-
公开(公告)号：KR100648463B1
公开(公告)日：2006-11-27
申请号：KR1020050089484
申请日：2005-09-26
Applicant: 삼성전기주식회사
IPC: C09K21/04
Abstract: Provided is a flame resistant resin composition, which has a controllable curing degree while maintaining excellent mechanical properties such as mechanical strength, is free from halogen, and is useful for fabricating a printed circuit board via imprinting lithography. The flame resistant resin composition comprises: (a) 100 parts by weight of a composite epoxy resin comprising 1-40 parts by weight of a bisphenol A type epoxy resin, 1-30 parts by weight of a phenol novolac epoxy resin, 1-10 parts by weight of a cresol novolac epoxy resin, 1-20 parts by weight of a rubber-modified epoxy resin and 1-50 parts by weight of a phosphor-based epoxy resin; (b) a curing agent mixed at an equivalent ratio of 1:1 to the combined epoxy equivalent of the composite epoxy resin; (c) 0.1-1 parts by weight of a curing accelerator; and (d) 10-50 parts by weight of inorganic fillers.
Abstract translation: 本发明提供一种耐火树脂组合物，其具有可控的固化度，同时保持优异的机械性能如机械强度，不含卤素，并且可用于通过压印光刻制造印刷电路板。 该阻燃树脂组合物包含：（a）100重量份的复合环氧树脂，其包含1-40重量份的双酚A型环氧树脂，1-30重量份的酚醛清漆环氧树脂，1-10 重量的甲酚酚醛清漆环氧树脂，1-20重量份的橡胶改性环氧树脂和1-50重量份的磷基环氧树脂; （b）以1：1的当量比混合到所述复合环氧树脂的组合环氧当量的固化剂; （c）0.1-1重量份的固化促进剂; 和（d）10-50重量份的无机填料。
-
公开(公告)号：KR100645641B1
公开(公告)日：2006-11-14
申请号：KR1020050041134
申请日：2005-05-17
Applicant: 삼성전기주식회사
Abstract: An imprint mold for printed circuit board fabricated by using PTFE(polytetrafluoroethylene) is provided to embody the printed circuit board with excellent physical properties including releasing property, strength, thermal conductivity, durability, chemical-resistance, water-repellent property, self-lubrication, etc. by using electrolytic nickel plating solution dispersed with PTFE powder to form a nickel plated layer and having multiple via-holes and structure corresponding to circuit patterns. A method for fabricating imprint mold(300) comprises the steps of: (a) preparing a master mold(100) that includes multiple via-holes and patterns of a structure including circuit pattern; (b) forming a metal coating layer(200) on the master mold having the structure patterns; (c) preparing electrolytic nickel plating solution having PTFE(320) powder dispersion; (d) forming PTFE-charged nickel plating layer(310) by contacting the nickel plating solution with the master mold; (e) separating the nickel plating layer from the master mold; (f) heat-treating the separated nickel plating layer to partially decompose PTFE charged in the nickel plating layer.
Abstract translation: 提供一种使用PTFE（聚四氟乙烯）制造的印刷电路板压印模具，以实现包括脱模性，强度，导热性，耐久性，耐化学性，防水性，自润滑性等优异物理性能的印刷电路板。 通过使用分散有PTFE粉末的电解镍电镀液形成镍镀层并具有多个通孔和对应于电路图案的结构。 一种用于制造压印模具（300）的方法，包括以下步骤：（a）准备包括多个通孔和包括电路图案的结构的图案的主模具（100） （b）在具有所述结构图案的所述母模上形成金属涂层（200）; （c）制备具有PTFE（320）粉末分散体的电解镀镍溶液; （d）通过使镀镍溶液与母模接触而形成带有PTFE填充的镍镀层（310）; （e）将镍镀层从母模分离; （f）对分离的镍镀层进行热处理，以使填充在镍镀层中的PTFE部分分解。
-
公开(公告)号：KR1020060104735A
公开(公告)日：2006-10-09
申请号：KR1020050027121
申请日：2005-03-31
Applicant: 삼성전기주식회사
CPC classification number: H05K3/107 , H05K3/0014 , H05K3/005 , H05K2201/0209 , H05K2203/0108 , Y10T428/24917
Abstract: 본 발명은 우수한 내구성을 갖는 인쇄회로기판용 임프린트 몰드 및 이를 이용한 인쇄회로기판의 제조방법에 관한 것으로, 형성하고자 하는 복수의 비아 및 패턴에 대응되는 구조물이 표면에 형성된 인쇄회로기판용 임프린트 몰드에 있어서, 상기 몰드가 열 또는 자외선 경화형 프리폴리머(prepolymer) 100중량부에 대하여 0.1∼5.0㎛의 평균입경을 갖는 필러 30∼80중량부를 함침시켜 된 것을 특징으로 하는 우수한 내구성을 갖는 인쇄회로기판용 임프린트 몰드 및 이를 이용한 인쇄회로기판의 제조방법을 제공한다.
