第一导电连接图案。 第一腔被提供到衬底主体。 第一金属图案被提供到基板主体并且靠近第一空腔。 第一电子部件被插入到第一腔体中，并且具有设置到第一主体的球垫和第一主体的上边缘部。 第一导电连接图案位于第一电子部件的上边缘，并且扩展到第一金属图案。 第一导电连接图案与球垫和第一金属图案接触。

公开(公告)号：KR1020080029593A

公开(公告)日：2008-04-03

申请号：KR1020060096401

申请日：2006-09-29

Applicant: 삼성전자주식회사

Inventor： 방효재 ,  한성찬 ,  한훈 ,  이동춘

IPC: H01L23/12 ,  H01L23/48

CPC classification number: H01L23/49582 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing a lead frame stack package using laser soldering is provided to enhance the reliability of products by strongly sticking a semiconductor module to a stack package without a soldering defect through the use of solder ball. A method for manufacturing a lead frame stack package includes the step of stacking a second lead frame package on a first lead frame package to be partially contacted to each other; and the step of combining a lead(43) of the first lead frame package with a lead of the second lead frame package through a laser soldering. The combination through the laser soldering is performed by putting a solder ball(80) supplied from a laser soldering head on a junction portion of the leads and melting the solder ball by a laser beam irradiated from the laser soldering head and then hardening the solder ball to join the leads. The method further includes stacking the third lead frame package on the second lead frame package; and closely adhering a lead of the second lead frame package to a lead of the third lead frame package.

Abstract translation: 提供了一种使用激光焊接制造引线框架堆叠封装的方法，以通过使用焊球强力地将半导体模块强力地粘贴到堆叠封装而没有焊接缺陷来提高产品的可靠性。 一种用于制造引线框架堆叠封装的方法包括将第二引线框架封装堆叠在第一引线框架封装上以彼此部分接触的步骤; 以及通过激光焊接将第一引线框架封装的引线（43）与第二引线框架封装的引线组合的步骤。 通过激光焊接的组合通过将从激光焊接头提供的焊球（80）放置在引线的接合部分上并通过从激光焊接头照射的激光束熔化焊球，然后使焊球硬化 加入线索。 该方法还包括将第三引线框架封装堆叠在第二引线框架封装上; 并将第二引线框架封装的引线紧密地粘合到第三引线框架封装的引线上。

公开(公告)号：KR1020080017162A

公开(公告)日：2008-02-26

申请号：KR1020060078917

申请日：2006-08-21

Applicant: 삼성전자주식회사

Inventor： 방효재 ,  신화수 ,  이성열 ,  김용현 ,  한성찬 ,  김중현

IPC: H01L21/60 ,  H01L23/48

CPC classification number: H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1369 ,  H01L2224/16 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/4015 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A mounting structure of a semiconductor device having soldering flux and an under fill resin layer, and a method for mounting the semiconductor device are provided to prevent the crack of soldering portions between solder balls and ball pads by using epoxy resin flux. A mounting structure of a semiconductor device includes a pattern substrate(20), an element substrate(10), solder balls(15), first soldering fluxes(13), and an under fill resin layer(35). The pattern substrate includes terminal pads(21). The element substrate, which is installed on the pattern substrate, includes ball pads(11) opposite to the terminal pads. The solder balls are contacted to the terminal pads and ball pads between the pattern substrate and element substrate. The first soldering fluxes of epoxy resin group attaches the solder balls to the ball pads. The under fill resin layer is used for filling the solder balls and soldering fluxes between the pattern substrate and element substrate.

