公开(公告)号：WO01026435A1

公开(公告)日：2001-04-12

申请号：PCT/DE2000/003424

申请日：2000-09-29

IPC: B23K26/40 ,  B23K26/402 ,  B23K101/42 ,  H05K3/00 ,  B23K26/00

CPC classification number: H05K3/0038 ,  B23K26/40 ,  B23K2203/16 ,  B23K2203/30 ,  B23K2203/50 ,  H05K3/0055 ,  H05K2201/0112 ,  H05K2203/0195

Abstract: In order to laser drill laminates which comprise at least one metal layer and at least one dielectric layer made of an organic material, a frequency-doubled Nd vanadate laser is used that has the following parameters: pulse duration /= 30 kHz for the metal layer; >/= 20 kHz for the dielectric layer, and wavelength = 532 nm.

Abstract translation: 用于层压材料的激光钻孔，具有金属层和由有机材料制成，一个frequenzverdopplter钕钒酸盐激光具有下列参数中的至少一个介电层的规划船长：脉冲宽度<40纳秒; 脉冲频率> / = 30千赫的金属层; > / = 20千赫的介电层; 波长= 532纳米。

公开(公告)号：WO01015500A1

公开(公告)日：2001-03-01

申请号：PCT/JP2000/002224

申请日：2000-04-06

IPC: B23K26/00 ,  B23K26/38 ,  B23K101/42 ,  H05K3/00 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/0038 ,  H05K3/025 ,  H05K3/382 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/0358 ,  H05K2203/0315

Abstract: A copper-clad laminate (4) is provided in which holes or recesses can be appropriately formed by laser to create through holes and via holes for connections from an outer copper layer to inner copper layers. A copper-clad laminate (4) used includes outer copper foil whose surface has a laser reflectivity less than 86% and a luminosity (L value) less than 22 when it is covered with fine copper oxide or fine copper particles.

Abstract translation: 提供一种覆铜层压板（4），其中可以通过激光适当地形成孔或凹槽，以形成用于从外铜层到内铜层的连接的通孔和通孔。 使用的覆铜层压板（4）包括外表面铜箔，其表面具有小于86％的激光反射率和小于22的亮度（L值），当其被细铜氧化物或细铜颗粒覆盖时。

公开(公告)号：WO00057680A1

公开(公告)日：2000-09-28

申请号：PCT/EP2000/002560

申请日：2000-03-23

IPC: H05K3/00 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/025 ,  H05K3/0038 ,  H05K3/385 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/0323 ,  H05K2203/0315 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer printed circuit board is disclosed. First a composite foil (10) including a functional copper foil (16) mounted on a carrier foil (12) is laminated on a core board (20). The functional copper foil (16) is less than 10 mu m thick, and has a front side facing the carrier foil (12) and a back side coated with a resin (18). Next, the carrier foil (12) is removed from the functional copper foil (16), in order to uncover the front side of the functional copper foil (16). Then, a CO2 laser source is used to drill holes through the functional copper foil (16) and the resin (18) in order to form microvias (24). It is also disclosed a composite foil (10) comprising four different layers for use in the manufacture of a multilayer printed circuit board.

Abstract translation: 公开了一种制造多层印刷电路板的方法。 首先，在芯板（20）上层叠包括安装在载体箔（12）上的功能性铜箔（16）的复合箔（10）。 功能性铜箔（16）厚度小于10μm，并且具有面向载体箔（12）的前侧和涂覆有树脂（18）的背面。 接下来，为了露出功能性铜箔（16）的前侧，将载体箔（12）从功能性铜箔（16）上除去。 然后，使用CO 2激光源来钻孔通过功能铜箔（16）和树脂（18）以形成微孔（24）。 还公开了一种复合箔（10），其包括用于制造多层印刷电路板的四个不同层。

公开(公告)号：WO1998020531A2

公开(公告)日：1998-05-14

申请号：PCT/US1997018974

申请日：1997-10-22

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： W.L. GORE & ASSOCIATES, INC. ,  NODDIN, David, B.

IPC: H01L21/48

CPC classification number: H01L21/486 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2203/1383

Abstract: A method of forming a through-via (62) in a laminated substrate (60) by applying a polymeric photoabsorptive layer (68) on an exposed bottom surface of a laminated substrate. A through-via is laser drilled in the substrate through the substrate to a bottom of the substrate. The photoabsorptive layer (68) formed on the bottom surface of the substrate is then removed.

