公开(公告)号：EP1732130A2

公开(公告)日：2006-12-13

申请号：EP06076112.9

申请日：2006-05-26

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/36 ,  H01L25/10

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit assembly (10,110,210,310,410) containing a surface mount (SM) IC package (14) wire bonded to a substrate (12) and configured to conduct heat from the package (14) into a heat sink (18) through a heat-conducting member (16) instead of the substrate (12). The package (14) contains an IC device (20) with input/output pads (22) on a surface (32) thereof that are connected with leads (38) to conductors on the substrate (12). The heat sink (18) is located adjacent the package (14) so as not to be separated from the package (14) by the substrate (12). The heat-conducting member (16) is positioned adjacent the surface (34) of the device (20) opposite its input/output pads (22), and is bonded to the device (20) and heat sink (18) to provide a heat path between the package (14) and heat sink (18) that does not pass through the substrate (12).

Abstract translation: 一种电路组件（10,110,210,310,410），其包含结合到基板（12）的表面安装（SM）IC封装（14）引线，并被配置为通过导热部件将热量从封装（14）传导到散热器（18） （16）代替衬底（12）。 封装（14）包含IC器件（20），其在其表面（32）上具有与引线（38）连接到衬底（12）上的导体的输入/输出焊盘（22）。 散热器（18）位于封装（14）附近，以便不被基板（12）与封装（14）分离。 导热构件（16）邻近装置（20）的与其输入/输出垫（22）相对的表面（34）定位，并且结合到装置（20）和散热器（18）以提供 封装（14）和不通过基板（12）的散热器（18）之间的热路径。

公开(公告)号：EP1681765A2

公开(公告)日：2006-07-19

申请号：EP05078000.6

申请日：2005-12-27

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A.

IPC: H03G3/30

CPC classification number: H03G3/3005 ,  H04S7/00 ,  H04S2400/13

Abstract: An audio volume control system (10) including a plurality of audio signal sources (12) each configured to generate an audio signal (14), and a controller (16) configured to retrieve a stored volume setting for each audio signal source (12) and control the output volume level of an output device (18) in response to the stored volume setting.

公开(公告)号：EP1622199A3

公开(公告)日：2006-03-15

申请号：EP05076556.9

申请日：2005-07-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Wilkinson, Lester ,  Gerbsch, Erich W.

IPC: H01L23/46 ,  H01L23/473

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels (14), one or more inlet ports (38) for supplying liquid coolant to the micro-channels (14), and one or more outlet ports (40) for exhausting coolant that has passed through the micro-channels (14). The semiconductor device (10) is mounted on a single or multi-layer circuit board (44) having electrical and fluid interconnect features that mate with the electrical terminals (12a, 12b) and inlet and outlet ports (38, 40) of the device (10) to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：EP1622436A2

公开(公告)日：2006-02-01

申请号：EP05076530.4

申请日：2005-07-05

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Degenkolb, Thomas A.

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H01G9/012 ,  H05K2201/10651 ,  H05K2201/10757 ,  Y02P70/613

Abstract: A surface mountable axial leaded component (100) including a component body (102), a first component lead (104A) and a second component lead (104B). The first component lead (104A) extends from a first end of the component body (102) and a second component lead (104B) extends from a second end of the component body (102) that is opposite the first end. A portion of the first and second component leads (104A,104B) is formed in a loop and a diameter of the loop is at least equal to the diameter of the component body (102). The loop may be formed as a circular loop, an elliptical loop, a polygon loop, a square loop or rectangular loop, among other loop configurations. When formed as a circular loop, the loop may include a flat segment.

Abstract translation: 一种表面安装的轴向引线元件（100），包括元件主体（102），第一元件引线（104A）和第二元件引线（104B）。 第一部件引线（104A）从部件主体（102）的第一端延伸，并且第二部件引线（104B）从与第一端相对的部件主体（102）的第二端延伸。 第一和第二部件引线（104A，104B）的一部分形成为环形，并且环的直径至少等于部件主体（102）的直径。 环路可以形成为圆环，椭圆环，多边形环，矩形环或矩形环，以及其他环路配置。 当形成为圆形环时，环可以包括平坦段。

公开(公告)号：EP1589795A1

公开(公告)日：2005-10-26

申请号：EP05075795.4

申请日：2005-04-06

Applicant: Delphi Technologies, Inc.

Inventor： Sarma, Dwadasi H. ,  Heytens, Rhonda J. ,  Berlin, Carl W. ,  Fairchild, Ray M. ,  Myers, Bruce A. ,  Ward, Daniel K.

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H01L23/15 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (30) that makes use of a low-temperature co-fired ceramic (LTCC) substrate (10), and a process for producing the assembly (30). The substrate (10) contains at least first and second regions (32,34) formed by a plurality of first ceramic layers (36) and at least one second ceramic layer (38), respectively, that are superimposed and bonded to each other. Conductor lines (22) are present on at least some of the first ceramic layers (36) so as to be between adjacent pairs of the layers (36). Electrically-conductive vias (16) electrically interconnect the conductor lines (22) on different first ceramic layers (36), and a surface-mount IC device (12) is mounted to the substrate (10). The first ceramic layers (36) are formed of electrically-nonconductive materials, while the one or more second ceramic layers (38) contain thermally-conductive particles dispersed in a matrix of electrically-nonconductive materials, such that the one or more second ceramic layers (38) are more thermally conductive than the first ceramic layers (36).