인쇄회로기판, 임프린트, 몰드, 프리폴리머, 필러-
公开(公告)号：KR100632581B1
公开(公告)日：2006-10-09
申请号：KR1020050035625
申请日：2005-04-28
Applicant: 삼성전기주식회사
Abstract: A releasing treatment method of imprint mold for printed circuit board is provided to form an excellent releasing layer with thermal and chemical stability and mechanical property on the printed circuit board by preparing an aluminum layer on a nickel mold, plasma-treating the layer and combining specific silane compound to the mold through self association process. The treatment method comprises steps of: (a) preparing a nickel mold with nickel plated surface; (b) forming aluminum layer on the surface of the nickel mold; (c) plasma-treating the aluminum layer; and (d) combining the plasma-treated nickel mold with silane compound represented by a follow formula(1), wherein R1 to R3 are same or different and halogen or C1-C20 of alkoxy group, and n is integer ranging from 1 to 20. The aluminum formation step is carried out by any one selected from sputtering, metal vapor deposition or physical vapor deposition.
Abstract translation: 本发明提供一种印刷电路板压印模具的脱模处理方法，通过在镍模具上制备铝层，对该层进行等离子体处理，并结合具体方法，在印刷电路板上形成具有热，化学稳定性和机械性能的优异脱模层 硅烷化合物通过自缔合过程加入到模具中。 该处理方法包括以下步骤：（a）制备具有镀镍表面的镍模具; （b）在镍模的表面上形成铝层; （c）等离子体处理铝层; （d）将经等离子体处理的镍模具与由下式（1）表示的硅烷化合物组合，其中R 1至R 3相同或不同，且卤素或烷氧基的C 1 -C 20，且n为1至20的整数 通过选自溅射，金属气相沉积或物理气相沉积中的任何一种进行铝形成步骤。
-
公开(公告)号：KR1020150024154A
公开(公告)日：2015-03-06
申请号：KR1020130101247
申请日：2013-08-26
Applicant: 삼성전기주식회사
CPC classification number: H05K1/036 , H05K1/0366 , H05K1/0373 , H05K2201/0145 , H05K2201/0154 , H05K2201/0158 , H05K2201/0269 , Y10T428/264 , Y10T428/31515
Abstract: 본 발명은 인쇄회로기판용 절연필름 및 이를 이용한 제품을 제공한다. 구체적으로는, 본 발명의 대표적인 실시 예에 따른 절연필름에 있어서, 절연층 내의 무기충전제의 함량이 농도 구배를 갖는 절연재 및 이를 적용한 인쇄회로기판이 내층회로 및 내층회로의 쓰루 홀 (through hole)의 충진성을 높일 수 있는 효과를 나타낼 수 있다.
Abstract translation: 提供一种用于印刷电路板的绝缘膜和具有该绝缘膜的产品。 更具体地，在根据本发明的典型实施例的绝缘膜中，绝缘层中具有无机填料含量的浓度梯度的绝缘材料和具有该绝缘层的印刷电路板可以提高填充性能 内层电路的内层电路和通孔。
-
Patent Agency Ranking
公开(公告)号：KR1020150022559A
公开(公告)日：2015-03-04
申请号：KR1020130100627
申请日：2013-08-23
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0366 , H05K1/0298 , H05K1/036 , H05K1/115 , H05K2201/0137 , H05K2201/0145 , H05K2201/0195
Abstract: 본 발명은 인쇄회로기판용 적층재, 이를 이용한 인쇄회로기판 및 그 제조 방법에 관한것이다.