Abstract translation: 通过在层叠基板的暴露的底面上施加聚合物光吸收层（68），在层压基板（60）中形成贯通孔（62）的方法。 通孔在衬底中通过衬底被激光钻到衬底的底部。 然后除去形成在基板的底表面上的光吸收层（68）。

公开(公告)号：WO1995029573A1

公开(公告)日：1995-11-02

申请号：PCT/EP1995001514

申请日：1995-04-21

Applicant: SIEMENS S.A. ,  BOONE, Luc ,  DE STEUR, Hubert ,  DUMOULIN, Ann ,  MATTELIN, Antoon ,  VAN PUYMBROECK, Josef ,  HEERMANN, Marcel ,  SCHÖNBERGER, Eduard

Inventor： SIEMENS S.A.

IPC: H05K03/40

CPC classification number: H05K3/243 ,  H05K1/0284 ,  H05K3/0032 ,  H05K3/061 ,  H05K3/181 ,  H05K3/28 ,  H05K2201/0112 ,  H05K2203/0505 ,  H05K2203/0571 ,  H05K2203/0597 ,  H05K2203/107 ,  H05K2203/135

Abstract: The proposed method of forming conductive patterns with solderable or bondable connection regions on insulating substrates involves the following steps: a) application of a metallic coating (M1, M2) to the substrate (U); b) application of an organic galvanically-resistant and etch-resistant protective layer (S) to the metallic coating (M1, M2) in an electrolytic dip bath; c) removal of the protective layer (S) in future connection regions with the aid of laser beam; d) galvanic deposition of an etch-resistant solderable or bondable end surface (E) layer onto the regions of the metallic coating (M1, M2) exposed during step c); e) removal of the protective layer (S) at least in the regions directly adjacent to the future conductive pattern, using a laser beam; f) etching of the regions of metallic coating (M1, M2) exposed during step e) down to the surface of the substrate (U). Only one organic protective layer (S) is thus necessary; this serves as both galvanic resist and etching resist and can if necessary also be applied as a soldering mask. Electrophoretic enamel, which can be structured several times with a laser beam, is used to form the protective layer (S).

Abstract translation: 与可焊接和/或粘合的连接区域的导体图案的上电绝缘，包括以下步骤的衬底的形成：a）将金属化（M1，M2）提供给衬底（U）; b）将一个有机的，电镀和耐蚀刻保护层（S），以在电解金属化（M1，M2）; c）中删除在使用激光辐射随后连接区域的保护层（S）; D）电沉积暴露于金属化（M1，M2）的在工艺步骤c）中的区域的，可焊接和/或粘合的耐蚀刻端面（E）; E）在该区域中去除至少所述保护层（S）直接邻接使用激光辐射将来导体图案; F）蚀刻所述方法在步骤e）（M1，M2）的金属化的区域暴露于该衬底（U）的表面上。 因此，存在仅单个有机保护使用（S），其作为抗镀层和抗蚀剂和如可任选地用作焊料掩模层。 为了形成被使用的保护层（S）电沉积涂料，其可以由多个激光辐射的方式来构造。

公开(公告)号：EP2671919A4

公开(公告)日：2014-12-10

申请号：EP11866389

申请日：2011-11-28

Applicant: PANASONIC CORP

Inventor： KONNO YUKO ,  TAKASHITA HIROMITSU ,  TAKEDA TSUYOSHI ,  FUJIWARA HIROAKI ,  YOSHIOKA SHINGO

IPC: C08L33/02 ,  C08K5/00 ,  C09D125/08 ,  C09D133/08 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

公开(公告)号：EP2112723A3

公开(公告)日：2013-04-17

申请号：EP09005731.6

申请日：2009-04-23

Applicant: Iriso Electronics Co., Ltd.

Inventor： Sugaya, Yujiro ,  Saito, Tomomitsu

IPC: H01R13/66 ,  H01R43/02 ,  H01R13/658 ,  H05K3/32

CPC classification number: H01R43/0221 ,  H01R13/6585 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/328 ,  H05K2201/0112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2203/107 ,  H05K2203/1136

Abstract: An object of the present invention is to provide a laser welding method in which when a laser beam is made incident on a thin film, carbide generated by the heat of the laser beam is prevented from being ejected between respective metallic thin plates. In the present invention, it is configured such that in each of second conductive sections 43 made of a metallic thin plate, a slit 43b which extends from a welding position to the end of the second conductive section 43 is provided, and that the second conductive sections 43 are respectively welded to the terminals 20 by making the laser beam incident at the respective welding positions of the substrate 41 (thin film). Thereby, even when a resin at the laser beam incident portion is carbonized by the thermal energy of the laser beam and thereby the resin carbide is ejected from the welding portion, it is possible to discharge the carbide to the outside from the lower end of the second conductive section 43 via the slit 43b of the second conductive section 43. Thereby, the carbide is prevented from being ejected between the second conductive sections 43 adjacent to each other. As a result, it is possible to effectively prevent the lowering of the insulation resistance between the respective second conductive sections 43 due to the carbide.

