公开(公告)号：EP1204307A3

公开(公告)日：2002-10-30

申请号：EP01125896.9

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R. ,  Krautheim, Thomas B.

IPC: H05K3/36

CPC classification number: H05K3/4007 ,  H05K3/062 ,  H05K3/363 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/209 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/1184 ,  Y10S439/943 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: In conventional ETM (Etched Tri-Metal) circuit structures a pin connector in which the pin (30) is etched from the ETM substrate (16) and the mating cavity (32) is etched from the ETM substrate (18) to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin (30) serves as an anchor with the metallurgical bonds with solder (34) in the cavity (32) that forms on the copper surfaces (24,26) of the ETM circuit structures (16,18) to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.

公开(公告)号：EP1111975A1

公开(公告)日：2001-06-27

申请号：EP99931469.3

申请日：1999-07-22

Applicant: Toyo Kohan Co., Ltd.

Inventor： SAIJO, Kinji, Toyo Kohan Co., Ltd. ,  YOSHIDA, Kazuo, Toyo Kohan Co., Ltd. ,  OHSAWA, Shinji, Toyo Kohan Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/062 ,  H05K3/20 ,  H05K3/44 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10S428/901 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/24917

Abstract: In the present invention, which produces a clad sheet for a multilayered printed circuit board capable of being economically manufactured and having excellent performance, a multilayered printed circuit board using thereof and a manufacturing method thereof, a multilayered printed circuit board is manufactured by

forming clad sheet for a multilayered printed circuit board 34 by
laminating copper foil 19, 24, 33 which are to be formed into conductor layer 10, 17, 18 and nickel plating 20, 21 which are to be etching-stopper layer and
simultaneously press-bonding both,
producing a base by selectively etching clad sheet for a multilayered printed circuit board 34,
forming outer conductor layer 15, 16 on the surface of the base and
simultaneously making patterning, and
electrically connecting among conductor layer 10, 15, 16 by
interposing columnar conductor 17, 18 formed by etching copper foil 19, 24, 33 and nickel plating 20, 21.

Abstract translation: 在本发明中，其产生用于多层印刷电路板能够被经济地制造，并具有优良性能的包覆板，使用它们的多层印刷电路板及其制造方法，多层印刷电路板是通过形成包层板制造 为通过层叠铜箔19，24，33将被形成为导体层10，17，18和镀镍20，21，它们将被蚀刻停止层，并同时压接二者的多层印刷电路板34， 通过选择性地蚀刻用于多层印刷电路板34包层板，所述基体的表面上形成外导体层15,16，同时使这种图案化和电通过插入柱状导体17之间的导体层10，15，16连接产生一个基 通过蚀刻铜箔19，24，33和镀镍20 18形成，21

公开(公告)号：EP0545328B1

公开(公告)日：1997-03-19

申请号：EP92120367.5

申请日：1992-11-28

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Fukutomi, Naoki ,  Nakayama, Hajime ,  Tsubomatsu, Yoshiaki ,  Kaitou, Kouichi ,  Yoshidomi, Yasunobu ,  Takahashi, Yoshihiro

IPC: H05K3/00 ,  H05K3/06

CPC classification number: H05K3/428 ,  H05K3/04 ,  H05K3/205 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10S29/016 ,  Y10T29/49156 ,  Y10T29/49158

公开(公告)号：EP0545328A2

公开(公告)日：1993-06-09

申请号：EP92120367.5

申请日：1992-11-28

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Fukutomi, Naoki ,  Nakayama, Hajime ,  Tsubomatsu, Yoshiaki ,  Kaitou, Kouichi ,  Yoshidomi, Yasunobu ,  Takahashi, Yoshihiro

IPC: H05K3/00 ,  H05K3/06

CPC classification number: H05K3/428 ,  H05K3/04 ,  H05K3/205 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10S29/016 ,  Y10T29/49156 ,  Y10T29/49158

Abstract: A wiring board is fabricated through the following steps:

(A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal;
(B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal;
(C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and
(D) etching off the carrier metal foil and the thin layer at desired parts thereof.

Abstract translation: 通过以下步骤制造布线板：（A）在由第一金属制成的细长载体金属箔的一侧上形成具有蚀刻条件不同于第一金属的第二金属的薄层; （B）在所述薄层的表面上形成具有蚀刻条件不同于所述第二金属的第三金属的所需布线图案; （C）将所述载体金属箔叠置在所述布线图案的一侧位于绝缘基板上，由此所述布线图案嵌入所述绝缘基板中; 和（D）在其所需部分刻蚀载体金属箔和薄层。 ð

公开(公告)号：EP2213148A4

公开(公告)日：2011-09-07

申请号：EP08837045

申请日：2008-10-08

Applicant: TESSERA INC

Inventor： HABA BELGACEM ,  OGANESIAN VAGE ,  ENDO KIMITAKA

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/24226 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces 132, 134. A plurality of conductive protrusions 112 can extend upwardly from the plane defined by the first metal layer 102 through the dielectric layer 116. The conductive protrusions 112 can have top surfaces 126 at a first height 115 above the first metal layer 132 which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias 128 can extend from the top surfaces 126 of the protrusions 112 to connect the protrusions 112 with the second metal layer.

