公开(公告)号：WO2008062975A1

公开(公告)日：2008-05-29

申请号：PCT/KR2007/005802

申请日：2007-11-19

Applicant: LG CHEM, LTD. ,  HAN, Bo-ryeong ,  CHUN, Moon-seok ,  PARK, Do-yeon ,  KIM, Su-kyung ,  KOO, Chong-min ,  LEE, Bum-jae ,  GANG, Choel-han

Inventor： HAN, Bo-ryeong ,  CHUN, Moon-seok ,  PARK, Do-yeon ,  KIM, Su-kyung ,  KOO, Chong-min ,  LEE, Bum-jae ,  GANG, Choel-han

IPC: C08F279/02

CPC classification number: C08F257/02 ,  C08F279/02 ,  C08L51/003 ,  C08L51/04 ,  C08L53/02 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233 ,  C08L2666/24 ,  C08L2666/02

Abstract: The present invention provides a polymer particle and a method of preparing the same. More precisely, the invention provides a polymer particle having optimum impact strength and improved elastic recovery rate by forming the brush having softness on the surface of the monodisperse polymer particle by the anion dispersion polymerization using a conjugated diene monomer.

Abstract translation: 本发明提供一种聚合物颗粒及其制备方法。 更准确地说，本发明通过使用共轭二烯单体的阴离子分散聚合，通过在单分散聚合物颗粒的表面上形成具有柔软性的刷子来提供具有最佳冲击强度和提高弹性回收率的聚合物颗粒。

公开(公告)号：WO2015108025A1

公开(公告)日：2015-07-23

申请号：PCT/JP2015/050619

申请日：2015-01-13

Applicant: デクセリアルズ株式会社

Inventor： 篠原　誠一郎

IPC: H01R11/01 ,  H01B1/20 ,  H01B5/16 ,  H01L21/60 ,  H01R43/00

CPC classification number: G02F1/13452 ,  H01B1/22 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/1426 ,  H01L2924/381 ,  H05K1/181 ,  H05K3/323 ,  H05K3/325 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10734 ,  H05K2203/166 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/066 ,  H01L2924/01006 ,  H01L2924/069 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/06 ,  H01L2924/0615

Abstract: 　回路基板の配線ピッチや電子部品の電極端子がファインピッチ化されても、電子部品と回路基板との導通性を確保するとともに、電子部品の電極端子間におけるショートを防止する。　回路基板（１２）上に異方性導電接着剤（１）を介して電子部品（１８）が接続された接続体（１０）において、異方性導電接着剤（１）は、導電性粒子（４）が規則的に配置され、導電性粒子（４）の粒子径が、電子部品（１８）の接続電極（１９）の高さの１／２以下である。

Abstract translation: 本发明的目的是确保当电路基板或电子部件的电极端子的布线间距被赋予更细的间距并且防止在电极之间发生短路时，在电子部件和电路基板之间存在导电性 电子元件的端子。 本发明提供了一种连接体（10），其具有通过各向异性导电粘合剂（1）设置在电路基板（12）上的电子部件（18），其中各向异性导电粘合剂（1）具有规则地设置在其中的导电颗粒（4） 导电粒子（4）的粒径为电子部件（18）的连接电极（19）的高度的1/2，或更小。

公开(公告)号：WO2006065009A1

公开(公告)日：2006-06-22

申请号：PCT/KR2005/002005

申请日：2005-06-27

Applicant: CHEIL INDUSTRIES INC. ,  JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub

Inventor： JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub

IPC: C08J3/12

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which are used in the mounting field of circuit boards. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

Abstract translation: 这里公开的是各向异性导电粘合剂膜中所含的各向异性导电颗粒，其用于电路板的安装领域。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。

公开(公告)号：WO1995020820A1

公开(公告)日：1995-08-03

申请号：PCT/IE1995000009

申请日：1995-01-26

Applicant: LOCTITE (IRELAND) LIMITED ,  McARDLE, Ciaran, Bernard ,  BURKE, Joseph

Inventor： LOCTITE (IRELAND) LIMITED

IPC: H01F01/44

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R4/04 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347 ,  H01L2924/00

Abstract: The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

Abstract translation: 本发明提供一种组合物（3），其包含：（i）含有非磁性载体液体中的铁磁颗粒的胶体悬浮液（4）的铁磁流体，和（ii）具有基本均匀的多个导电颗粒 尺寸和形状，分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒（5）。 通过磁体装置（8）对组合物（3）施加基本均匀的磁场使得导电颗粒（5）形成规则图案（9）。 该组合物用于在电子工业中的两组导体（2a，2b; 7a，7b）之间提供各向异性导电通路（9a，9b）。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。

公开(公告)号：WO1994002974A1

公开(公告)日：1994-02-03

申请号：PCT/GB1993001448

申请日：1993-07-12

Applicant: CENTRAL RESEARCH LABORATORIES LIMITED ,  NAYLOR, Malcolm

Inventor： CENTRAL RESEARCH LABORATORIES LIMITED

IPC: H01R04/04

CPC classification number: H05K3/323 ,  H01L2224/29499 ,  H01L2924/01079 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/0218 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0281 ,  H05K2201/0323

Abstract: A method of forming an anisotropic electrical connection between conductive elements (22, 24) having an oxide layer (28) is disclosed. The method comprises the use of an adhesive (30) including carbon fibres (32) and metallic particles (34). On the application of pressure, the carbon fibres (32) penetrate the oxide layer (28), whilst the metallic particles (34) deform such that a good electrical connection is made between overlying elements (22, 24).

