公开(公告)号：US20080144260A1

公开(公告)日：2008-06-19

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H05K7/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二个土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

公开(公告)号：US07273988B2

公开(公告)日：2007-09-25

申请号：US11150210

申请日：2005-06-13

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/16

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。

公开(公告)号：US20050146019A1

公开(公告)日：2005-07-07

申请号：US11048861

申请日：2005-02-03

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/09

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

公开(公告)号：US20030196831A1

公开(公告)日：2003-10-23

申请号：US10419197

申请日：2003-04-21

Applicant: NEC Corporation

Inventor： Yuki Momokawa

IPC: H05K001/09

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。

公开(公告)号：JP6205053B2

公开(公告)日：2017-09-27

申请号：JP2016525303

申请日：2014-07-24

Applicant: エルジー ディスプレイ カンパニー リミテッド

Inventor： ドゥクス・オー ,  スン・スー・パク ,  ミンスー・カン

IPC: H01L51/50 ,  H05K1/14

CPC classification number: H05K1/14 ,  H01L51/5246 ,  H05K1/028 ,  H05K1/111 ,  H05K3/361 ,  H01L51/0097 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/058 ,  H05K2201/09563 ,  H05K2201/10128 ,  H05K2201/10901 ,  H05K3/323

公开(公告)号：JP6191991B2

公开(公告)日：2017-09-06

申请号：JP2014073577

申请日：2014-03-31

Applicant: パナソニックIPマネジメント株式会社

Inventor： 松本 玄 ,  小掠 哲義 ,  和久田 大介

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K3/0044 ,  H05K3/14 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10901 ,  H05K3/16 ,  Y10T29/49162

公开(公告)号：JP2003318524A

公开(公告)日：2003-11-07

申请号：JP2002118905

申请日：2002-04-22

Applicant: Nec Corp ,  日本電気株式会社

Inventor： MOMOKAWA HIROKI

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: PROBLEM TO BE SOLVED: To inexpensively prevent peeling of a land even when lead-free solder is used. SOLUTION: A wiring board is provided with a substrate 11 having a through hole 12, a first conductive film 13 coating the internal surface of the hole 12, and the land 15 formed on the surface of the substrate 11 around the opening of the hole 12 and composed of a second conductive film connected to the first conductive film 13. The wiring board is also provided with circuit wiring 16 formed on the surface of the substrate 11 and connected to the land 15, a protective film 17 covering the wiring 16, and a coating member 18 coating at least part of the outer peripheral edge 15A of the land 15. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：即使使用无铅焊料，也能廉价地防止焊盘的剥离。 解决方案：布线板设置有具有通孔12的基板11，涂覆孔12的内表面的第一导电膜13和形成在基板11的表面周围的开口 孔12，由与第一导电膜13连接的第二导电膜构成。布线基板还设置有电路布线16，其形成在基板11的表面上并与凸台15连接，保护膜17覆盖布线 16，以及涂覆部分18，其涂覆了陆地15的外周边缘15A的至少一部分。版权所有（C）2004，JPO

公开(公告)号：US12114425B2

公开(公告)日：2024-10-08

申请号：US17942442

申请日：2022-09-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Guodong Zhang ,  Chong Chen ,  Jian Zhang ,  Shaoyong Xiang ,  Zhijun Qu ,  Changxing Sun

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/184 ,  H05K2201/09509 ,  H05K2201/10901

Abstract: A signal transmission structure includes a circuit board, a chip, and a cable assembly. The chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly includes a cable, and the circuit board includes a plurality of conductive holes. The chip is electrically connected to the cable of the cable assembly using the conductive hole to transmit a signal of the chip using the cable.

公开(公告)号：US20230274994A1

公开(公告)日：2023-08-31

申请号：US18005021

申请日：2021-06-23

Applicant: VALEO EAUTOMOTIVE FRANCE SAS

Inventor： Aurelien POUILLY

IPC: H01L23/31 ,  H01L25/07 ,  H05K1/18 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L25/072 ,  H05K1/18 ,  H01L21/56 ,  H05K2201/10166 ,  H05K2201/10568 ,  H05K2201/10901

Abstract: A power electronics module having at least one electronic chip, and an electrically insulating overmolded block at least partially encapsulating each of the at least one chip. The module includes at least one projection against which a component can bear, such as an electronic circuit board for controlling each chip. The projection includes an electrically insulating material and extending from one face of the block.

公开(公告)号：US11729898B1

公开(公告)日：2023-08-15

申请号：US17831859

申请日：2022-06-03

Applicant: TE Connectivity Solutions GmbH

Inventor： Justin Dennis Pickel ,  Margaret Mahoney Fernandes ,  Timothy Robert Minnick

IPC: H05K1/11 ,  H05K1/02 ,  H01R12/58 ,  H05K1/18

CPC classification number: H05K1/0222 ,  H05K1/116 ,  H01R12/58 ,  H05K1/18 ,  H05K2201/09481 ,  H05K2201/09609 ,  H05K2201/09772 ,  H05K2201/10189 ,  H05K2201/10901

Abstract: A printed circuit board includes a layered substrate having a plurality of layers having an electrical connector footprint configured to receive an electrical connector. The printed circuit board includes pair anti-pads passing through the layered substrate around pairs of signal vias. The printed circuit board includes ground vias passing through the layered substrate. The ground vias are configured to receive ground pins of the electrical connector. The ground vias are located outside of the pair anti-pads. The printed circuit board includes SI vias passing through the layered substrate. The SI vias form an SI fence surrounding the corresponding pair anti-pad.