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    Underfill film having thermally conductive sheet
    71.
    发明授权
    Underfill film having thermally conductive sheet 有权
    具有导热片的底部填充膜

    公开(公告)号：US07943435B2

    公开(公告)日：2011-05-17

    申请号：US12164085

    申请日：2008-06-29

    Applicant: Keiji Matsumoto

    Inventor： Keiji Matsumoto

    IPC: H01L21/44 ,  H01L21/48

    CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

    Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

    Abstract translation: 用于电子设备的底部填充膜包括导热片。 电子设备可以包括印刷电路板，电气部件，底部填充物和导热片。 底部填料位于电路板和组件之间。 导热片位于底部填充物内，并与底部填充物一起构成底部填充膜。 该装置可以包括将组件固定到电路板的焊料凸块，底部填充膜具有其中焊料凸块对准的孔。 电路板底面可能有焊锡凸块，有助于散热。 电路板上可能有散热片，导热片固定到散热片上，有助于散热。 导热片可以固定到促进散热的底盘上。 因此，导热片促进了从部件到至少电路板的散热。

    Optical transceiver with frame ground and signal ground isolated with parallel plate capacitor
    72.
    发明申请
    Optical transceiver with frame ground and signal ground isolated with parallel plate capacitor 失效
    带有接地和信号接地隔离的平行板电容器的光收发器

    公开(公告)号：US20090123116A1

    公开(公告)日：2009-05-14

    申请号：US12289034

    申请日：2008-10-17

    Applicant: Keiji Tanaka ,  Kenichiro Uchida

    Inventor： Keiji Tanaka ,  Kenichiro Uchida

    IPC: G02B6/36

    CPC classification number: G02B6/4201 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/147 ,  H05K1/162 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/10121 ,  H05K2201/10575

    Abstract: A technique is disclosed for an optical transceiver, where the frame ground is electrically isolated from the signal ground in a low frequency region and is conducted in a high frequency region, without applying a capacitor as a substantial circuit component. The transceiver includes a TOSA whose housing is grounded with the FG and connected with the driver with a FPC board. On the FPC board is formed with a parallel plate capacitor, one conductive pattern on the one surface is connected with the housing of the TOSA, while the other pattern in the opposite surface is connected with the SG. This parallel plate capacitor isolates the FG from the SG in low frequencies, while conducts the FG with the SG in high frequencies.

    Abstract translation: 公开了一种用于光收发器的技术，其中框架地与低频区域中的信号地电隔离并且在高频区域中传导，而不施加电容器作为实质电路部件。 收发器包括TOSA，其外壳与FG接地，并与FPC板与驱动器连接。 在FPC基板上形成有平行平板电容器，一个表面上的一个导体图案与TOSA的外壳相连，而相反表面的另一个图案与SG连接。 这种平行电容器将FG与SG在低频下隔离，同时以高频率将SG与SG进行导通。

    Underfill film having thermally conductive sheet
    73.
    发明申请
    Underfill film having thermally conductive sheet 审中-公开

    公开(公告)号：US20080067670A1

    公开(公告)日：2008-03-20

    申请号：US11946709

    申请日：2007-11-28

    Applicant: Keiji Matsumoto

    Inventor： Keiji Matsumoto

    IPC: H01L23/02

    CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

    Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

    Assembly of ICs with blocking capacitors and printed circuit boards
    76.
    发明申请
    Assembly of ICs with blocking capacitors and printed circuit boards 审中-公开
    装配封闭电容器和印刷电路板的IC

    公开(公告)号：US20040125516A1

    公开(公告)日：2004-07-01

    申请号：US10669640

    申请日：2003-09-25

    Inventor： Uwe Brand ,  Heinz Ibowski

    IPC: H02H007/16

    CPC classification number: H05K1/0231 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K3/305 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10575 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A method and arrangement for the advantageous assembly of blocking capacitors for an integrated circuit. An integrated circuit includes a BGA housing having a plurality of preferably ball-shaped connector pins. A printed circuit board is also provided, having conductor paths to which the housing of the integrated circuit is electrically and mechanically contacted by means of the connector pins. At least one blocking capacitor is spatially arranged between two connector pins of the housing and also between the printed circuit board and housing of the integrated circuit.