Abstract translation: 使用低温共烧陶瓷（LTCC）基板（10）的电路板组件（30）和用于制造组件（30）的工艺。 衬底（10）至少包含由多个第一陶瓷层（36）和至少一个第二陶瓷层（38）形成的第一和第二区域（32,34），它们彼此叠加并结合。 导体线（22）存在于至少一些第一陶瓷层（36）上，以便在相邻的层（36）之间。 导电通孔（16）将不同第一陶瓷层（36）上的导体线（22）电互连，并且表面安装IC器件（12）安装到基板（10）。 第一陶瓷层（36）由非导电材料形成，而一个或多个第二陶瓷层（38）包含分散在非导电材料的基体中的导热颗粒，使得一个或多个第二陶瓷层 （38）比第一陶瓷层（36）更加导热。

公开(公告)号：EP1463104A2

公开(公告)日：2004-09-29

申请号：EP04075831.0

申请日：2004-03-15

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A. ,  Myers, Bruce A.

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01R13/504 ,  H01R13/665 ,  H01R43/24 ,  H05K3/0058 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: An overmolded electronic package (100, 200, 300, 400, 500) includes a circuit-carrying substrate (24) and a connector housing (14) or shroud (14') interconnected via a suitable interconnection arrangement (20, 32, 34; 20' 32, 320). Some embodiments may include a backplate (12) affixed to the substrate (24) and, in some cases, also to the connector housing (14) or shroud (14'). In some embodiments, the connector housing (14) or shroud (14') may be affixed to the substrate (12), and in any case the entire subassembly of components is overmolded with a rigidly formable molding compound (110) to bond together all components of the subassembly and form the overmolded electronic package (100, 200, 300, 400, 500). The subassembly of components with the exception of the backplate (12) may alternatively be overmolded with the molding compound (110), and a backplate (12) thereafter affixed to the subassembly via a compliant bonding medium (402).

Abstract translation: 包覆成型的电子封装（100，200，300，400，500）包括一个电路承载基板（24）和一个连接器壳体（14）或通过合适的互连装置（20，32，34相互连接罩（14“）; 20 '32，320）。 一些实施例可包括固定到基板（24），并且在一些情况下，后板（12），即在连接器壳体（14）或护罩（14“）。 在一些实施例中，连接器壳体（14）或护罩（14“）可以固定到基板（12），并且在任何情况下，组件的整个子组件是包覆模制有一个刚性地成形模塑料（110）粘结在一起的所有 子组件和部件形成所述包覆成型的电子封装（100，200，300，400，500）。 与所述背板（12）的异常部件的子组件可替换地与模制化合物（110）和背板（12）之后经由柔性接合装置（402）附连到子组件包覆模制。

公开(公告)号：EP1291912A2

公开(公告)日：2003-03-12

申请号：EP02078469.0

申请日：2002-08-21

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Brandenburg, Scott D. ,  Tsai, Jeenhuei S.

IPC: H01L23/31

CPC classification number: H01L21/563 ,  H01L23/3107 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15151

Abstract: An overmolded circuit board assembly (30,50) and a method for forming the assembly (30,50). The assembly (30,50) and method entail overmolding both surfaces of a circuit board (12,42,62,82) and underfilling at least one surface-mount circuit device (14,44,64,84) attached to at least one surface of the board (12,42,62,82) with solder bump connections (18,48), with the result that the circuit device (14,44,64,84) is spaced above the surface of the circuit board (12,42,62,82) so as to define a gap (22,52,72,92) therebetween. The circuit board assembly (30,50) further comprises a cavity (20,50,70,90), such as a blind hole (30) or closed through-hole (50,70,90), defined in the surface of the circuit board (12,42,62,82) beneath the circuit device (14,44,64,84), such that the cavity (20,50,70,90) communicates with the gap (22,52,72,92) between the circuit board (12,42,62,82) and device (14,44,64,84), but is closed off from the opposite surface of the circuit board (12,42,62,82). As a result of the presence of the cavity (20,50,70,90), air that becomes trapped in the gap (22,52,72,92) by a molding material (16,46) during the overmolding/underfilling process is collected and compressed within the cavity (20,50,70,90), yielding a void-free underfill between the circuit board (12,42,62,82) and

Abstract translation: 包覆成型的电路板组件（30,50）和用于形成组件（30,50）的方法。 组件（30,50）和方法包括模制电路板（12,42,62,82）的两个表面，并且底部填充至少一个附接到至少一个的表面安装电路装置（14,44,64,84） 具有焊料凸块连接（18,48）的板（12,42,62,82）的表面，结果电路器件（14,44,64,84）在电路板（12）的表面上方间隔开 ，42,42,82），以便在它们之间限定间隙（22,52,72,92）。 电路板组件（30,50）还包括空腔（20,50,70,90），例如盲孔（30）或闭合通孔（50,70,90），其限定在 在电路装置（14,44,64,84）下面的电路板（12,42,62,82），使得空腔（20,50,70,90）与间隙（22,52,72,92）连通 ）与电路板（12,42,62,82）之间的电路板（12,42,62,82）的相对表面封闭。 由于空腔（20,50,70,90）的存在，在包覆成型/底部填充过程期间被模制材料（16,46）捕获在间隙（22,52,72,92）中的空气 在腔（20,50,70,90）内收集和压缩，在电路板（12,42,62,82）和之间产生无空隙的底部填充物