公开(公告)号：US20160029481A1

公开(公告)日：2016-01-28

申请号：US14809195

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: H05K1/03 ,  F21V29/85 ,  H05K1/02 ,  F21V29/83 ,  H05B33/06 ,  H05B33/12 ,  F21V29/70

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: A display device is provided. The display device includes a light engine having light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the light emitting components for improved cooling of the heat generated by the light emitting component and surrounding devices.

Abstract translation: 提供显示装置。 显示装置包括具有安装到具有柔性石墨基板的柔性电路板的发光部件的光引擎。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 高的平面内导热石墨衬底提供增强的传热能力以有效地将热量从发光部件移开，以改善由发光部件和周围器件产生的热量的冷却。

公开(公告)号：US20160029480A1

公开(公告)日：2016-01-28

申请号：US14809193

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: H05K1/03 ,  H05K1/09

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: A flexible circuit board having a flexible graphite substrate is provided. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. Electronic components are mounted to the flexible circuit board to form a circuit arrangement. A thermally conductive conduit can be disposed in thermal and physical contact with a surface of the electronic component and the surface of the flexible graphite substrate to. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating electronic component and surrounding devices.

Abstract translation: 提供了具有柔性石墨基板的柔性电路板。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 电子部件安装到柔性电路板上以形成电路装置。 导热导管可以与电子部件的表面和柔性石墨基板的表面热物理接触地布置。 高平面导热石墨基板提供增强的传热能力，以有效地将热量从电子部件移开，以改善发热电子部件和周围装置的冷却。

公开(公告)号：US20160025280A1

公开(公告)日：2016-01-28

申请号：US14809194

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: F21K99/00 ,  H05K1/03 ,  H05K1/09 ,  F21V29/83

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: An LED light arrangement is provided. The light arrangement includes LED light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed an the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating light emitting component and surrounding devices.

Abstract translation: 提供LED灯布置。 光装置包括安装在具有柔性石墨基板的柔性电路板上的LED发光部件。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 高平面导热石墨基板提供增强的传热能力，以有效地将热量从电子部件移开，以改善发热元件和周围设备的冷却。

公开(公告)号：US20150043181A1

公开(公告)日：2015-02-12

申请号：US14523245

申请日：2014-10-24

Applicant: TESSERA, INC.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206

Abstract: The present disclosure is directed to a microelectronic assembly that includes first and second microelectronic elements, signal leads, one or more jumper leads, and a dielectric element that has first and second apertures. The signal leads may be connected to one or more of the microelectronic elements and extend through the one or more of the first or second apertures to conductive elements on the dielectric element. The jumper leads may extend through the first aperture and be connected to a contact of the first microelectronic element. The one or more jumper leads may span over the second aperture and be connected to a conductive element on the dielectric element.

Abstract translation: 本公开涉及包括第一和第二微电子元件，信号引线，一个或多个跳线以及具有第一和第二孔的电介质元件的微电子组件。 信号引线可以连接到一个或多个微电子元件，并且延伸通过第一或第二孔中的一个或多个到电介质元件上的导电元件。 跳线可以延伸穿过第一孔径并连接到第一微电子元件的触点。 一个或多个跨接线可以跨过第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US08722422B2

公开(公告)日：2014-05-13

申请号：US13415291

申请日：2012-03-08

Applicant: Dennis A. Briggs

Inventor： Dennis A. Briggs

IPC: B01L99/00 ,  F04B13/00 ,  F04B43/00

CPC classification number: H05K3/321 ,  F17D3/00 ,  H01L21/4867 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/225 ,  H05K3/3463 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2203/176 ,  Y10T137/0396 ,  Y10T436/25 ,  Y10T436/2575 ,  H01L2924/00

Abstract: This invention describes a method for pumping or delivering fluids utilizing a flexible vessel subject to controlled pressures within another pressure vessel. The pressure vessel can be sourced with positive and/or negative (e.g., vacuum) pressure.

Abstract translation: 本发明描述了一种利用在另一个压力容器内承受受控压力的柔性容器泵送或输送流体的方法。 压力容器可以采用正和/或负（例如，真空）压力。

公开(公告)号：US08466564B2

公开(公告)日：2013-06-18

申请号：US13278506

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L23/48 ,  H01L29/40

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof; a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and an electrically conductive plane attached to the dielectric element and at least partially positioned between the first and second apertures, the electrically conductive plane being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements.

