公开(公告)号：US5459610A

公开(公告)日：1995-10-17

申请号：US62688

申请日：1993-05-20

Applicant: David M. Bloom ,  Francisco S. A. Sandejas ,  Olav Solgaard ,  Raj B. Apte

Inventor： David M. Bloom ,  Francisco S. A. Sandejas ,  Olav Solgaard ,  Raj B. Apte

IPC: B81B3/00 ,  G02B5/18 ,  G02B26/08 ,  H04N9/12

CPC classification number: B81B3/001 ,  G02B26/0808 ,  G02B5/1828 ,  B81C2201/115 ,  Y10S359/90

Abstract: A modulator for modulating incident rays of light, the modulator comprising a plurality of equally spaced apart beam elements, each of which includes a light reflective planar surface. The elements are arranged parallel to each other with their light reflective surfaces parallel to each other. The modulator includes means for supporting the beam elements in relation to one another and means for moving the beam elements relative to one another so that the beams move between a first configuration wherein the modulator acts to reflect the incident rays of light as a plane mirror, and a second configuration wherein the modulator diffracts the incident rays of light as they are reflected therefrom. At least one of the facing surfaces of the beam elements and underlying substrate is configured to reduce any tendency to stick as they are pulled together. In operation, the light reflective surfaces of the beam elements remain parallel to each other in both the first and the second configurations and the perpendicular spacing between the reflective surfaces of adjacent beam elements is equal to m/4 times the wavelength of the incident rays of light, wherein m=an even whole number or zero when the beam elements are in the first configuration and m=an odd number when the beam elements are in the second configuration.

Abstract translation: 一种用于调制入射光线的调制器，所述调制器包括多个等间隔开的光束元件，每个光束元件包括光反射平面。 元件彼此平行地布置，其光反射表面彼此平行。 调制器包括用于相对于彼此支撑光束元件的装置和用于相对于彼此移动光束元件的装置，使得光束在第一配置之间移动，其中调制器作为反射作为平面镜的入射光线， 以及第二配置，其中调制器衍射入射的光线，因为它们被反射。 梁元件和下面的基底的至少一个相对表面被配置成减少当它们被拉在一起时粘合的任何倾向。 在操作中，光束元件的光反射表面在第一和第二构造中保持彼此平行，并且相邻光束元件的反射表面之间的垂直间隔等于入射光线的波长的m / 光，其中当波束元素处于第一配置时，m =偶数或零，并且当波束元处于第二配置时m =奇数。

公开(公告)号：WO2014163985A1

公开(公告)日：2014-10-09

申请号：PCT/US2014/019661

申请日：2014-02-28

Applicant: INVENSENSE, INC.

Inventor： WILLIAMS, Kirt, Reed ,  HUANG, Kegang ,  XU, Wencheng ,  SHIN, Jongwoo ,  LIM, Martin

IPC: H01L21/00

CPC classification number: B81B3/001 ,  B81C2201/115

Abstract: In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness.

Abstract translation: 在集成的MEMS器件中，移动具有光滑表面的硅部件如果接触则可以粘在一起。 通过使至少一个光滑表面粗糙化，有效的接触面积以及因此的表面附着能减少，因此粘附力降低。 可以通过以局部不均匀蚀刻速率蚀刻气体，等离子体或液体中的光滑表面来提供表面的粗糙化。 各种蚀刻化学和条件导致各种表面粗糙度。

公开(公告)号：WO2011034972A2

公开(公告)日：2011-03-24

申请号：PCT/US2010/048997

申请日：2010-09-15

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  KOTHARI, Manish ,  GUDLAVALLETI, Sauri ,  ZEE, Stephen

Inventor： KOTHARI, Manish ,  GUDLAVALLETI, Sauri ,  ZEE, Stephen

IPC: G02B26/00

CPC classification number: B81B3/0008 ,  B81B2201/042 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  G02B26/0841

Abstract: In certain embodiments, a device is provided including a substrate and a plurality of supports over the substrate. The device may further include a mechanical layer having a movable portion and a stationary portion. The stationary portion may disposed over the supports. In certain embodiments, the device further includes a reflective surface positioned over the substrate and mechanically coupled to the movable portion. The device of certain embodiments further includes at least one movable stop element displaced from and mechanically coupled to the movable portion. In certain embodiments, the at least a portion of the stop element may be positioned over the stationary portion.

