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公开(公告)号:JP2005018086A
公开(公告)日:2005-01-20
申请号:JP2004235722
申请日:2004-08-13
Inventor: IWAZAWA HARUO , KAJITA TORU , IWANAGA SHINICHIRO
IPC: G03F7/039 , G03F7/032 , H01L21/027
Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition as a chemically amplified resist, which is, in particular, excellent in resolution for a contact hole as well as excellent in transparency for radiation, dry etching durability, pattern profile, sensitivity, resolution or the like. SOLUTION: The radiation-sensitive resin composition contains: (A) a resin having an alicyclic skeleton in the main chain and/or the side chain; (B) a resin having ≥60 %/μm transmittance for radiation at 100 to 300 nm wavelength; and (C) a radiation-sensitive acid generating agent. At least one of the component (C) and the component (B) contains an acid-cleaving group. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题:提供作为化学增幅抗蚀剂的辐射敏感性树脂组合物,特别是对于接触孔的分辨率优异,以及辐射透明度优异,干蚀刻耐久性,图案图 ,灵敏度,分辨率等。 解决方案:辐射敏感性树脂组合物含有:(A)主链和/或侧链具有脂环骨架的树脂; (B)100〜300nm波长的辐射透射率≥60%的树脂; 和(C)辐射敏感性酸产生剂。 组分(C)和组分(B)中的至少一种含有酸裂解基团。 版权所有(C)2005,JPO&NCIPI
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公开(公告)号:DE69733164T2
公开(公告)日:2006-02-16
申请号:DE69733164
申请日:1997-02-07
Applicant: JSR CORP
Inventor: SUWA MITSUHITO , KAJITA TORU , IWANAGA SHIN-ICHIRO , OTA TOSHIYUKI
Abstract: A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.
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公开(公告)号:DE69728366T2
公开(公告)日:2005-02-24
申请号:DE69728366
申请日:1997-12-12
Applicant: JSR CORP
Inventor: SUWA MITSUHITO , IWASAWA HARUO , KAJITA TORU , IWANAGA SHIN-ICHIRO
Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.
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公开(公告)号:DE69736024T2
公开(公告)日:2006-11-23
申请号:DE69736024
申请日:1997-02-07
Applicant: JSR CORP
Inventor: SUWA MITSUHITO , KAJITA TORU , IWANAGA SHIN-ICHIRO , OTA TOSHIYUKI
Abstract: A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.
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公开(公告)号:DE60143178D1
公开(公告)日:2010-11-18
申请号:DE60143178
申请日:2001-06-15
Inventor: NISHIMURA YUKIO , YAMAHARA NOBORU , YAMAMOTO MASAFUMI , KAJITA TORU , SHIMOKAWA TSUTOMU , ITO HIROSHI
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公开(公告)号:SG125883A1
公开(公告)日:2006-10-30
申请号:SG200004850
申请日:2000-09-16
Applicant: JSR CORP
Inventor: DOUKI KATSUJI , MURATA KIYOSHI , ISHII HIROYUKI , KAJITA TORU , SHIMOKAWA TSUTOMU
Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.
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公开(公告)号:DE60025297T2
公开(公告)日:2006-08-17
申请号:DE60025297
申请日:2000-09-14
Applicant: JSR CORP
Inventor: DOUKI KATSUJI , MURATA KIYOSHI , ISHII HIROYUKI , KAJITA TORU , SHIMOKAWA TSUTOMU
Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.
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公开(公告)号:DE60025297D1
公开(公告)日:2006-03-30
申请号:DE60025297
申请日:2000-09-14
Applicant: JSR CORP
Inventor: DOUKI KATSUJI , MURATA KIYOSHI , ISHII HIROYUKI , KAJITA TORU , SHIMOKAWA TSUTOMU
Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.
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公开(公告)号:DE69728366D1
公开(公告)日:2004-05-06
申请号:DE69728366
申请日:1997-12-12
Applicant: JSR CORP
Inventor: SUWA MITSUHITO , IWASAWA HARUO , KAJITA TORU , IWANAGA SHIN-ICHIRO
Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.
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公开(公告)号:DE69220257T3
公开(公告)日:2002-06-13
申请号:DE69220257
申请日:1992-01-24
Applicant: JSR CORP
Inventor: KAJITA TORU , OTA TOSHIYUKI , YUMOTO YOSHIJI , MIURA TAKAO
Abstract: 1. An i-ray sensitive positive resist composition: which (A) comprises an alkali-soluble novolak resin obtained by subjecting (a) a phenolic mixture of 5 to 95 mol% of 2,3-xylenol with 95 to 5 mol% of a phenol selected from mon-, di- and tri-methyl phenols other than 2,3-xylenol or (b) a phenolic mixture of 5 to 50 mol% of 3,4-xylenol with 95 to 50 mol% of a phenol selected from mono-, di- and trimethyl phenols other than 3,4-xylenol to polycondensation together with an aldehyde, and a 1,2-quinonediazide compound, and (B) which has sensitivity to i-ray. There is also provided a method of forming a pattern, which comprises: (1) applying the i-ray sensitive positive resist composition to a wafer to form a photosensitive layer, (2) irradiating the photosensitive layer with i-ray through a predetermined pattern, and (3) developing the pattern with a developer.
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