公开(公告)号：WO2004100186A1

公开(公告)日：2004-11-18

申请号：PCT/US2004/013226

申请日：2004-04-30

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： BLECKER, Paul, N. ,  MANIRAJ, Sirikhit ,  PINEDA, Martin, ,  VRANICAR, Anthony ,  YANKELLO, Francis, M. ,  WASILEWSKI, Frank

IPC: H01C1/144

CPC classification number: H01C1/016 ,  H01C1/1406 ,  H01C1/144 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5, 7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion, The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.

Abstract translation: 一种适于表面安装在基板（19）上的电路保护装置（31）。 该装置具有由导电聚合物组合物构成并位于第一和第二电极（5,7）之间的层状PTC电阻元件（3）。 连接到第一电极的是包含导电材料的第一电端子（33），其具有借助于第一连接部分（47）连接到第一柔性部分（39）的第一附接部分（35）。 第一柔性部分的至少一部分不与第一电极连接。 第一附接部分与第一连接部分和第一柔性部分中的至少一个共面。第一附接部分可以包含狭槽（49）和固定铰链部分（51）。 当通过从第一端子延伸的安装部件（41）将装置安装在基板上时，尽管将安装部件刚性地附接到基板上，但是第一柔性部分允许导电聚合物的收缩和膨胀。

公开(公告)号：WO1987001007A1

公开(公告)日：1987-02-12

申请号：PCT/DE1986000110

申请日：1986-03-14

Applicant: ROBERT BOSCH GMBH ,  FASSEL, Reinhard ,  HAUBNER, Georg ,  ZÖBL, Hartmut

Inventor： ROBERT BOSCH GMBH

IPC: H05K07/20

CPC classification number: H05K9/0018 ,  H05K1/0203 ,  H05K3/3447 ,  H05K7/20854 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10454 ,  H05K2201/10522

Abstract: Electric switchgear (10) with at least one power component (12) in a fully-insulated casing (14), and provided with a heat sink (21) and connection pieces (14) emerging from the casing (14). To evacuate to the outside the heat generated in the power components (12) through the connection elements (13) the heat sink (21) is connected over a large contact surface with several connection elements (13) in order to transfer the heat, while ensuring electrical insulation. The invention can be used generally in order to dissipate heat from electrical equipment with a fully insulated casing and preferably in motor vehicles, where it is subjected to exacting requirements owing to the presence of dirt and damp.

Abstract translation: 具有在全绝缘壳体（14）中的至少一个动力部件（12）的电气开关装置（10），并且设置有从所述壳体（14）露出的散热器（21）和连接件（14）。 为了通过连接元件（13）将功率部件（12）中产生的热量排出到外部，散热器（21）在大的接触表面上连接有多个连接元件（13）以便传递热量，同时 确保电气绝缘。 本发明通常可以用于从具有完全绝缘的外壳的电气设备中散热，优选在机动车辆中，由于存在污物和潮湿而受到严格要求。

公开(公告)号：KR101565643B1

公开(公告)日：2015-11-03

申请号：KR1020130048125

申请日：2013-04-30

Applicant: 삼성전기주식회사

Inventor： 김위헌 ,  오대복 ,  이재훈 ,  김상혁 ,  최재열

IPC: H01G4/12 ,  H01G4/30 ,  H01G2/06

CPC classification number: H01G4/01 ,  H01G2/06 ,  H01G4/005 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10454

Abstract: 본발명은적층세라믹전자부품및 그실장기판에관한것으로, 유전체층을포함하며, 길이를 L, 폭을 W 및두께를 T라할때, T/W 〉1.0을만족하는육면체형상의세라믹본체; 상기유전체층을사이에두고상기세라믹본체의양 단면을통해번갈아노출되도록형성된복수의제1 및제2 내부전극을포함하여용량이형성되는액티브층; 상기액티브층의상부에형성된상부커버층; 상기액티브층의하부에형성되며, 상기상부커버층에비해두꺼운두께를갖는하부커버층; 및상기세라믹본체의양 단면을덮도록형성된제1 및제2 외부전극;을포함하며, 상기하부커버층의두께를 Tb라하면, 0.03 ≤ Tb/T ≤ 0.25를만족하는적층세라믹전자부품을제공한다.