Abstract translation: 在某些实施例中，提供了一种包括衬底和在衬底上的多个支撑体的装置。 该装置还可以包括具有可移动部分和固定部分的机械层。 固定部分可以设置在支撑件上方。 在某些实施例中，所述装置还包括位于所述基板上并且机械地联接到所述可移动部分的反射表面。 某些实施例的装置还包括至少一个可动止动元件，该可移动止动元件从可移动部分移动并机械联接到可动部分。 在某些实施例中，止动元件的至少一部分可以定位在固定部分上方。

公开(公告)号：WO2007106271A1

公开(公告)日：2007-09-20

申请号：PCT/US2007/003591

申请日：2007-02-09

Applicant: QUALCOMM INCORPORATED ,  TUNG, Ming-Hau ,  KOGUT, Lior

Inventor： TUNG, Ming-Hau ,  KOGUT, Lior

IPC: B81C1/00

CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they axe incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

Abstract translation: 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护涂层优选地改进其中所包含的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

公开(公告)号：WO2004000717A2

公开(公告)日：2003-12-31

申请号：PCT/GB0302495

申请日：2003-06-09

Applicant: FILTRONIC COMPOUND SEMICONDUCT ,  GALLANT ANDREW JAMES

Inventor： GALLANT ANDREW JAMES

IPC: B81B3/00 ,  H01G5/16 ,  B81B

CPC classification number: B81B3/0008 ,  B81C2201/115 ,  H01G4/2325 ,  H01G5/18

Abstract: A micro-electromechanical variable capacitor with first and second capacitor plates spaced apart to define a gap therebetween. The first plate has two control electrodes and an active electrode. The second plate is movable relative to first plate when a voltage is applied to produce a potential difference across the control electrode and the second capacitor plate. This has the effect of varying the capacitance of the capacitor. The facing surface of at least one of the plates is formed in such a way that it has a roughened surface. The degree of roughness is sufficient to prevent the facing surfaces adhering together through stiction.

Abstract translation: 一个微机电可变电容器，其具有间隔开的第一和第二电容器板，以在它们之间形成间隙。 第一板具有两个控制电极和一个有源电极。 当施加电压以产生跨越控制电极和第二电容器板的电位差时，第二板可相对于第一板移动。 这具有改变电容器的电容的效果。 至少一个板的面对表面形成为具有粗糙表面。 粗糙度足以防止面对表面粘着在一起。

公开(公告)号：WO0029770A2

公开(公告)日：2000-05-25

申请号：PCT/US9927450

申请日：1999-11-16

Applicant: CALIFORNIA INST OF TECHN

Inventor： TAI YU-CHONG ,  WANG XUAN-QI

IPC: B81B3/00 ,  B81C1/00 ,  F15C5/00 ,  F16K15/14 ,  F16K99/00 ,  F16K

CPC classification number: F16K99/0001 ,  B81B3/001 ,  B81B2201/054 ,  B81B2203/0127 ,  B81C2201/115 ,  F15C5/00 ,  F16K15/144 ,  F16K99/0009 ,  F16K99/0034 ,  F16K99/0057 ,  F16K2099/0074 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/7888 ,  Y10T137/7895

Abstract: The present disclosure describes a Parylene micro check valve (10) including a micromachined silicon valve seat (15) with a roughened top surface to which a membrane cap (20) is anchored by twist-up tethers (25). The micro check valve is found to exhibit low cracking pressure, high reverse pressure, low reverse flow leakage, and negligible membrane-induced flow resistance when used as a valve over a micro orifice through which flow liquid and gas fluids.

Abstract translation: 本披露描述了一种派瑞林微型止回阀（10），其包括具有粗糙顶面的微机械加工硅阀座（15），膜帽（20）通过绞合系绳（25）锚定到该微型机械阀座（15）。 当微型止回阀用作流过液体和气体流体的微孔时，表现出低开启压力，高反向压力，低反向流动泄漏以及可忽略的膜致流动阻力。

公开(公告)号：KR1020160124178A

公开(公告)日：2016-10-26

申请号：KR1020167025596

申请日：2014-12-22

Applicant: 로베르트 보쉬 게엠베하

Inventor： 곤스카율리안 ,  라인무트요헨 ,  아메토보블라마불리

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81C1/00119 ,  B81B1/004 ,  B81B7/02 ,  B81B2203/0315 ,  B81C1/00293 ,  B81C2201/112 ,  B81C2201/115 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/019

Abstract: 본발명은마이크로기계부품(100)을제조하기위한방법에관한것으로, 상기방법은, 부품(100)의 MEMS 요소(5) 내에, 또는캡 요소(6) 내에접근개구부(7)를형성하는단계와, MEMS 요소(5)와캡 요소(6) 사이에하나이상의공동(8a, 8b)을형성하면서상기캡 요소(6)와 MEMS 요소(5)를연결하는단계와, 규정된분위기에서레이저(9)를이용하여하나이상의공동(8a, 8b)으로의접근개구부(7)를밀폐하는단계를포함한다.