Abstract translation: 提供具有助焊剂和填充不足的树脂层的半导体器件的安装结构以及用于安装半导体器件的方法，以通过使用环氧树脂焊剂来防止焊球和焊盘之间的焊接部分的裂纹。 半导体器件的安装结构包括图形基板（20），元件基板（10），焊球（15），第一焊剂（13）和下填充树脂层（35）。 图案基板包括端子焊盘（21）。 安装在图案基板上的元件基板包括与端子焊盘相对的球垫（11）。 焊球与图案基板和元件基板之间的端子焊盘和焊盘接触。 环氧树脂组的第一个助焊剂将焊球附着在球垫上。 填充树脂层用于填充图案基板和元件基板之间的焊球和焊剂。

公开(公告)号：KR1020080010901A

公开(公告)日：2008-01-31

申请号：KR1020060071574

申请日：2006-07-28

Applicant: 삼성전자주식회사

Inventor： 방효재 ,  이동춘 ,  한성찬 ,  김경두 ,  황선규

IPC: H01L23/12

CPC classification number: H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0231 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor package having a passive component and a semiconductor memory module including the same are provided to reduce a size of a memory module substrate as the area of the passive component to make a computer system compact. A semiconductor package(225) includes a mounting substrate(110), a semiconductor chip(120), a passive component, and a cover(130). The semiconductor chip is bonded to the mounting substrate. The passive component penetrates through the mounting substrate around the semiconductor chip. The cover covers the mounting substrate, the semiconductor chip, and the passive component. The semiconductor chip has a pad array composed of a plurality of pads(122) and the mounting substrate has a pad array composed of a plurality of pad electrodes(114). The pads of the semiconductor chip and the pad electrodes are electrically connected to each other.

Abstract translation: 提供具有无源部件和包括该半导体存储器模块的半导体存储器模块的半导体封装，以减小作为无源部件的区域的存储器模块基板的尺寸以使计算机系统紧凑。 半导体封装（225）包括安装基板（110），半导体芯片（120），无源部件和盖（130）。 半导体芯片与安装基板结合。 被动元件穿过半导体芯片周围的安装基板。 封盖覆盖安装基板，半导体芯片和无源元件。 半导体芯片具有由多个焊盘（122）构成的焊盘阵列，并且安装基板具有由多个焊盘电极（114）构成的焊盘阵列。 半导体芯片的焊盘和焊盘电极彼此电连接。

公开(公告)号：KR1020080005740A

公开(公告)日：2008-01-15

申请号：KR1020060064471

申请日：2006-07-10

Applicant: 삼성전자주식회사

Inventor： 방효재 ,  한성찬 ,  한훈 ,  최재훈

IPC: H01L21/60 ,  H01L23/48

CPC classification number: H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/15331 ,  H01L2924/00012

Abstract: A semiconductor package including a PCB(Printed Circuit Board) having a flexible region and a semiconductor module having the package are provided to absorb variation occurring due to a difference in thermal expansion coefficient between the PCB and a semiconductor chip. A semiconductor package includes a first printed circuit board(101), a first semiconductor chip(151), and a plurality of solder balls. The first printed circuit board is provided with a flexible region(F) and rigid regions(R1,R2). The first semiconductor chip is provided on one surface of the first printed circuit board. The first semiconductor chip is installed in a center portion of the first printed circuit board. The solder balls are formed on both outside portions of the first printed circuit board. The both outside portions are the rigid regions. The flexible region is positioned adjacent to the both outside portions. The center portion is the rigid region. The flexible region is provided between the center portion and the both outside portions.

Abstract translation: 提供了包括具有柔性区域的PCB（印刷电路板）和具有封装的半导体模块的半导体封装，以吸收由于PCB和半导体芯片之间的热膨胀系数的差异而发生的变化。 半导体封装包括第一印刷电路板（101），第一半导体芯片（151）和多个焊球。 第一印刷电路板设置有柔性区域（F）和刚性区域（R1，R2）。 第一半导体芯片设置在第一印刷电路板的一个表面上。 第一半导体芯片安装在第一印刷电路板的中心部分。 焊球形成在第一印刷电路板的两个外侧部分上。 两个外部部分是刚性区域。 柔性区域邻近两个外侧部分定位。 中心部分是刚性区域。 柔性区域设置在中心部分和两个外部部分之间。