Abstract translation: 互连元件130可以包括具有顶面116b和远离顶面的底面116a的电介质层116，限定沿着底面延伸的平面的第一金属层和沿着顶面延伸的第二金属层。 第一或第二金属层之一或两者可以包括多个导电迹线132,134。多个导电突起112可以从由第一金属层102限定的平面向上延伸穿过电介质层116.导电 突起112可以具有在第一金属层132上方的第一高度115处的顶表面126，其可以大于电介质层的高度的50％。 多个导电通孔128可以从突起112的顶表面126延伸，以将突起112与第二金属层连接。

公开(公告)号：EP2172089A4

公开(公告)日：2011-08-10

申请号：EP08779797

申请日：2008-06-23

Applicant: TESSERA INC

Inventor： HABA BELGACEM

IPC: H05K3/46

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0384 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming contacts for an interconnection element, includes (a) joining a conductive element to an interconnection element having multiple wiring layers, (b) patterning the conductive element to form conductive pins, and (c) electrically interconnecting the conductive pins with conductive features of the interconnection element. A multiple wiring layer interconnection element having an exposed pin interface, includes an interconnection element having multiple wiring layers separated by at least one dielectric layer, the wiring layers including a plurality of conductive features exposed at a first face of the interconnection element, a plurality of conductive pins protruding in a direction away from the first face, and metal features electrically interconnecting the conductive features with the conductive pins.

公开(公告)号：EP2213148A2

公开(公告)日：2010-08-04

申请号：EP08837045.7

申请日：2008-10-08

Applicant: Tessera, Inc.

Inventor： HABA, Belgacem ,  OGANESIAN, Vage ,  ENDO, Kimitaka

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/24226 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces 132, 134. A plurality of conductive protrusions 112 can extend upwardly from the plane defined by the first metal layer 102 through the dielectric layer 116. The conductive protrusions 112 can have top surfaces 126 at a first height 115 above the first metal layer 132 which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias 128 can extend from the top surfaces 126 of the protrusions 112 to connect the protrusions 112 with the second metal layer.

公开(公告)号：EP1830611A1

公开(公告)日：2007-09-05

申请号：EP05807092.1

申请日：2005-11-18

Applicant: Multi, Inc. ,  Toyo Kohan Co., Ltd.

Inventor： WATANABE, Mitsuhiro ,  SAIJO, Kinji, Toyo Kohan Co., Ltd. ,  OHSAWA, Shinji, Toyo Kohan Co., Ltd. ,  YOSHIDA, Kazuo, Toyo Kohan Co., Ltd. ,  NANBU, Koji, Toyo Kohan Co., Ltd.

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/06 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/427 ,  H05K1/0265 ,  H05K1/116 ,  H05K3/062 ,  H05K3/20 ,  H05K3/4658 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/09736 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/1476 ,  Y10T156/10

Abstract: To provide a printed wiring board and a method for manufacturing the printed wiring board in which circuit widths of a signal transmission circuit and a power supply circuit or the like, which conventionally require to have greatly different circuit widths, are close to each other as much as possible and substantial miniaturization can be achieved. In order to achieve this object, a printed wiring board obtained by etching a metal-clad laminate including a conductive layer and an insulating layer is employed, in which a first circuit and a second circuit having different thicknesses formed in a same reference plane coexist. In addition, it is characterized in that a thicker circuit of the first circuit or the second circuit has a clad-like configuration in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked. Further, a manufacture of the printed wiring board is characterized in that a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked is a start material, and selective etching characteristic between the different kind of metal layer and the copper layer is effectively utilized.

Abstract translation: 为了提供印刷电路板和制造印刷电路板的方法，其中传统上需要具有大大不同的电路宽度的信号传输电路和电源电路等的电路宽度彼此接近 并且可以实现实质的小型化。 为了实现该目的，采用通过蚀刻包括导电层和绝缘层的覆金属层压板获得的印刷线路板，其中形成在相同参考平面中的具有不同厚度的第一电路和第二电路共存。 此外，其特征在于，第一电路或第二电路的较厚电路具有层叠结构，其中第一铜层/不同种类的金属层/第二铜层三层依次层叠。 此外，印刷布线板的制造的特征在于，其中顺序层叠有三层第一铜层/不同种类的金属层/第二铜层的复合材料是起始材料，并且具有选择性蚀刻特性 在不同种类的金属层和铜层之间有效地利用。

公开(公告)号：EP0926267B1

公开(公告)日：2003-10-15

申请号：EP98310604.8

申请日：1998-12-22

Applicant: Ford Motor Company

Inventor： Achari, Achyuta ,  Li, Delin

IPC: C23F1/36

CPC classification number: H05K3/062 ,  C23F1/36 ,  H05K3/067 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376

公开(公告)号：EP1006765A3

公开(公告)日：2003-01-08

申请号：EP99309654.4

申请日：1999-12-01

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R.

IPC: H05K3/46

CPC classification number: H05K3/4685 ,  H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: A multi-layer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic fortifying layers (52,54) to mechanically and/or electrically fortify the circuit. A preferred embodiment includes air bridge structures (90) having generally T-shaped cross-sections (99), which provide strengthened, mechanically robust air bridges (33) which are especially resistant to damage from flexure and displacement due to physical impact, bending, thermal excursions, and the like.