公开(公告)号：EP1317399A2

公开(公告)日：2003-06-11

申请号：EP01970902.1

申请日：2001-09-14

Applicant: MCNC

Inventor： GOODWIN-JOHANSSON, Scott, H. ,  MCGUIRE, Gary, E.

IPC: B81B3/00 ,  F16J3/02 ,  F15C5/00

CPC classification number: F16K99/0001 ,  B81B3/0021 ,  B81B2201/054 ,  B81B2203/0127 ,  B81B2203/04 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0028 ,  F16K99/0051 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2059/0081

Abstract: A MEMS valve device driven by electrostatic forces is provided. The MEMS valve device includes a substrate having an aperture formed therein, a substrate electrode, a moveable membrane that overlies the aperture and has an electrode element and a biasing element. Additionally, at least one resiliently compressible dielectric layer is provided to insure electrical isolation between the substrate electrode and electrode element of the moveable membrane. In operation, a voltage differential is established between the substrate electrode and the electrode element of the moveable membrane to move the membrane relative to the aperture to thereby controllably adjust the portion of the aperture that is covered by the membrane. In another embodiment the resiliently compressible dielectric layer(s) have a textured surface; either at the valve seat, the valve seal or at both surfaces. In another embodiment of the invention a pressure-relieving aperture is defined within the substrate and is positioned to underlie the moveable membrane.

公开(公告)号：EP0954450A4

公开(公告)日：2000-03-22

申请号：EP98904706

申请日：1998-01-23

Applicant: CALIFORNIA INST OF TECHN

Inventor： TAI YU-CHONG ,  XING YANG ,  GROSJEAN CHARLES

IPC: B81B3/00 ,  F15C5/00 ,  F16K99/00 ,  B44C1/22 ,  F16K31/12

CPC classification number: F16K99/0001 ,  B81B2201/054 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00158 ,  F15C5/00 ,  F16K99/0015 ,  F16K99/0044 ,  F16K99/0061 ,  F16K2099/0074 ,  F16K2099/008

公开(公告)号：EP0674181A3

公开(公告)日：1997-02-05

申请号：EP95104148.2

申请日：1995-03-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Shiomi, Hiromu, c/o Itami Works of Sumimoto Elec. ,  Nishibayahi. Yoshiki, c/o Itami Works of Sumimoto ,  Shikata, Shin-ichi, c/o Itami Works of Sumimoto

IPC: G01P15/08 ,  G01L1/18

CPC classification number: G01P15/0802 ,  B81B3/007 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/034 ,  B81B2201/035 ,  B81B2201/054 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00682 ,  B81C2201/0109 ,  G01H3/08 ,  G01H11/00 ,  G01H11/06 ,  G01P15/125 ,  G01P2015/0828

Abstract: A micro mechanical component of the present invention comprises a base, and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion is formed from a diamond layer. Thus, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance can be greatly improved as a micro mechanical component processed in a fine shape, from the conventional level. Further, because the drive portion exhibits excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be widely expanded from the conventional range.

公开(公告)号：EP0465229A1

公开(公告)日：1992-01-08

申请号：EP91306015.8

申请日：1991-07-02

Applicant: SEIKO EPSON CORPORATION

Inventor： Kamisuki, Shinichi ,  Nose, Yasuto ,  Shimizu, Nobuo ,  Yotsuya, Shinichi

IPC: F04B43/04 ,  F04B21/02 ,  H01L21/308

CPC classification number: B81B3/0005 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2203/0127 ,  F04B43/046 ,  F04B53/102 ,  H01L21/3083

Abstract: The present invention provides a micropump comprising a silicon substrate (38), which is sandwiched between glass substrates (39, 40) and which is formed with a diaphragm (36) and a valve, the valve including a valve membrane (50) and a valve member (35) for controlling fluid flow through a through-hole (34a) in the valve membrane, the valve member engaging one of the glass substrates. The diaphragm and the valve membrane are disposed closer to the glass substrate engaged by the valve member than to the other glass substrate.

Abstract translation: 本发明提供了一种微型泵，其包括被夹在玻璃基板（39,40）之间并形成有隔膜（36）和阀的硅基板（38），所述阀包括阀膜（50）和阀 用于控制通过阀膜中的通孔（34a）的流体流动的阀构件（35），阀构件接合玻璃基板中的一个。 隔膜和阀膜设置成比与其他玻璃基板接近的与阀构件接合的玻璃基板更靠近。

公开(公告)号：EP2592044B1

公开(公告)日：2014-05-21

申请号：EP11729126.0

申请日：2011-04-25

Applicant: Ikerlan, S. Coop.