公开(公告)号：EP2045635A1

公开(公告)日：2009-04-08

申请号：EP07828160.7

申请日：2007-07-19

Applicant: Hitachi Chemical Company, Ltd.

Inventor： SHIBATA, Tomoaki ,  MIYATAKE, Masato ,  TAKAHASHI, Atsushi ,  YAMAGUCHI, Masatoshi

IPC: G02B6/12 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H05K3/0023 ,  H05K2201/0112 ,  H05K2201/0209

Abstract: The present invention provides a hybrid optical/electrical circuit board in which an optical waveguide prepared by an exposing and developing step is combined with an electric circuit, wherein a printed wiring board containing an inorganic filler and a light absorber is used, and it has an optical waveguide core pattern having a high resolution and makes it possible to raise a density of optical wiring.

Abstract translation: 本发明提供了一种混合光电路板，其中通过曝光和显影步骤制备的光波导与电路组合，其中使用包含无机填料和光吸收体的印刷线路板，并且其具有 光波导芯图案具有高分辨率并且可以提高光布线的密度。

公开(公告)号：EP1594351A3

公开(公告)日：2008-05-14

申请号：EP05009792.2

申请日：2005-05-04

Applicant: National Starch and Chemical Investment Holding Corporation

Inventor： McCormick, Demetrius ,  Nowicki, James W. ,  Cheng, Chih-Min ,  O'Hara, Wanda

IPC: H05K3/32 ,  H05K1/16 ,  H01B1/20 ,  H01L21/60

CPC classification number: H05K3/321 ,  B82Y30/00 ,  H01B1/20 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29424 ,  H01L2224/29447 ,  H01L2224/29488 ,  H01L2224/83868 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/323 ,  H05K2201/0112 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05032 ,  H01L2924/05341 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.

公开(公告)号：EP1559740A1

公开(公告)日：2005-08-03

申请号：EP05000974.5

申请日：2005-01-19

Applicant: Mitsubishi Polyester Film GmbH

Inventor： Kliesch, Holger, Dr. ,  Kiehne, Thorsten, Dr. ,  Hilkert, Gottfried, Dr. ,  Hora, Franz

IPC: C08J5/18 ,  C08L67/02 ,  C08K3/00 ,  C08K3/22 ,  C23C18/16 ,  H05K3/18

CPC classification number: B32B27/18 ,  B29C55/023 ,  B29K2067/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B32B2272/00 ,  B32B2305/70 ,  B32B2309/105 ,  B32B2425/00 ,  B32B2457/08 ,  C08J3/22 ,  C08J5/18 ,  C08J2367/02 ,  C08K3/013 ,  C23C18/14 ,  H05K1/0393 ,  H05K3/105 ,  H05K3/185 ,  H05K2201/0112 ,  H05K2203/107 ,  Y10T428/259 ,  Y10T428/265 ,  Y10T428/31786 ,  C08L67/02

Abstract: Die Erfindung betrifft eine ein- oder mehrschichtige, orientierte Folie aus einem Polyester, der ein Additiv enthält, welches unter Bestrahlung mit elektromagnetischer Strahlung Metallkeime bildet, an denen sich in weiteren Prozessschritten weiteres Metall anlagern lässt. Die Folie enthält weiterhin ein weiteres, Strahlung absorbierendes Material. Die Erfindung betrifft ferner ein Verfahren zur Herstellung dieser Folie und ihre Verwendung in Leiterplatten, Flachbandkabeln, Smartcards, RFID-Labels, Folientastaturen und folienbasierten Schaltungen aller Art.

Abstract translation: 用厚度为5至500微米，包括单或多层至少单轴拉伸热塑性聚酯膜，基于所述膜的各情况下，可以通过电磁辐射能够活化的金属化合物的0.5-15％（重量），和 0.1-15重量吸收辐射的材料的％。 因此独立claimsoft包括用于生产单层或多层至少单轴拉伸热塑性聚酯膜，其特征在于通过一平膜挤出过程中，熔融物（或多个）对应于所述膜的各个层（S），冷却该 所得电影，再加热它，并在一个方向（S），和热定型定向它。