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    CONDUCTIVE CONTACT TERMINAL TO BE MOUNTED ON A SUBSTRATE SURFACE
    64.
    发明申请
    CONDUCTIVE CONTACT TERMINAL TO BE MOUNTED ON A SUBSTRATE SURFACE 审中-公开
    导电接触端子安装在基板表面上

    公开(公告)号：WO2010134734A3

    公开(公告)日：2011-03-03

    申请号：PCT/KR2010003114

    申请日：2010-05-17

    Applicant: DOOSUNG IND CO LTD ,  KIM SEON TAE ,  LEE HYUNG CHUN ,  LEE SANG WON

    Inventor： KIM SEON TAE ,  LEE HYUNG CHUN ,  LEE SANG WON

    IPC: H05K9/00 ,  H05K3/30

    CPC classification number: H05K3/3421 ,  H01R13/03 ,  H01R13/2414 ,  H05K2201/10909 ,  Y02P70/613

    Abstract: The present invention relates to a conductive contact terminal to be mounted on a substrate surface. The conductive contact terminal to be mounted on a substrate surface according to the present invention comprises: an elastic core which provides elasticity to the contact terminal; a metal layer formed to cover the outer surface of the elastic core; and a conductive adhesive layer interposed between the elastic core and the metal layer to adhere the elastic core and the metal layer together. The conductive contact terminal to be mounted on a substrate surface according to the present invention has low electric resistance, prevents materials from being deformed in a high temperature reflow soldering process, and prevents a loss of conductivity even upon the occurrence of a fracture in the metal layer that provides conductivity to the conductive contact terminal.

    Abstract translation: 本发明涉及一种要安装在基板表面上的导电接触端子。 根据本发明的要安装在基板表面上的导电接触端子包括：向接触端子提供弹性的弹性芯; 形成为覆盖弹性芯的外表面的金属层; 以及插入在弹性芯和金属层之间的导电粘合剂层，以将弹性芯和金属层粘合在一起。 根据本发明的要安装在基板表面上的导电接触端子具有低电阻，防止材料在高温回流焊接工艺中变形，并且即使在金属中发生断裂时也防止导电性损失 为导电接触端子提供导电性的层。

    METHOD FOR IMPROVING THE MANUFACTURING SAFETY OF WELD JOINTS
    66.
    发明申请
    METHOD FOR IMPROVING THE MANUFACTURING SAFETY OF WELD JOINTS 审中-公开
    方法增加了生产安全焊料连接

    公开(公告)号：WO00054561A1

    公开(公告)日：2000-09-14

    申请号：PCT/DE2000/000377

    申请日：2000-02-08

    IPC: B23K1/20 ,  B23K1/00 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H01L23/498

    CPC classification number: H05K3/403 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/248 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/09181 ,  H05K2201/10909 ,  Y02P70/613

    Abstract: The invention relates to a method of improving the manufacturing safety of weld joints (7) between a ceramic support (1) and a printed-circuit board (10). Said method consists of the deposition of a first metallization layer (5) resistant to alloy breakdown on the ceramic support (1), followed by the imprinting of a second metallization layer (6), which enhances wetting behaviour, on the first metallization layer (5). In this way the thickness of the overall metallization layer (5, 6) can be increased in the area of the edges (8) of a weld joint (7). The resulting raised solder ring in turn permits the fully automatic optical control of the weld joint (7).

    Abstract translation: 本发明涉及一种用于陶瓷基板（1）和电路板（10）之间增加焊点（7）的生产可靠性。 它包括陶瓷基板（1）和第二随后压印上施加第一ablegierungsbeständigen金属化层（5）的步骤中，润湿行为增强金属化层（6）的第一金属化层（5）上。 从而增加了Gesamtmetallisierungsschichtdicke（5,6）在边缘区域（8）的焊料接头的（7）是可以实现的，这又使焊接接头（7）的光学Lothochstieg全自动控制。

