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公开(公告)号:KR101192230B1
公开(公告)日:2012-10-16
申请号:KR1020080123097
申请日:2008-12-05
Applicant: 한국전자통신연구원
Abstract: 광도파로 형성 방법을 제공한다. 이 방법은 반도체 기판에 활성부를 정의하는 트렌치를 형성하고, 활성부를 부분적으로 산화시키는 것을 포함한다. 활성부의 산화되지 않은 부분은 코어에 포함되고, 활성부의 산화된 부분은 클래딩(cladding)에 포함된다.
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公开(公告)号:KR1020120055251A
公开(公告)日:2012-05-31
申请号:KR1020100116877
申请日:2010-11-23
Applicant: 한국전자통신연구원
IPC: H01L31/102 , H01L31/18 , H01L31/0224 , H01L31/028
CPC classification number: H01L31/102 , H01L31/18 , H01L31/0224 , H01L31/028
Abstract: PURPOSE: A light detection device and a manufacturing method thereof are provided to simplify manufacturing processes by forming a self-aligned light absorption layer and a first conductive pattern without an additional pattern. CONSTITUTION: An insulating pattern(106) includes a groove which exposes a part of a first conductive pattern(102). A light absorption layer(110) fills the groove of the insulating pattern. The light absorption layer has an upper surface which is arranged higher than the upper surface of the insulating pattern. A second conductive pattern(112) is arranged on the light absorption layer. Connection terminals(116) is respectively and electrically connected to the first conductive pattern and the second conductive pattern.
Abstract translation: 目的:提供光检测装置及其制造方法,以通过形成自对准的光吸收层和第一导电图案来简化制造工艺,而不需要额外的图案。 构成:绝缘图案(106)包括暴露第一导电图案(102)的一部分的凹槽。 光吸收层(110)填充绝缘图案的凹槽。 光吸收层具有比绝缘图案的上表面高的上表面。 第二导电图案(112)布置在光吸收层上。 连接端子(116)分别电连接到第一导电图案和第二导电图案。
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公开(公告)号:KR1020110064884A
公开(公告)日:2011-06-15
申请号:KR1020090121653
申请日:2009-12-09
Applicant: 한국전자통신연구원
IPC: H01L21/20
CPC classification number: H01L21/7624 , H01L21/76243 , H01L21/76264 , H01L29/0657
Abstract: PURPOSE: A semiconductor device and forming method thereof are provided to support a core semiconductor pattern by a semiconductor pattern, thereby minimizing the bending of the core semiconductor pattern. CONSTITUTION: A first buried oxide film(110a,110b) is formed in a semiconductor substrate(100). A support semiconductor pattern(140a,140b) contacts one sidewall of a core semiconductor pattern(130). The first buried oxide film is located under the core semiconductor pattern. The first buried oxide film is eliminated. The gap between the core semiconductor pattern and the semiconductor substrate is filled with a second buried oxide film.
Abstract translation: 目的:提供半导体器件及其形成方法以通过半导体图案来支撑芯半导体图案,从而使芯半导体图案的弯曲最小化。 构成:在半导体衬底(100)中形成第一掩埋氧化膜(110a,110b)。 支撑半导体图案(140a,140b)接触芯半导体图案(130)的一个侧壁。 第一掩埋氧化膜位于芯半导体图案之下。 第一掩埋氧化膜被消除。 芯半导体图案和半导体衬底之间的间隙填充有第二掩埋氧化物膜。
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公开(公告)号:KR1020100067347A
公开(公告)日:2010-06-21
申请号:KR1020080125871
申请日:2008-12-11
Applicant: 한국전자통신연구원
IPC: G02B6/12
CPC classification number: G02B6/1228 , G02B6/12004 , G02B6/124 , G02B6/34
Abstract: PURPOSE: An optical device is provided to maximize coupling efficiency by selectively extracting wavelength or part of light from a first optical waveguide through a lateral lattice on the side of the optical waveguide. CONSTITUTION: A first cladding is arranged on a substrate. A first optical waveguide(120) has a first dielectric constant extended on the first cladding in a first direction. A lateral lattice(130) is formed on one side of the first optical waveguide. A second optical waveguide(140) fills the space of the lateral lattice on the first cladding and is extended in a second direction cross the first direction. A second cladding is arranged on the second optical waveguide and has a third dielectric constant. The first dielectric constant is larger than the second dielectric constant. The second dielectric constant is larger than the third dielectric constant.
Abstract translation: 目的:提供一种光学装置,通过选择性地从光波导侧的横向晶格选择性地提取来自第一光波导的波长或部分光以使耦合效率最大化。 构成:第一包层布置在基底上。 第一光波导(120)具有在第一方向上在第一包层上延伸的第一介电常数。 横向晶格(130)形成在第一光波导的一侧。 第二光波导(140)填充第一包层上的横向晶格的空间,并且沿与第一方向交叉的第二方向延伸。 第二包层布置在第二光波导上并具有第三介电常数。 第一介电常数大于第二介电常数。 第二介电常数大于第三介电常数。
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公开(公告)号:KR1020050051882A
公开(公告)日:2005-06-02
申请号:KR1020030085550
申请日:2003-11-28
Applicant: 한국전자통신연구원
IPC: G02B6/12
CPC classification number: G02B6/12002 , G02B6/4203 , H01L31/0232
Abstract: 본 발명은 기판 내부에 전반사 / 무반사면을 구비하는 식각구조복합체를 형성하여 입사광과의 결합효율 및 광검출소자의 감도를 향상시킨 광결합 장치에 관한 것으로 이를 이용하면 표면 입사형 광검출기나 측면입사형 광검출기가 모두 집적가능하고 패키징의 난이도를 크게 낮출 수 있어 저비용으로 광검출기의 감도를 증가시킬 수 있도록 하는 효과가 있다.
Abstract translation: 提供一种光耦合装置,其形成包括基板内的全反射面/抗反射面的蚀刻结构复合体,以提高与入射光的耦合效率和光检测器装置的响应度,由此表面照明光电检测器或边缘 - 耦合光电检测器都是可整合的,并且可以降低封装期间的难度,并且以低成本提高光电检测器的响应度。
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