公开(公告)号：KR1020140129610A

公开(公告)日：2014-11-07

申请号：KR1020130048125

申请日：2013-04-30

Applicant: 삼성전기주식회사

Inventor： 김위헌 ,  오대복 ,  이재훈 ,  김상혁 ,  최재열

IPC: H01G4/12 ,  H01G4/30 ,  H01G2/06

CPC classification number: H01G4/01 ,  H01G2/06 ,  H01G4/005 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10454

Abstract: 본 발명은 적층 세라믹 전자부품 및 그 실장 기판에 관한 것으로, 유전체층을 포함하며, 길이를 L, 폭을 W 및 두께를 T라 할때, T/W 〉1.0을 만족하는 육면체 형상의 세라믹 본체; 상기 유전체층을 사이에 두고 상기 세라믹 본체의 양 단면을 통해 번갈아 노출되도록 형성된 복수의 제1 및 제2 내부 전극을 포함하여 용량이 형성되는 액티브층; 상기 액티브층의 상부에 형성된 상부 커버층; 상기 액티브층의 하부에 형성되며, 상기 상부 커버층에 비해 두꺼운 두께를 갖는 하부 커버층; 및 상기 세라믹 본체의 양 단면을 덮도록 형성된 제1 및 제2 외부 전극;을 포함하며, 상기 하부 커버층의 두께를 Tb라 하면, 0.03 ≤ Tb/T ≤ 0.25를 만족하는 적층 세라믹 전자부품을 제공한다.

Abstract translation: 本发明涉及一种多层陶瓷电子部件及其安装基板。 提供了包括六边形陶瓷体的多层陶瓷电子部件，其包括电介质层，并且具有满足T / W> 1.0的长度（L），宽度（W）和厚度（T） 包括多个第一和第二内部电极的有源层，其通过插入介电层交替地暴露于陶瓷体的两个横截面，并形成容量; 顶层，形成在有源层的上侧; 底层覆盖层，其形成在有源层的下侧，并且与顶盖层相比具有厚的厚度; 以及覆盖陶瓷体的两个截面的第一和第二外部电极。 如果底层的厚度为Tb，则满足0.03 <= Tb / T <= 0.25。

公开(公告)号：KR101052648B1

公开(公告)日：2011-07-28

申请号：KR1020057020707

申请日：2004-04-30

Applicant: 티이 커넥티비티 코포레이션

Inventor： 베커폴엔. ,  마니레이시릭히트 ,  피네다마틴 ,  브라니카안토니 ,  얀켈로프란시스엠. ,  바시레브스키프랭크

IPC: H01C1/144 ,  H01C1/14 ,  H01C1/016

CPC classification number: H01C1/016 ,  H01C1/1406 ,  H01C1/144 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y02P70/613

Abstract: 본 발명은 기판(19) 위에 표면 장착을 하기에 적합한 회로 보호 장치(31)에 관한 것이다. 상기 장치는 전도성 폴리머 조성으로 이루어진 층상의 PTC 저항 소자(3)를 가지며 제1 및 제2 전극(5, 7) 사이에 위치한다. 제1 연결부(47)에 의해 제1 유연부(39)에 연결되는 제1 장착부(35)를 가지는 전기 전도성 물질을 포함하는 제1 전기 단자(33)는 제1 전극에 장착된다. 제1 유연부의 적어도 일부는 제1 전극에 장착되지 아니한다. 제1 장착부는 제1 연결부 및 제1 유연부의 적어도 하나와 동일 평면에 있다. 제1 장착부는 슬롯(49) 및 고체 힌지부(51)를 포함할 수 있다. 장치가 제1 단자로부터 연장되는 장착 요소(41)에 의해 기판에 장착될 때, 기판에 장착 요소의 견고한 장착에도 불구하고 제1 유연부는 전도성 폴리머의 수축 및 팽창을 가능하게 한다.
회로 보호 장치, 제1 단자, 제2 단자, 제1 장착부, 제1 유연부, 제1 연결부, 제2 장착부, 제2 유연부, 제2 연결부