    CONTACT PLUG
    67.
    发明申请
    CONTACT PLUG 审中-公开
    联系电话

    公开(公告)号：WO1989003128A1

    公开(公告)日：1989-04-06

    申请号：PCT/DE1988000575

    申请日：1988-09-15

    Applicant: SIEMENS AKTIENGESELLSCHAFT ,  HUBER, Anton

    Inventor： SIEMENS AKTIENGESELLSCHAFT

    IPC: H01R04/02

    CPC classification number: H05K3/3447 ,  H01R4/02 ,  H05K3/3468 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/10871 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2081 ,  H05K2203/1147 ,  H05K2203/304

    Abstract: A contact plug may be wave soldered in a preferably sealed electric component, although the original core cannot be soldered, at least not with sufficient reliability. An electrically conductive contact plug (S with H or with I) for conducting current and/or voltage to/from the electric connection of a component (E) is secured by an insulator (G), for example glass (G), within a passage in a support (K), for example a protecting housing (K) of the component (E), and contains on its surface a metal capable of being soldered with a solder paint, for example soft solder, at least on the spot (on H or I) where it can be soldered to a socket (M). The socket (M) is in turn made of a metal capable of being soldered and is arranged in a support (L), for example in a printed circuit board (L) made of insulating material. The contact plug (S with H or with I) has a pin-like core (S) of a metal not capable of being soldered, at least not reliably soldered, secured by means of the insulator (G) in the passage, conductively connected (for example by a bonded wire (D) to the component (E) and surrounded by a sheath (H or I). The sheath (H or I) is in turn electroconductively secured to the core (S), for example by spot welding, and is completely made of a material capable of being soldered or has a material capable of being soldered at least on the point of its surface at which it (H or I) is soldered to the socket (M). Long-time resistant, reliable contact plug soldering, in particular for motor vehicle electronic circuits.

    LEAD FINISHING FOR A SURFACE MOUNT PACKAGE
    68.
    发明申请
    LEAD FINISHING FOR A SURFACE MOUNT PACKAGE 审中-公开
    表面安装包装的导线整理

    公开(公告)号：WO1987004008A1

    公开(公告)日：1987-07-02

    申请号：PCT/US1986001883

    申请日：1986-09-15

    Applicant: MOTOROLA, INC.

    Inventor： MOTOROLA, INC. ,  LIN, Paul, T.

    IPC: H01L23/28

    CPC classification number: H01L23/49555 ,  H01L23/3107 ,  H01L23/3135 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A surface mount package (60) having a plurality of exterior package leads (64) with a dual finished surface (66, 68). The lower part of the lead which is to be bonded to a bonding pad (74) of a substrate (70) such as a printed circuit board is provided with a solder-wettable surface (68) which extends only part-way up the length of the lead (64) to meet with a non-wettable surface region (66). Alternately, or in addition thereto, the upper portions of the leads (64) may be coated with a chemical, plastic or other solder- phobic composition (84) to provide the non-wettable surface region (66). Bonds made using such leads (64) are stronger and more reliable because of the affinity of the solder (72) for the lead (64) at the contact area (74) and the aversion of the solder (72) to wick up the lead into the non-wettable area (66) of the lead (64) nearer the package (60) and thus draw solder (72) away from the bonding area (74). The configuration of the solder bond is easily and quickly adjusted by controlling the area or depth of the solder coated region (68) on only the lower portion of the leads (64) of the surface mountable integrated circuit package (60).

    Abstract translation: 具有多个具有双重精加工表面（66,68）的外部封装引线（64）的表面安装封装（60）。 要被接合到诸如印刷电路板的基板（70）的接合焊盘（74）的引线的下部设置有焊料可润湿表面（68），其仅沿着长度方向 的引线（64）以满足不可润湿的表面区域（66）。 或者，或者除此之外，引线（64）的上部可涂覆有化学，塑料或其它阻燃组合物（84）以提供不可润湿的表面区域（66）。 由于焊料（72）在接触区域（74）处与焊料（64）的亲和性以及焊料（72）对引线的吸引力而使用这种引线（64）制成的焊接更坚固和更可靠 进入靠近封装（60）的引线（64）的不可润湿区域（66），从而将焊料（72）从结合区域（74）拉出。 通过仅控制可表面安装的集成电路封装（60）的引线（64）的下部的焊料涂覆区域（68）的面积或深度，可容易且快速地调整焊接结构。