    Abstract translation: 用于集成电路的隔离电容器的有利组装的方法和装置。 集成电路包括具有多个优选球形连接器针脚的BGA壳体。 还提供了一种印刷电路板，其具有导体路径，集成电路的壳体通过连接器引脚电气机械接触到该导体路径。 在壳体的两个连接器插脚之间以及印刷电路板和集成电路的壳体之间空间地布置至少一个隔离电容器。

    Electrical connector with solder plate and pegs for PC board mounting
    77.
    发明授权
    Electrical connector with solder plate and pegs for PC board mounting 失效
    带焊盘的电连接器和用于PC板安装的钉

    公开(公告)号：US06716060B2

    公开(公告)日：2004-04-06

    申请号：US10213871

    申请日：2002-08-06

    Applicant: Martin Gollhofer ,  Roland Etzkom ,  Wolfgang Zeeb ,  Wolfgang Hutt ,  Michael Stache

    Inventor： Martin Gollhofer ,  Roland Etzkom ,  Wolfgang Zeeb ,  Wolfgang Hutt ,  Michael Stache

    IPC: H01R1366

    CPC classification number: H01R12/7052 ,  H05K3/306 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10575 ,  H05K2201/10598

    Abstract: An electrical connector is constructed for ease of fixing a sheet metal solder plate (25) to the bottom surface portion (70) of the connector insulator frame (12), so the solder plate can be soldered to one or more traces on a circuit board to hold down the frame. The frame has downwardly extending pegs (33-35) and the solder plate has corresponding peg-receiving holes (28-30). The mount plate forms at least one tongue (48, 49) at each of its holes, each tongue projecting against one of the pegs to form an interference fit against the peg that prevents removable of the solder plate from the insulator pegs. Each peg has a vertical slot (38, 39) that receives a nose (50, 51) at the end of the tongue.

    Abstract translation: 电连接器被构造为便于将金属板焊接板（25）固定到连接器绝缘体框架（12）的底表面部分（70），使得焊接板可以焊接到电路板上的一个或多个迹线 按住框架。 框架具有向下延伸的销钉（33-35），并且焊接板具有对应的钉接收孔（28-30）。 安装板在其每个孔处形成至少一个舌部（48,49），每个舌片突出抵靠其中一个栓钉，以形成与栓钉的过盈配合，从而防止焊料板从绝缘钉上移除。 每个钉具有在舌头末端接收鼻子（50,51）的垂直槽（38,39）。

    Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
    78.
    发明授权
    Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards 失效
    低成本，大规模RF混合封装，可以简单的组装到混合信号印刷电路板上

    公开(公告)号：US06417747B1

    公开(公告)日：2002-07-09

    申请号：US09935496

    申请日：2001-08-23

    Applicant: Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

    Inventor： Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

    IPC: H01P100

    CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

    Abstract: An RF interconnect is incorporated in RF module packages for direct attachment onto a multi-layer PWB using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing including a metal bottom wall structure. The module includes a plurality of RF interconnects, which provide RF interconnection between the package and the PWB. Each interconnect includes a feedthrough center pin protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator. The center pin is surrounded with a ring of shield pins attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes formed in the PWB, and make contact with fuzz button interconnects disposed in the holes. Circuitry connects the fuzz button interconnects to appropriate levels of the PWB for grounding and RF signal conduction.

    Abstract translation: RF互连结合在RF模块封装中，以使用可压缩中心导体（Fuzz按钮）互连直接连接到多层PWB上。 该模块具有以微波频率工作的电路。 模块封装包括金属外壳，其包括金属底壁结构。 该模块包括多个RF互连，其在封装和PWB之间提供RF互连。 每个互连件包括穿过形成在金属底壁中的开口突出的馈通中心销，由隔离绝缘子提供隔离。 中心销被围绕着一个安装在模块壳体底壁外表面的屏蔽销圈。 销可插入形成在PWB中的孔中，并与布置在孔中的绒头按钮互连接触。 电路将毛绒按钮互连连接到PWB的适当级别，用于接地和RF信号传导。

    Method of mounting electric part onto a substrate
    80.
    发明授权
    Method of mounting electric part onto a substrate 失效
    将电气部件安装在基板上的方法

    公开(公告)号：US4506443A

    公开(公告)日：1985-03-26

    申请号：US383006

    申请日：1982-05-28

    Applicant: Tsukasa Itoh

    Inventor： Tsukasa Itoh

    IPC: H05K1/18 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H05K3/306 ,  H05K1/184 ,  H05K3/305 ,  H05K3/3415 ,  H05K2201/10575 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1189 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144

    Abstract: A chip mounting substrate which comprises inserting holes formed in a substrate for inserting chips in, a sheet provided on the top surface of the substrate to cover the holes and having adhesivity on the inner surface covering the holes, and wiring pattern provided on the back surface of the substrate so as to be associated with electrode portions of the chips inserted in the inserting holes, so that after inserting the chips in the inserting holes to thereby temporarily adhere and fix them by the sheet, the electrode portion of each chip and the associated wiring pattern are soldered and connected together.

    Abstract translation: 一种芯片安装基板，包括插入形成在用于插入芯片的基板中的孔，设置在基板的顶表面上的片材以覆盖孔并且在覆盖孔的内表面上具有粘合性，以及设置在背面上的布线图案 以便与插入插入孔中的芯片的电极部分相关联，使得在将芯片插入插入孔中之后，通过片材临时粘附和固定芯片，每个芯片的电极部分和相关联的 接线图案被焊接并连接在一起。

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