Abstract translation: 公开了一种在具有氧化物层（28）的导电元件（22,24）之间形成各向异性电连接的方法。 该方法包括使用包括碳纤维（32）和金属颗粒（34）的粘合剂（30）。 在施加压力时，碳纤维（32）穿透氧化物层（28），同时金属颗粒（34）变形使得在上层元件（22,24）之间形成良好的电连接。

公开(公告)号：US09332642B2

公开(公告)日：2016-05-03

申请号：US14481188

申请日：2014-09-09

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

Abstract translation: 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。

公开(公告)号：US09093196B2

公开(公告)日：2015-07-28

申请号：US11863379

申请日：2007-09-28

Applicant: Toshifumi Hashiba ,  Kazutoshi Hayakawa ,  Satomi Kudo ,  Kohei Moriyama ,  Tsuyoshi Fujii

Inventor： Toshifumi Hashiba ,  Kazutoshi Hayakawa ,  Satomi Kudo ,  Kohei Moriyama ,  Tsuyoshi Fujii

IPC: H01B1/00 ,  H01B1/20 ,  C08J3/12 ,  H01B1/12 ,  H05K3/32

CPC classification number: H01B1/20 ,  C08J3/12 ,  C08J3/126 ,  C08J2333/20 ,  H01B1/128 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2998

Abstract: Conductive particles each includes a polymer base particle and a conductive layer coating the polymer base particle. Let the compressive elastic deformation characteristic KX of one conductive particle when the displacement of particle diameter of the conductive particles is X % be defined by the following formula: KX=(3/√2)·(SX−3/2)·(R−1/2)·FX. FX is the load (N) necessary for X % displacement of the conductive particles. SX is the compressive deformation amount (mm) upon X % displacement of the conductive particles. R is the particle radius (mm) of the conductive particles. The compressive elastic deformation characteristic K50 when the displacement of particle diameter of the conductive particles is 50% is 100 to 50000 N/mm2 at 20° C., and the recovery factor of particle diameter of the conductive particles when the displacement of particle diameter of the conductive particles is 50% is not less than 30% at 20° C.

Abstract translation: 导电粒子各自包含聚合物基体颗粒和涂覆聚合物基础颗粒的导电层。 使导电粒子的粒径的位移为X％时的一个导电性粒子的压缩弹性变形特性KX由下式定义：KX =（3 /√2）·（SX-3/2）·（R -1/2）·FX。 FX是导电颗粒的X％位移所需的载荷（N）。 SX是导电颗粒的X％位移时的压缩变形量（mm）。 R是导电粒子的粒子半径（mm）。 导电粒子的粒径为50％时的压缩弹性变形特性K50在20℃为100〜50000N / mm 2，当导电粒子的粒径移动时的导电粒子的粒径的回收率 导电颗粒在20℃下为50％不小于30％

公开(公告)号：US08089151B2

公开(公告)日：2012-01-03

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。

公开(公告)号：US07413452B2

公开(公告)日：2008-08-19

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: H01R4/58

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。

公开(公告)号：US20060054867A1

公开(公告)日：2006-03-16

申请号：US10509204

申请日：2003-03-25

Applicant: Yukio Yamada

Inventor： Yukio Yamada

IPC: H01B1/12

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01B1/20 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A conductive particle 30 which can be used for connecting a variety of adherends is provided, and the conductive particle 30 includes a resin particle 31, a first conductive particle disposed around the resin particle 31, a first resin coating 25 disposed on the periphery thereof and softer than the resin particle 31, and a second conductive thin film 36 disposed therearound; and if the surface part of, for example, an electrode 13 of an adherend that is to be connected is hard, a first resin coating 35 and the second conductive thin film 36 are destroyed by pressure to bring the second conductive thin film 36 in contact with the electrode 13 and a metal wiring 17. If the surface part of the electrode 13 is soft, the second conductive thin film on the surface side comes in contact with the electrode 13, which makes it possible for the particle to be used regardless of the surface state of an adherend, in other words, be used for connecting a variety of adherends

Abstract translation: 提供了可用于连接各种被粘物的导电粒子30，导电粒子30包括树脂粒子31，设置在树脂粒子31周围的第一导电粒子，设置在其周边的第一树脂被膜25和 比树脂粒子31柔软，以及设置在其周围的第二导电薄膜36。 并且如果例如要连接的被粘物的电极13的表面部分是硬的，则第一树脂涂层35和第二导电薄膜36被压力破坏，以使第二导电薄膜36接触 电极13和金属布线17.如果电极13的表面部分是软的，则表面侧的第二导电薄膜与电极13接触，这使得可以使用颗粒，而不管 被粘物的表面状态，换句话说，用于连接各种被粘体