Abstract translation: 本发明涉及适用于表面安装在基板（19）上的电路保护装置（31）。 该装置具有导电聚合物组合物的层状PTC电阻元件3，并位于第一和第二电极5,7之间。 包括具有通过第一连接部分47连接到第一柔性部分39的第一安装部分35的导电材料的第一电端子33安装到第一电极。 第一柔性部分的至少一部分未附接至第一电极。 第一安装部分与第一连接部分和第一柔性部分中的至少一个齐平。 第一安装部分可以包括狭槽49和实心铰链部分51。 当通过从第一端子延伸的安装元件41将装置安装到基板上时，尽管将安装元件牢固地安装在基板上，第一柔性部分仍能够使导电聚合物收缩和膨胀。

公开(公告)号：WO2017111838A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/000396

申请日：2015-12-26

Applicant: INTEL CORPORATION

Inventor： LAMBERT, William, J. ,  ROY, Mihir, K. ,  MANUSHAROW, Mathew, J.

IPC: H01L23/48

CPC classification number: H05K1/185 ,  H05K3/0047 ,  H05K3/3436 ,  H05K2201/10454 ,  H05K2201/10651

Abstract: Embodiments are generally directed to vertically embedded passive components. An embodiment of a device includes a semiconductor die; and a package coupled with the semiconductor die. The package includes one or more passive components connected with the semiconductor die, the one or more passive components being embedded vertically in the package substrate, each of the passive components including a first terminal and a second terminal. A first passive component is embedded in a through hole drilled in the package, the first terminal of the first passive component being connected to the semiconductor die by a via through an upper buildup layer on the package.

Abstract translation: 实施例通常针对垂直嵌入的无源组件。 器件的实施例包括半导体管芯; 以及与半导体管芯耦合的封装。 封装包括与半导体管芯连接的一个或多个无源组件，所述一个或多个无源组件垂直嵌入封装基板中，每个无源组件包括第一端子和第二端子。 第一无源部件嵌入在封装中钻出的通孔中，第一无源部件的第一端子通过穿过封装上的上堆积层的通孔连接至半导体管芯。

公开(公告)号：WO2014051848A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/052389

申请日：2013-07-26

Applicant: APPLE INC.

Inventor： LI, Xingqun ,  RIBAS, Carlos ,  PYPER, Dennis, R. ,  FOSTER, James, H. ,  FISHER, Joseph, R., Jr. ,  MULLINS, Scott, P. ,  MAYO, Sean, A. ,  CHEN, Wyeman

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L2224/16235 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/11 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4614 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  Y10T29/49146

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

Abstract translation: 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入器安装到印刷电路板，并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。

公开(公告)号：WO2013163416A1

公开(公告)日：2013-10-31

申请号：PCT/US2013/038200

申请日：2013-04-25

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： MCCONNELL, John, E. ,  WEBSTER, Alan, P. ,  BULTITUDE, John ,  GURAV, Abhijit

IPC: H01L23/34 ,  H05K7/20

CPC classification number: H05K1/0271 ,  H01C1/014 ,  H01C1/14 ,  H01C7/18 ,  H01G2/06 ,  H01G4/232 ,  H01G4/38 ,  H05K1/181 ,  H05K1/182 ,  H05K3/30 ,  H05K3/301 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10454 ,  Y10T29/49121

Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.