Abstract translation: 一种用于制造微机械部件的方法，包括在所述部件的MEMS元件或盖元件中形成进入开口; 将所述MEMS元件连接到所述盖元件，在所述MEMS元件和所述盖元件之间形成至少一个空腔; 并且使用激光在限定的气氛下关闭所述至少一个空腔的进入开口。

公开(公告)号：KR101370666B1

公开(公告)日：2014-03-04

申请号：KR1020070022362

申请日：2007-03-07

Applicant: 가부시키가이샤 한도오따이 에네루기 켄큐쇼

Inventor： 야마구치마유미 ,  이즈미코나미

IPC: H01L29/00

CPC classification number: H01L27/1266 ,  B81B3/001 ,  B81C2201/115 ,  H01L27/1214

Abstract: 미소 구조체는 제1 구조층과, 공극부를 사이에 두고 상기 제1 구조층과 마주보고 상기 제1 구조층에 부분적으로 고정된 제2 구조층을 포함한다. 상기 제1 구조층과 상기 제2 구조층의 적어도 한쪽은 변위가 가능하다. 또한, 상기 제1 구조층과 상기 제2 구조층이 대향하는 표면들의 거칠기는 서로 다르다.
미소 구조체, 반도체, 적층, 에칭

公开(公告)号：KR100964970B1

公开(公告)日：2010-06-21

申请号：KR1020070082558

申请日：2007-08-17

Applicant: 한국전자통신연구원

Inventor： 제창한 ,  이명래 ,  정성혜 ,  황건 ,  최창억

IPC: B81B7/00 ,  H01L21/304 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81C2201/115

Abstract: 본 발명은 3 차원 멤즈 미세구조체를 구비하는 멤즈 소자가 구조체 기판 또는 건조판에 고착되는 것을 방지하는 장치에 관한 것으로, 더욱 상세하게는 미세구조체와 구조체 기판 사이에 존재하는 세척액을 제거하면서 발생하는 표면장력으로 미세구조체가 기판에 고착되는 현상을 방지하기 위해 건조판; 및 세척액 제거를 위해 상부에 위치하는 미세구조체로부터 흘러나오는 세척액이 배출되도록 상기 건조판 상부 면에 소정의 높이로 복수 개 형성되는 미세돌기를 포함하는 3 차원 멤즈 미세구조체의 고착방지를 위한 부양 장치에 관한 것이다.
멤즈(MEMS), 미세구조체, 세척액, 고착방지

公开(公告)号：KR1020090105910A

公开(公告)日：2009-10-07

申请号：KR1020097010768

申请日：2008-01-10

Applicant: 소이텍

Inventor： 아스파베르나르 ,  라가헤블랑샤르크리스텔레 ,  수비니콜라

IPC: B81C1/00

CPC classification number: B81B3/001 ,  B81C1/00952 ,  B81C2201/115

Abstract: The invention relates to a process for forming a semiconductor component with a buried rough interface comprising: a) the formation of a rough interface (22) of predetermined roughness R2 in a first semiconductor substrate (16), with: * the selection of a semiconductor substrate (16), presenting a surface (14) with roughness R1>R2, * a thermal oxidation step for this substrate until an oxide-semiconductor interface (22) of roughness R2 is obtained, b) preparation of the oxidized surface of this first semiconductor substrate in view of assembly with a second substrate, c) the assembly of the surface of the oxide and of the second substrate.

Abstract translation: 本发明涉及一种用于形成具有掩埋粗糙界面的半导体部件的方法，包括：a）在第一半导体衬底（16）中形成预定粗糙度R2的粗糙界面（22），其中：*选择半导体 衬底（16），其具有粗糙度R1> R2的表面（14），*用于该衬底的热氧化步骤，直到获得粗糙度R2的氧化物半导体界面（22），b）制备该第一 半导体衬底，与第二衬底组装，c）氧化物和第二衬底的表面的组装。