公开(公告)号：KR1020100070054A

公开(公告)日：2010-06-25

申请号：KR1020080128645

申请日：2008-12-17

Applicant: 한화테크윈 주식회사

Inventor： 이수봉

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/116 ,  H05K3/429 ,  H05K2201/0939 ,  H05K2201/10734

Abstract: PURPOSE: A circuit board and a manufacturing method thereof are provided to prevent the deflection of a ball land by forming a plating layer inside a via hole. CONSTITUTION: A circuit board(100) comprises a substrate(101), a conductive layer(130), a ball land(140), and a plating layer(150). The substrate is made of insulating materials. The ball land is formed on the substrate. The via hole passes through the substrate in order to correspond to the ball land. The plating layer is formed inside the via hole. The plating layer is contact with the ball land. The conductive layer is formed on the inner surface of the via hole. The conductive layer is contacted with the plating layer and the substrate. The plating layer includes one selected from a group made of Cu, Ni, Cr, and Au.

Abstract translation: 目的：提供一种电路板及其制造方法，以通过在通孔内形成镀层来防止球台的偏转。 构成：电路板（100）包括基板（101），导电层（130），球台（140）和镀层（150）。 基板由绝缘材料制成。 球面形成在基板上。 通孔穿过基板以对应于球面。 电镀层形成在通孔内。 镀层与球面接触。 导电层形成在通孔的内表面上。 导电层与镀层和基底接触。 镀层包括选自由Cu，Ni，Cr和Au组成的组中的一种。

公开(公告)号：EP2867905B1

公开(公告)日：2017-02-08

申请号：EP13731720.2

申请日：2013-06-19

Applicant: BSH Hausgeräte GmbH

Inventor： KOVACIC, Peter ,  ZAGER, Igor

IPC: H05K3/40 ,  H05K1/16 ,  H01C10/50 ,  H01C10/48 ,  H01H19/58

CPC classification number: H01C10/48 ,  H01C10/50 ,  H01H19/585 ,  H05K1/167 ,  H05K3/4007 ,  H05K2201/0939

公开(公告)号：EP2903399A4

公开(公告)日：2016-07-27

申请号：EP12885910

申请日：2012-09-26

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： SHIMIZU RYOICHI ,  IWAMOTO MITSUO ,  TODA MITSUAKI

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

公开(公告)号：EP2867905A1

公开(公告)日：2015-05-06

申请号：EP13731720.2

申请日：2013-06-19

Applicant: BSH Hausgeräte GmbH

Inventor： KOVACIC, Peter ,  ZAGER, Igor

IPC: H01C10/48 ,  H01C10/50 ,  H01H19/58 ,  H05K1/16

CPC classification number: H01C10/48 ,  H01C10/50 ,  H01H19/585 ,  H05K1/167 ,  H05K3/4007 ,  H05K2201/0939

Abstract: The invention relates to a kitchen appliance for processing foodstuffs, with an electric motor and a controller module (10) for the electric motor, wherein the controller module (10) has a circuit board (12) for electrical and/or electronic components (14), and wherein the circuit board (12) has at least one first and one second contact pole (15, 16), which cooperate with a switching bridge (20) to control the electric motor, wherein the contact poles (15, 16) are elongated in shape and run in parallel at least in certain sections.

公开(公告)号：EP1098555A3

公开(公告)日：2005-04-13

申请号：EP00309666.6

申请日：2000-11-01

Applicant: CANON KABUSHIKI KAISHA

Inventor： Otaki, Toru ,  Inagawa, Hideho ,  Osaka, Toru

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H05K2201/09227 ,  H05K2201/09336 ,  H05K2201/0939 ,  H05K2201/09627 ,  H05K2201/10734

Abstract: A printed wiring board having assembled thereon a grid array type package, a multi-terminal device with many terminals arranged in matrix, is provided, through first signal connection holes, signal lines, and second connection holes, with many numbers of lands divided into plural blocks, being arranged in matrix on a first layer to connect each terminal of the multi-terminal device correspondingly, signal line patterns connected with many lands, and drawn out in the same direction per block, and first signal patterns from lands positioned on the innermost line of many lands. Then, the wiring patterns of the signal lines are drawn out regularly from many lands formed in matrix on the assembling surface of the grid array type package to make it easier for the printed wiring board to effectuate wiring connections without making them complicated or increasing the number of layers of the printed wiring board. Also, with the provision of ground patterns that surround signal lines, it is made possible to reduce unwanted radiation, as well as to suppress the occurrence of malfunctions of electronic equipment due to reflections and ground bounces.