    CIRCUIT IMPRIME COMPORTANT AU MOINS UN COMPOSANT CERAMIQUE
    69.
    发明申请
    CIRCUIT IMPRIME COMPORTANT AU MOINS UN COMPOSANT CERAMIQUE 审中-公开
    包含至少一个陶瓷组件的印刷电路

    公开(公告)号：WO2012025693A1

    公开(公告)日：2012-03-01

    申请号：PCT/FR2011/051950

    申请日：2011-08-23

    Applicant: HISPANO SUIZA ,  LHOMMEAU, Tony

    Inventor： LHOMMEAU, Tony

    IPC: H01G2/06 ,  H05K3/34

    CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H05K3/3426 ,  H05K2201/10909 ,  Y02P70/613

    Abstract: L'invention concerne un circuit imprimé comportant un support (1 ) sur lequel est fixé au moins un composant céramique (2, 3, 4) de façon à permettre l'évacuation de la chaleur produite par le composant céramique (2, 3, 4), et à éviter les fissures dans le composant céramique (2, 3, 4) et dans le support (1 ). Pour ce faire, le composant céramique (2, 3, 4) est fixé au support (1 ) par l'intermédiaire de deux connecteurs (5, 6) en matériau composite à matrice métallique. Ces deux connecteurs sont en outre de préférence incisés pour permettre un report des contraintes mécaniques qui s'exercent dans le support dans les connecteurs.

    Abstract translation: 本发明涉及一种印刷电路，其包括基板（1），至少一个陶瓷部件（2,3,4）被安装在该基板上，以使陶瓷部件（2,3,4）产生的热能够被排出 并且防止陶瓷部件（2,3,4）和基板（1）中的裂纹。 为此，通过由金属基复合材料制成的两个连接器（5,6）将陶瓷部件（2,3,4）附接到基板（1）上。 所述两个连接器还优选地具有切口，以便使得施加在基板中的机械应力能够承载在连接器中。

    기판 표면 실장용 도전성 접촉 단자
    70.
    发明申请
    기판 표면 실장용 도전성 접촉 단자 审中-公开
    导电接触端子安装在基板表面上

    公开(公告)号：WO2010134734A2

    公开(公告)日：2010-11-25

    申请号：PCT/KR2010/003114

    申请日：2010-05-17

    Applicant: 두성산업주식회사 ,  김선태 ,  이형춘 ,  이상원

    Inventor： 김선태 ,  이형춘 ,  이상원

    IPC: H05K9/00 ,  H05K3/30

    CPC classification number: H05K3/3421 ,  H01R13/03 ,  H01R13/2414 ,  H05K2201/10909 ,  Y02P70/613

    Abstract: 본 발명은 기판 표면 실장용 도전성 접촉 단자를 제공한다. 본 발명의 기판 표면 실장용 도전성 접촉 단자는 접촉 단자에 탄성을 부여하는 탄성 코어; 상기 탄성코어의 외측을 감싸도록 형성된 금속층; 및 상기 탄성 코어와 상기 금속층 사이에 상기 탄성 코어와 상기 금속층을 서로 접착시키는 전도성 접착제층;을 포함한다. 본 발명의 기판 표면 실장용 도전성 접촉 단자는 전기 저항이 낮고, 고열의 리플로우 솔더링 공정에서도 재료의 변형이 없으며, 도전성 접촉 단자에 전도성을 부여하는 금속층에 파단이 발생하여도 전도성을 상실하지 않는다.

    Abstract translation: 本发明涉及一种要安装在基板表面上的导电接触端子。 根据本发明的要安装在基板表面上的导电接触端子包括：向接触端子提供弹性的弹性芯; 形成为覆盖弹性芯的外表面的金属层; 以及插入在弹性芯和金属层之间的导电粘合剂层，以将弹性芯和金属层粘合在一起。 根据本发明的要安装在基板表面上的导电接触端子具有低电阻，防止材料在高温回流焊接工艺中变形，并且即使在金属中发生断裂时也防止导电性损失 为导电接触端子提供导电性的层。

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