Abstract translation: 描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。 分立的电子设备具有带终端和引线框的电子无源部件。 补偿兼容部件在终端和引线框架之间。 补偿柔性部件具有复合芯和复合芯上的第一导体。 第一个导线与端子电接触。 第二导体也在复合芯上，其中第二导体与引线框架电接触。

公开(公告)号：WO2013023926A3

公开(公告)日：2013-10-17

申请号：PCT/EP2012065083

申请日：2012-08-01

Applicant: SMA SOLAR TECHNOLOGY AG ,  JANSSEN EBERHARD ,  MARSCHANG VOLKER ,  ROECHER BURKHARD

Inventor： JANSSEN EBERHARD ,  MARSCHANG VOLKER ,  ROECHER BURKHARD

IPC: H05K1/02 ,  H01G2/04 ,  H01G2/06 ,  H01G2/14 ,  H01R12/70 ,  H01R13/66 ,  H02M7/00 ,  H05K3/22 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K7/1417 ,  H01G2/06 ,  H01G2/106 ,  H01G2/14 ,  H02M7/003 ,  H05K1/0201 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0254 ,  H05K1/0268 ,  H05K3/222 ,  H05K3/301 ,  H05K3/325 ,  H05K7/14 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10454 ,  H05K2201/10492 ,  Y10T29/49004

Abstract: An electronic device includes a housing (120), a circuit board (100), a plurality of holders (180) having mechanical connectors to the housing (120) and to the circuit board (100) and mechanically fixing the circuit board (100) within the housing (120), and at least one capacitor (130) having a first electrode (131), a second electrode (132) and a dielectric arranged between the first and second electrodes (131, 132). The first electrode (131) is electrically connected to a contact (110) on the circuit board (100), and the second electrode (132) is electrically connected to the housing (120). The at least one capacitor (130) is part of one of the plurality of holders (180); and the dielectric of the capacitor (130) is part of a thermal insulation between the connectors to the circuit board (100) and to the housing (120).

Abstract translation: 一种电子装置，包括壳体（120），电路板（100），具有与壳体（120）和电路板（100）的机械连接器并机械固定电路板（100）的多个保持器（180） （120）内，以及至少一个具有第一电极（131），第二电极（132）和布置在第一和第二电极（131,132）之间的电介质的电容器（130）。 第一电极（131）电连接到电路板（100）上的触点（110），并且第二电极（132）电连接到外壳（120）。 所述至少一个电容器（130）是所述多个保持器（180）中的一个的一部分; 并且电容器（130）的电介质是电路板（100）的连接器和壳体（120）之间的热绝缘的一部分。

公开(公告)号：WO2008055708A3

公开(公告)日：2008-07-10

申请号：PCT/EP2007009854

申请日：2007-11-09

Applicant: FRAUNHOFER GES FORSCHUNG ,  POLITYKO DMITRY DAVID ,  WENZEL STEPHAN ,  JUNG ERIK ,  HEFER JAN ,  NIEDERMAYER MICHAEL ,  GUTTOWSKI STEPHAN

Inventor： POLITYKO DMITRY DAVID ,  WENZEL STEPHAN ,  JUNG ERIK ,  HEFER JAN ,  NIEDERMAYER MICHAEL ,  GUTTOWSKI STEPHAN

IPC: H05K1/18 ,  H01L23/538

CPC classification number: H05K1/144 ,  H05K1/145 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

Abstract: The invention relates to a microelectronic subassembly comprising at least two circuit support layers (1, 2, 3) which are disposed parallel on top of one another, are formed by different sections of a folded substrate that is flexible in at least some areas, are equipped with electronic components, and are mechanically interconnected by means of at least one surface-mounted component (4, 4') that is part of a circuit on at least one of the circuit support layers (1, 2, 3). The invention further relates to a method for producing such a microelectronic subassembly.

Abstract translation: 本发明涉及一种微电子组件，包括至少两个平行的叠置的电路载体层（1，2，3），它们由一个至少部分柔性的折叠基板的不同部分上形成，并装有电子部件，其中所述电路载体层（1，2，3 ）通过作为电路载体层（1,2,3）中的至少一个上的电路的一部分的至少一个表面安装部件（4,4'）机械地彼此连接。 本发明还涉及用于制造这种微电子组件的方法。