公开(公告)号：DE102014109609A1

公开(公告)日：2015-01-15

申请号：DE102014109609

申请日：2014-07-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUSSERLECHNER UDO ,  DANGELMAIER JOCHEN ,  STEINER RAINER ,  STRUTZ VOLKER

IPC: H01L23/18 ,  G01R15/20 ,  G01R19/00 ,  H01L21/50 ,  H01L23/02 ,  H01L23/488 ,  H01L43/02

Abstract: Eine Stromsensorvorrichtung weist ein Gehäuse mit einem Hohlraum und einen fest an dem Gehäuse montierten Leiter auf. Ein Halbleiterchip, der dafür ausgelegt ist, ein Magnetfeld zu erfassen, ist in dem Hohlraum angeordnet. Ein elektrisch isolierendes Medium ist dafür ausgelegt, den Hohlraum des Gehäuses zumindest teilweise zu füllen.

公开(公告)号：DE102006015241A1

公开(公告)日：2007-06-28

申请号：DE102006015241

申请日：2006-03-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  STRUTZ VOLKER

IPC: H01L23/50 ,  H01L21/60

Abstract: Component has a plastic housing (7) and outer contacts (8), which are embedded in the housing. The contacts are accessible on a lower side of the housing, and are arranged in the lower border angle region. An expansion joint (14) is arranged in the lower side of the plastic housing. The joint is provided between the border angle region and the outer contact surfaces (11) of the outer contact and a central region (12) of the housing. A semiconductor chip is arranged in the central region. An independent claim is also included for: a method for manufacturing a semiconductor component.

公开(公告)号：DE102004019724A1

公开(公告)日：2005-08-04

申请号：DE102004019724

申请日：2004-04-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/065 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14

Abstract: Memory module (1) comprises circuit board (2) with region (R), which experiences highest deformation on circuit board bending, which carries semiconductor components (3). On stressed region is fitted at least one further semiconductor component (4), e.g. logic integrated circuit.Mechanical bracing element is located in stressed region of circuit board, either at front side of circuit board, or at its rear side under further semiconductor component. INDEPENDENT CLAIM is included for computer system incorporating inventing memory module.

公开(公告)号：DE10045534B4

公开(公告)日：2005-03-17

申请号：DE10045534

申请日：2000-09-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STRUTZ VOLKER ,  GEBAUER UTA

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H05K3/32

Abstract: The invention relates to an electronic component with external connection elements and to a method of electrically connecting and/or fixing an electronic component to a printed-circuit board. For this purpose, the electronic component has capillary elements as external connection elements, which are connected to contact connection areas of a leadframe or to contact areas of a chip. The capillary element protrudes out of the electronic component and has, on its protruding end, a suction opening with capillary action.

公开(公告)号：DE10135393A1

公开(公告)日：2003-02-27

申请号：DE10135393

申请日：2001-07-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GEBAUER UTA ,  STRUTZ VOLKER ,  HEDLER HARRY

IPC: B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  H01L23/50 ,  H01L21/58

Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

公开(公告)号：DE10021859A1

公开(公告)日：2001-11-15

申请号：DE10021859

申请日：2000-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  NEU ACHIM ,  BAUER MONIKA ,  STRUTZ VOLKER ,  POHL JENS

IPC: H01L23/498 ,  H05K3/40 ,  H05K1/02 ,  H05K3/30

Abstract: Printed circuit board (1) comprises a conductor layer containing a bond window (5) with a conducting pathway (8). The conducting pathway has a conducting region (11) with a conducting body (14) in the region of the bond window. The conducting body has the same bending resistance moments in two directions running vertical to the conducting pathway axis. The conducting pathway has a region (12) for connecting to the bond pad of a semiconductor component. An Independent claim is also included for a process for the production of a printed circuit board. Preferred Features: The conducting body is parallelepiped or cylindrical and has a copper core region, an upper copper casing region and a lower copper casing region.