Abstract:
본 발명은 열전 물질의 종류에 제약이 없이 다양한 열전 소재를 제조하고, 또한 경제적이며 동시에 친환경적인 방법으로 열전 소재를 제조하기 위한 것으로, 열전 물질을 녹인 후 냉각시켜 잉곳(ingot)을 제조하는 잉곳 제조 단계; 상기 제조된 잉곳을 냉간 성형하여 열전 소재를 제조하는 냉간 성형 단계; 및 상기 제조된 열전 소재를 열처리하는 열처리 단계; 를 포함하는 냉간 성형을 이용한 고성능 열전 소재 제조 방법을 제공한다.
Abstract:
The present invention relates to bismuth telluride-indium selenide nanocomposite thermoelectric materials. The thermoelectric materials have the same composition as a chemical formula (Bi2(TeSe)3)1-x(In4Se3)x and in the chemical formula, the x provides the bismuth telluride-indium selenide nanocomposite thermoelectric materials having a value from 0.001 to 0.5. The bismuth telluride-indium selenide nanocomposite thermoelectric materials indicate significantly improved thermoelectric performance in a wide temperature range higher than room temperature, compared to existing thermoelectric materials and are helpfully used for a non-refrigerant refrigerator, general cooling machines such as an air conditioner, waste heat power generation, and structure materials of micro cooling /power generation systems.
Abstract:
The present invention relates to an oxide sensor and a method to manufacture the oxide sensor. The present invention provides an oxide sensor including: an oxide substrate; an oxide thin film layer formed on the oxide substrate and generating a two-dimensional electron gas (2DEG) layer on the bonding interface with the oxide substrate by including an oxide which is a different kind of the oxide substrate; and an electrode wiring connected to the 2DEG layer generated on the bonding interface of the oxide substrate and the oxide thin film layer. Furthermore, the present invention provides a method to manufacture the oxide sensor comprising the steps of: forming the oxide thin film layer generating the 2DEG layer on the bonding interface with the oxide substrate by depositing the oxide whereby is a different kind of the oxide substrate on the oxide substrate; etching the oxide thin film layer; and forming the electrode wiring connected to the 2DEG layer by depositing conductive materials on an etched portion. According to the present invention, it is possible to be ultra slim because the sensitivity of the ultra-thin film is high in principality whereby electrical conductivity of the 2DEG generated on the bonding interface with a different kind of changed oxide is used and be able to provide at a low cost by a simple manufacturing process.