公开(公告)号：EP1098555A2

公开(公告)日：2001-05-09

申请号：EP00309666.6

申请日：2000-11-01

Applicant: CANON KABUSHIKI KAISHA

Inventor： Otaki, Toru ,  Inagawa, Hideho ,  Osaka, Toru

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H05K2201/09227 ,  H05K2201/09336 ,  H05K2201/0939 ,  H05K2201/09627 ,  H05K2201/10734

Abstract: A printed wiring board having assembled thereon a grid array type package, a multi-terminal device with many terminals arranged in matrix, is provided, through first signal connection holes, signal lines, and second connection holes, with many numbers of lands divided into plural blocks, being arranged in matrix on a first layer to connect each terminal of the multi-terminal device correspondingly, signal line patterns connected with many lands, and drawn out in the same direction per block, and first signal patterns from lands positioned on the innermost line of many lands. Then, the wiring patterns of the signal lines are drawn out regularly from many lands formed in matrix on the assembling surface of the grid array type package to make it easier for the printed wiring board to effectuate wiring connections without making them complicated or increasing the number of layers of the printed wiring board. Also, with the provision of ground patterns that surround signal lines, it is made possible to reduce unwanted radiation, as well as to suppress the occurrence of malfunctions of electronic equipment due to reflections and ground bounces.

Abstract translation: 通过第一信号连接孔，信号线和第二连接孔，设置有多个阵列型封装的印刷电路板，具有多个端子排列成矩阵状的多端子装置，其中多个焊盘分成多个 块，以矩阵形式布置在第一层上，以相应地连接多终端设备的每个终端，与许多焊盘相连并沿与每块相同的方向拉出的信号线图案，以及位于最内层的焊盘的第一信号图案 许多土地线。 然后，信号线的布线图形从格栅阵列型封装的组装表面上的矩阵形状的多个区域中规则地拉出，使得印刷布线板更容易实现布线连接而不使其复杂或增加数量 的印刷线路板的层。 此外，通过提供环绕信号线的接地图案，可以减少不需要的辐射，并且抑制由于反射和地面反弹而导致的电子设备故障的发生。

公开(公告)号：EP3104671A1

公开(公告)日：2016-12-14

申请号：EP16167926.1

申请日：2016-05-02

Applicant: Joylabz LLC

Inventor： WILCOX, Bryan Randall ,  EDDIE, Todd ,  SILVER, Jay Saul

IPC: H05K1/11 ,  H01R11/30 ,  H01R13/62 ,  H01R12/72 ,  H05K5/00

CPC classification number: H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

Abstract translation: 用于磁耦合的系统和方法。 一个系统包括外部计算设备和具有导电端的连接器。 该系统还包括印刷电路板。 印刷电路板包括与背面相对的连接器侧。 连接器侧具有带孔的接触垫。 印刷电路板还包括位于印刷电路板背面的磁体。 磁体提供磁场，其被配置为向接触接触垫的连接器提供磁力吸引力。 印刷电路板还包括通信终端。 该系统还包括通过连接器和接触垫与印刷电路板通信的电路。

公开(公告)号：EP2903399A1

公开(公告)日：2015-08-05

申请号：EP12885910.5

申请日：2012-09-26

Applicant: Meiko Electronics Co., Ltd.

Inventor： SHIMIZU, Ryoichi ,  IWAMOTO, Mitsuo ,  TODA, Mitsuaki

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

Abstract: In the present invention, in a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component (14) is positioned with reference to a mark (12) formed in a copper layer (4), when an imaginary line extending from a search center (74), which is a center of a search range (72) of a sensor, to an edge side (78) of the search range (72) is represented as a search reference line (80) and an imaginary line extending, in a state in which a mark center (76), which is the center of the mark (12), is matched with the search center (74), from the mark center (76) in the same direction as the search reference line (80) and to an outer ridgeline (25) of the mark (12) is represented as a mark reference line (82), the mark (12) is formed in a shape in which the outer ridgeline (25) of the mark (12) is present in a position where a length of the mark reference line (82) is in a range of 30% or more of the search reference line (80).