Abstract translation: 微电子组件包括具有至少一个孔的电介质元件和其上的导电元件，其中包括在电介质元件的第二表面处暴露的端子; 第一微电子元件，其具有后表面和面向介电元件的前表面，所述第一微电子元件具有在其前表面处暴露的多个触点; 第二微电子元件，其具有背表面和面向第一微电子元件的后表面的前表面，第二微电子元件具有暴露在前表面处并突出超过第一微电子元件的边缘的多个触点; 以及连接到电介质元件并且至少部分地定位在第一和第二孔之间的导电平面，导电平面与第一或第二微电子元件中的至少一个的一个或多个触点电连接。

公开(公告)号：US08300425B2

公开(公告)日：2012-10-30

申请号：US12184086

申请日：2008-07-31

Applicant: Nader Gamini ,  Joseph C. Fjelstad

Inventor： Nader Gamini ,  Joseph C. Fjelstad

IPC: H05K7/02

CPC classification number: H05K1/185 ,  H01L25/105 ,  H01L25/16 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H05K1/023 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.

Abstract translation: 公开了一种提高电路组件中的电气部件的密度的装置。 电子部件202,204被堆叠成使得它们彼此重叠并且被封装在电子绝缘材料104中。所得到的子组件可以集成到印刷电路板或反向互连工艺组件中。

公开(公告)号：US20120167998A1

公开(公告)日：2012-07-05

申请号：US13415291

申请日：2012-03-08

Applicant: Dennis A. Briggs

Inventor： Dennis A. Briggs

IPC: F17D3/00

CPC classification number: H05K3/321 ,  F17D3/00 ,  H01L21/4867 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/225 ,  H05K3/3463 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2203/176 ,  Y10T137/0396 ,  Y10T436/25 ,  Y10T436/2575 ,  H01L2924/00

Abstract: This invention describes a method for pumping or delivering fluids utilizing a flexible vessel subject to controlled pressures within another pressure vessel. The pressure vessel can be sourced with positive and/or negative (e.g., vacuum) pressure.

Abstract translation: 本发明描述了一种利用在另一压力容器内经受受控压力的柔性容器来泵送或输送流体的方法。 压力容器可以采用正和/或负（例如，真空）压力。

公开(公告)号：US07878834B2

公开(公告)日：2011-02-01

申请号：US12424341

申请日：2009-04-15

Applicant: Neil S. Sherman ,  Brian H. Steuer

Inventor： Neil S. Sherman ,  Brian H. Steuer

IPC: H01R13/62

CPC classification number: H01R12/57 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

Abstract: A connector device for maintaining a desired spatial relationship for spatially and securely connecting to a platform, such as a circuit board, in an efficient manner. The connector device generally includes a body portion separated from the secondary device, a plurality of legs extending from the body portion for removably attaching the body portion to the secondary device, wherein the plurality of legs each include a foot member insertable within an opening of the secondary device for grasping the secondary device and at least one contact pin extending from the body portion to contact the secondary device on an opposite surface as the foot member. The contact pin maintains the separation between the body portion and the secondary device and includes a spring for providing a counter force against the secondary device with respect to the foot member.

Abstract translation: 一种连接器装置，用于以有效的方式保持用于空间和牢固地连接到平台（例如电路板）的期望的空间关系。 连接器装置通常包括与次级装置分离的主体部分，从主体部分延伸的多个腿部，用于可拆卸地将主体部分附接到次要装置，其中多个腿部各自包括可插入到第二装置的开口内的脚部件 用于抓握次级装置的次级装置和从主体部分延伸的至少一个接触销，以在与脚部件相反的表面上接触次级装置。 接触销保持主体部分和次要装置之间的分离，并且包括用于相对于脚部构件提供抵抗次级装置的反作用力的弹簧。

公开(公告)号：US07832897B2

公开(公告)日：2010-11-16

申请号：US12110344

申请日：2008-04-27

Applicant: Chin-Long Ku

Inventor： Chin-Long Ku

IPC: F21S2/00

CPC classification number: F21S2/005 ,  F21V21/005 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10628 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED unit includes a plurality of LEDs, each of which includes a base, an LED die mounted on the base, a pair of leads penetrating the base to electrically connect with the LED die, a plurality of legs extending radially from a periphery of the base, a plurality of cutouts defined in the base and an encapsulant enveloping the LED die. The pair of leads of each LED are joined to corresponding leads of adjacent LEDs to realize electrical connections of the LEDs, while the legs of each LED are fitted into corresponding cutouts of the bases of adjacent LEDs to realize mechanical connections of the LEDs.

Abstract translation: LED单元包括多个LED，每个LED包括基座，安装在基座上的LED管芯，穿过基座的一对引线以与LED管芯电连接;多个引脚， 基座，限定在基座中的多个切口和封装LED管芯的密封剂。 每个LED的一对引线被连接到相邻LED的相应引线，以实现LED的电连接，而每个LED的腿被装配到相邻LED的基座的相应切口中，以实现LED的机械连接。