본 발명의 일 실시예에 따른 인쇄회로기판용 적층재는 제 1 절연필름, 및 제 1 절연필름 상에 형성된 제 2 절연필름을 포함하며, 상기 제 1 절연필름과 상기 제 2 절연필름은 상이한 반응 촉진제의 함유량을 갖는다.Abstract translation: 本发明涉及一种用于印刷电路板的层压板和使用其的印刷电路板及其制造方法。 根据本发明实施例的用于印刷电路板的层压板包括形成在第一绝缘膜上的第一绝缘膜和第二绝缘膜。 第一绝缘膜的反应促进剂的含量与第二绝缘膜的反应促进剂的含量不同。
-
公开(公告)号：KR1020140021828A
公开(公告)日：2014-02-21
申请号：KR1020120087384
申请日：2012-08-09
Applicant: 삼성전기주식회사
CPC classification number: G01N33/32 , G01N21/84 , G01N21/892
Abstract: The present invention relates to a device for measuring drying rate and a method for measuring a drying rate using the same for measuring a drying rate of substrate materials for manufacturing an electronic device. The device for measuring a drying rate comprises: a supporting unit in which a substrate is arranged; and a marking unit forming marks on the substrate while being in contact with the substrate, arranged at the upper part of the substrate movably in every direction.
Abstract translation: 本发明涉及一种用于测量干燥速度的装置以及用于测量干燥速率的方法，该方法用于测量用于制造电子装置的基板材料的干燥速率。 用于测量干燥速率的装置包括：支撑单元，其中布置基板; 以及标记单元，其在与基板接触的同时在基板上形成标记，布置在基板的上部，在每个方向上可移动。
-
公开(公告)号：KR1020140008916A
公开(公告)日：2014-01-22
申请号：KR1020120076609
申请日：2012-07-13
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0298 , H05K1/0373 , H05K3/025 , H05K2201/0209 , Y10T428/265 , Y10T428/266 , Y10T428/31678
Abstract: The present invention relates to an insulation film including a metal layer. The insulation film according to one embodiment of the present invention includes a carrier, the metal layer, and an insulation layer. The metal layer is formed on the carrier. The insulation layer is formed on the metal layer. The carrier is made of Cu.
Abstract translation: 本发明涉及一种包括金属层的绝缘膜。 根据本发明的一个实施方案的绝缘膜包括载体，金属层和绝缘层。 金属层形成在载体上。 绝缘层形成在金属层上。 载体由Cu制成。
-
公开(公告)号：KR101228734B1
公开(公告)日：2013-02-01
申请号：KR1020100109967
申请日：2010-11-05
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0353 , C08G59/08 , C08G59/182 , C08G59/186 , C08G59/304 , C08G59/621 , H05K1/0326 , H05K3/4655 , H05K2201/012 , Y10T428/12396
Abstract: 본 발명은 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층 배선기판에 관한 것으로, 본 발명의 일 실시예에 따른 다층배선기판용 난연성 수지 조성물은 나프탈렌 변형 에폭시 수지, 크레졸 노블락 에폭시 수지, 고무 변성형 에폭시 수지 및 인계 에폭시 수지를 포함하는 복합 에폭시 수지; 및 특정 화학식으로 표시되는 난연제;를 포함한다. 본 발명에 따른 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층 배선기판은 우수한 난연성, 내흡습성 및 박리강도를 나타낸다.
-
公开(公告)号：KR1020120053921A
公开(公告)日：2012-05-29
申请号：KR1020100115289
申请日：2010-11-18
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4644 , H05K3/06 , H05K3/4602 , H05K3/4652 , H05K2201/0347 , H05K2203/1152 , Y10T29/49155
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to obtain the adhesive force between a conductive layer and an insulating layer by obtaining uniform illuminance on an insulating layer. CONSTITUTION: An insulating layer is formed on a core substrate having an internal circuit pattern(S100). Illuminance is formed on a surface of the insulating layer(S200). A via hole is formed on the insulating layer(S300) A metal coating layer is formed on the insulating layer(S400) A step forming the illuminance on the insulating layer surface includes a step(S210) attaching a metal foil to the insulating layer and a step(S220) removing the metal foil by etching the metal foil. The insulating layer having the uniform surface illuminance of a nano size is formed on the core substrate including the first circuit pattern. A second circuit pattern is formed on the insulating layer by plating.
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过在绝缘层上获得均匀的照度来获得导电层和绝缘层之间的粘合力。 构成：在具有内部电路图案的芯基板上形成绝缘层（S100）。 在绝缘层的表面形成有照度（S200）。 在绝缘层上形成通孔（S300）在绝缘层上形成金属被覆层（S400）在绝缘层表面形成照度的工序包括将金属箔附着在绝缘层上的工序（S210）， 通过蚀刻金属箔去除金属箔的步骤（S220）。 在包括第一电路图案的芯基板上形成具有纳米尺寸的均匀表面照度的绝缘层。 通过电镀在绝缘层上形成第二电路图案。
-
-
-
-
-
-
-
-
-
Search Results
96
records
(took 0.018 seconds)