Abstract translation: 在本发明中，在制造方法的标记形成工序的元件基板并入在其中的铜层（4）当虚线形成电子部件（14）被定位成与参考标记（12） 从搜索中心（74），所有这些是一个传感器的搜索范围（72）的中心，在搜索范围的边缘侧（78）延伸（72）被表示为搜索基准线（80）和在 假想延长线，在其中的状态下的标记中心（76），所有这些是标记的中心（12）与搜索中心（74）匹配时，来自在相同的方向上的中心标记（76） 搜索基准线（80）和在所述标记（12）的外脊线（25）被表示为标记参考线（82），标记（12）的形状被形成，其中所述外棱线（25）的 标记（12）是存在于一个位置，其中标记参考线（82）的长度的范围内的搜索基准线（80）的30％或更多。

公开(公告)号：EP2566307A2

公开(公告)日：2013-03-06

申请号：EP12005825.0

申请日：2012-08-10

Applicant: Eppendorf AG

Inventor： Reichmuth, Burkardt

IPC: H05K1/02 ,  B01L3/02 ,  G01F11/02 ,  H05K1/03

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument (200) with a cable holding space (185) in which a printed circuit board cable device (100) is arranged, more particularly to a dispenser or a pipette. The printed circuit board cable device has at least one printed circuit board (102), which has a first and a second side of the board, and, arranged in succession, at least one first printed circuit board section (A), at least one second printed circuit board section (B) and at least one third printed circuit board section (C), with the printed circuit board having a number of conductor tracks (121,122) which, at least in sections, are arranged parallel with respect to one another on the printed circuit board and extend from a first track section, which is arranged in the first printed circuit board section, via the second printed circuit board section to the third printed circuit board section, in which a second track section is arranged, wherein, in the second printed circuit board section, at least one conductor track (121a, 122a) is arranged on the first side of the board and at least one conductor track (121b, 122b) is arranged on the second side of the board.

Abstract translation: 本发明涉及具有电缆保持空间（185）的实验室样品仪器（200），其中布置有印刷电路板电缆装置（100），更具体地涉及一种分配器或移液器。 所述印刷电路板电缆装置具有至少一个印刷电路板（102），所述印刷电路板具有所述板的第一和第二侧，并且依次配置有至少一个第一印刷电路板部分（A），至少一个 第二印刷电路板部分（B）和至少一个第三印刷电路板部分（C），其中印刷电路板具有多个导体轨道（121,122），其至少部分地相对于彼此平行布置 在印刷电路板上并且经由第二印刷电路板部分从布置在第一印刷电路板部分中的第一轨道部分延伸到布置有第二轨道部分的第三印刷电路板部分， 在第二印刷电路板部分中，至少一个导体轨道（121a，122a）布置在板的第一侧上，并且至少一个导体轨道（121b，122b）布置在板的第二侧上。

公开(公告)号：EP0715489A2

公开(公告)日：1996-06-05

申请号：EP95308025.6

申请日：1995-11-09

Applicant: NCR International, Inc.

Inventor： König, Walter (NMI) ,  Mödl, Albert (NMI) ,  Baur, Peter Franz

IPC: H05K3/36 ,  H01R23/72

CPC classification number: H01R13/2414 ,  H01R12/52 ,  H01R12/714 ,  H01R13/658 ,  H05K1/117 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: A printed circuit board assembly includes two-dimensional arrays of connectors (14,16) to provide significantly higher data transfer rates than typical one-dimensionally arranged connectors, without sacrificing board space. The assembly includes a plurality of connection pads (14,16) on each printed circuit board (10,12). A layer of anisotropically conducting material (26) is placed between the connection pads and the boards are held together by fastening screws (28).

Abstract translation: 印刷电路板组件包括连接器（14,16）的二维阵列，以提供比典型的一维布置的连接器显着更高的数据传输速率，而不牺牲板空间。 组件包括在每个印刷电路板（10,12）上的多个连接焊盘（14,16）。 各向异性导电材料层（26）被放置在连接垫之间，并且板通过紧固螺钉（28）保持在一起。