Inventor： FERNANDEZ, Luis J. ,  ARANBURU, Iñigo ,  AGIRREGABIRIA, María ,  ELIZALDE, Jorge ,  BERGANZO, Javier ,  RUANO, Jesús ,  LAOUENAN, Florian ,  EZKERRA, Aitor

IPC: B81C3/00 ,  F15C5/00 ,  F16K99/00

CPC classification number: B01L3/5027 ,  B29C65/76 ,  B29C66/028 ,  B29C66/112 ,  B29C66/114 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/73117 ,  B29C66/7352 ,  B29C66/73921 ,  B29L2031/756 ,  B81B2201/054 ,  B81C3/001 ,  B81C2203/032 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0015 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  B29K2023/38

公开(公告)号：EP2298448A2

公开(公告)日：2011-03-23

申请号：EP10181157.8

申请日：2003-09-24

Applicant: California Institute of Technology

Inventor： Maerkl, Sebastian J ,  Thorsen, Todd A ,  Xiaoyan, Bao ,  Quake, Stephen R ,  Studer, Vincent

IPC: B01L3/00 ,  B81B1/00 ,  F15C5/00 ,  B81B3/00

CPC classification number: C12Q1/28 ,  B01L3/5025 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/0214 ,  B81B2201/054 ,  B81B2201/07 ,  B81C1/00119 ,  F15C5/00 ,  F16K11/20 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0318 ,  Y10T137/0329 ,  Y10T137/2224 ,  Y10T137/85938 ,  Y10T137/87249

Abstract: High-density microfluidic chips contain plumbing networks with thousands of micromechanical valves and hundreds of individually addressable chambers. These fluidic devices are analogous to electronic integrated circuits fabricated using large scale integration (LSI). A component of these networks is the fluidic multiplexor, which is a combinatorial array of binary valve patterns that exponentially increases the processing power of a network by allowing complex fluid manipulations with a minimal number of inputs. These integrated microfluidic networks can be used to construct a variety of highly complex microfluidic devices, for example the microfluidic analog of a comparator array, and a microfluidic memory storage device resembling electronic random access memories.

Abstract translation: 高密度微流控芯片包含具有数千个微机械阀门和数百个可单独寻址的腔室的管道网络。 这些流体装置类似于使用大规模集成（LSI）制造的电子集成电路。 这些网络的一个组成部分是流体多路复用器，它是二进制阀模式的组合阵列，通过允许使用最少数量的输入的复杂流体操纵来指数地增加网络的处理能力。 这些集成微流体网络可用于构建各种高度复杂的微流体装置，例如用于隔离异质样品的元件的装置。

公开(公告)号：EP1940549A2

公开(公告)日：2008-07-09

申请号：EP06816407.8

申请日：2006-10-03

Applicant: KIONIX, INC.

Inventor： YOUNG, Lincoln ,  ZHOU, Peng

IPC: B01L3/00 ,  F04B43/04 ,  B32B27/00 ,  F04B53/10

CPC classification number: F16K7/12 ,  B01F5/0683 ,  B01F5/0688 ,  B01F11/0071 ,  B01F13/0059 ,  B01F2215/0034 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0861 ,  B01L2300/0867 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0487 ,  B01L2400/06 ,  B01L2400/0638 ,  B01L2400/0655 ,  B01L2400/084 ,  B29C65/4895 ,  B29C66/004 ,  B29C66/54 ,  B29C66/5412 ,  B29C66/71 ,  B29K2025/00 ,  B29K2025/04 ,  B29K2033/08 ,  B29K2069/00 ,  B29K2101/12 ,  B29L2031/7496 ,  B29L2031/7506 ,  B29L2031/756 ,  B81B3/0021 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2203/0127 ,  B81C1/00103 ,  B81C1/00158 ,  F04B43/028 ,  F04B43/043 ,  F04B43/06 ,  F15C1/08 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0021 ,  F16K99/0034 ,  F16K99/0055 ,  F16K99/0057 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T29/49405 ,  Y10T137/212 ,  Y10T137/2202 ,  Y10T137/2218 ,  Y10T137/8593 ,  Y10T137/85978 ,  Y10T156/1002 ,  Y10T156/1043 ,  B29K2033/12 ,  B29K2025/06

Abstract: Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.

Abstract translation: 塑料微流体结构具有基本上刚性的膜片，其在松弛状态之间起作用，其中隔膜与衬底的表面相抵靠，并且其中隔膜从衬底移开的致动状态。 从下面的描述可以看出，用该隔膜形成的微流体结构提供易于制造和坚固的系统，以及容易制造的部件，例如阀和泵。

公开(公告)号：EP1565932A4

公开(公告)日：2006-09-13

申请号：EP03786769

申请日：2003-11-17

Applicant: SMC KK

Inventor： HARRIS JAMES M ,  PATEL SAPNA

IPC: B81B7/00 ,  B81C99/00 ,  F16K99/00 ,  H01L21/02 ,  H01L21/66 ,  H01L23/544 ,  H01L21/00 ,  H01L21/44

CPC classification number: H01L22/20 ,  B81B7/0012 ,  B81B2201/054 ,  B81B2201/058 ,  B81C99/0045 ,  B81C2203/038 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0034 ,  F16K99/0036 ,  F16K99/0059 ,  F16K2099/0074 ,  H01L21/02071 ,  H01L22/24 ,  H01L22/34

Abstract: A method for producing a corrosion-resistant channel in a wetted path of a silicon device enables such device to be used with corrosive compounds, such as fluorine. A wetted path of a MEMS device is coated (210) with either an organic compound resistant to attack by atomic fluorine or a material capable of being passivated by atomic fluorine. The device is then exposed to a gas that decomposes into active fluorine compounds (220) when activated by a plasma discharge. One example of such a gas is CF4, an inert gas that is easier and safer to work with than volatile gases like CIF3. The gas will passivate the material (if applicable) and corrode any exposed silicon. The device is tested (230) in such a manner that any unacceptable corrosion of the wetted path will cause the device to fail. If the device operates properly, the wetted path is deemed to be resistant to corrosion by fluorine or other corrosive compounds, as applicable.

Abstract translation: 一种用于在硅器件的润湿路径制备耐腐蚀的信道的方法，使与腐蚀性化合物，色彩可以使用这样的装置：诸如氟。 一个MEMS装置的润湿路径涂覆有：（1）以由耐氟原子或攻击有机化合物（2）能够通过氟原子被钝化材料。 然后将该装置暴露于的气体没有分解成活性氟化合物当由等离子体放电激活。 搜索气体的一个例子是CF4，挥发性惰性气体中做更容易，更安全与合作不是像ClF 3的气体。 气体将钝化材料（如果适用的话）和任何腐蚀暴露的硅。 该装置以这样的方式搜索测试所做的润湿路径的任何不可接受的腐蚀将导致器件失效。 如果该设备正常工作，将润湿路径被认为是被氟或其它腐蚀性化合物的耐腐蚀，如适用。

公开(公告)号：EP1565932A2

公开(公告)日：2005-08-24

申请号：EP03786769.4

申请日：2003-11-17

Applicant: Redwood Microsystems, Inc.

Inventor： HARRIS, James, M. ,  PATEL, Sapna

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H01L22/20 ,  B81B7/0012 ,  B81B2201/054 ,  B81B2201/058 ,  B81C99/0045 ,  B81C2203/038 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0034 ,  F16K99/0036 ,  F16K99/0059 ,  F16K2099/0074 ,  H01L21/02071 ,  H01L22/24 ,  H01L22/34

Abstract: A method for producing a corrosion-resistant channel in a wetted path of a silicon device enables such device to be used with corrosive compounds, such as fluorine. A wetted path of a MEMS device is coated (210) with either an organic compound resistant to attack by atomic fluorine or a material capable of being passivated by atomic fluorine. The device is then exposed to a gas that decomposes into active fluorine compounds (220) when activated by a plasma discharge. One example of such a gas is CF4, an inert gas that is easier and safer to work with than volatile gases like CIF3. The gas will passivate the material (if applicable) and corrode any exposed silicon. The device is tested (230) in such a manner that any unacceptable corrosion of the wetted path will cause the device to fail. If the device operates properly, the wetted path is deemed to be resistant to corrosion by fluorine or other corrosive compounds, as applicable.

公开(公告)号：EP1551753A2

公开(公告)日：2005-07-13

申请号：EP03774496.8

申请日：2003-09-24

Applicant: California Institute of Technology

Inventor： MAERKL, Sebastian, J. ,  THORSEN, Todd, A. ,  BAO, Xiaoyan ,  QUAKE, Stephen, R. ,  STUDER, Vincent

IPC: B81B1/00

CPC classification number: C12Q1/28 ,  B01L3/5025 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/0214 ,  B81B2201/054 ,  B81B2201/07 ,  B81C1/00119 ,  F15C5/00 ,  F16K11/20 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0318 ,  Y10T137/0329 ,  Y10T137/2224 ,  Y10T137/85938 ,  Y10T137/87249

Abstract: High-density microfluidic chips contain plumbing networks with thousands of micromechanical valves and hundreds of individually addressable chambers. These fluidic devices are analogous to electronic integrated circuits fabricated using large scale integration (LSI). A component of these networks is the fluidic multiplexor, which is a combinatorial array of binary valve patterns that exponentially increases the processing power of a network by allowing complex fluid manipulations with a minimal number of inputs. These integrated microfluidic networks can be used to construct a variety of highly complex microfluidic devices, for example the microfluidic analog of a comparator array, and a microfluidic memory storage device resembling electronic random access memories.

Abstract translation: 高密度微流控芯片包含具有数千个微机械阀门和数百个可单独寻址的腔室的管道网络。 这些流体装置类似于使用大规模集成（LSI）制造的电子集成电路。 这些网络的一个组成部分是流体多路复用器，它是二进制阀模式的组合阵列，通过允许使用最少数量的输入的复杂流体操纵来指数地增加网络的处理能力。 这些集成的微流体网络可用于构建各种高度复杂的微流体装置，例如比较器阵列的微流体模拟装置和类似于电子随机存取存储器的微流体存储器存储装置。