公开(公告)号：US4766520A

公开(公告)日：1988-08-23

申请号：US938416

申请日：1986-12-05

Applicant: Duane Huber ,  James P. Liautaud

Inventor： Duane Huber ,  James P. Liautaud

IPC: H05K3/10 ,  H05K3/20 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K5/0034 ,  H05K3/202 ,  H05K2201/0999 ,  H05K2201/10424 ,  H05K2201/10765 ,  H05K2203/175 ,  H05K3/107

Abstract: An injection molded housing for thick film ignition circuitry used in conjunction with automobile or other vehicle engines includes an integral lead frame for providing electrical connections between the circuitry and engine sensors and ignition components. To provide protection against lead frame failure as a result of vibration and thermal stresses encountered in the engine environment, residual stress cracking caused by varying flexure of the lead frame during the manufacturing process is prevented by utilizing a pre-mold base in which the lead frame is placed prior to subsequent encapsulating of both the lead frame and the pre-molded base. The result is a lead-frame housing construction of greater reliability.

Abstract translation: 用于与汽车或其他车辆发动机结合使用的厚膜点火电路的注模壳体包括用于在电路和发动机传感器和点火部件之间提供电连接的整体引线框架。 为了提供由于在发动机环境中遇到的振动和热应力引起的引线框架故障的保护，通过利用预模底座来防止在制造过程中由引线框架的变形引起的残余应力开裂，其中引线框架 放置在引导框架和预模制基座之后的封装之前。 结果是可靠性更高的引线框架结构。

公开(公告)号：US3747045A

公开(公告)日：1973-07-17

申请号：US3747045D

申请日：1971-04-19

Applicant: SPRAGUE ELECTRIC CO

Inventor： STROSS H

IPC: H01G2/06 ,  H01R12/71 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G2/06 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10878

Abstract: The lead configuration of an electrical component is such that one of the leads locks into position in an aperture of a wiring board when the unit is inserted therein with nominal pressure. This configuration allows the unit to slide only so far into the aperture before it locks in place, thereby prohibiting the unit from being inserted any further, or from falling out of position if the board were inverted. These units remain locked in an upright position on the wiring board for the purpose of being further secured thereon, as by wave soldering.

Abstract translation: 电气部件的引线构造使得当单元以公称压力插入其中时，引线之一锁定在布线板的孔中的适当位置。 该配置允许单元在锁定到位之前仅滑动到孔中，从而禁止单元进一步插入，或者如果板被倒置则不会脱离位置。 这些单元保持锁定在布线板上的直立位置，以便通过波峰焊接进一步固定在其上。

公开(公告)号：US3601787A

公开(公告)日：1971-08-24

申请号：US3601787D

申请日：1970-06-22

Applicant: GTE AUTOMATIC ELECTRIC LAB INC

Inventor： REIMER WILLIAM A

IPC: H01R4/00 ,  H05K3/34 ,  H05K3/36 ,  H01R5/04

CPC classification number: H01R12/52 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/10765 ,  H05K2201/10984 ,  H05K2203/0415

Abstract: A solder form facilitates replacement of receptacle terminals that extend through blind connecting through-holes of a plurality of circuit boards. A hairpin conductor within the solder form spreads apart when the form is melted to carry solder to a replacement terminal and to the conductive surface of a throughhole.

公开(公告)号：US3437882A

公开(公告)日：1969-04-08

申请号：US3437882D

申请日：1966-01-14

Applicant: TEXAS INSTRUMENTS INC

Inventor： CAYZER JOHN ANTHONY

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H02B1/04

CPC classification number: H05K1/14 ,  H01R12/52 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/1053 ,  H05K2201/10765 ,  H05K2201/10946 ,  H05K2201/10962

公开(公告)号：EP3285553A1

公开(公告)日：2018-02-21

申请号：EP16306063.5

申请日：2016-08-17

Applicant: Thomson Licensing

Inventor： LO HINE TONG, Dominique ,  MORIN, Pierre-Marie ,  LE FOULGOC, Jean-Marc

IPC: H05K1/02 ,  H01P1/12 ,  H05K3/32 ,  H01H1/26 ,  H01H1/58 ,  H01R12/52

CPC classification number: H05K3/325 ,  H01H1/26 ,  H01H1/5822 ,  H01H2001/5811 ,  H01H2221/044 ,  H01H2235/028 ,  H01P1/127 ,  H01P5/028 ,  H01R12/526 ,  H05K1/0242 ,  H05K1/0268 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10765 ,  Y02P70/611

Abstract: An interconnection element (255) is described including a first part (405) for connection to a first port of a transmission line (205) and a second flexible part (410) for connection to a second port of the transmission line (210), wherein in a first operating mode the first part is fixed to the first port and the second flexible part is biased such that it contacts the second port to interconnect the first and second port via the interconnection element; and in a second operating mode the first part is fixed to the first port and the second flexible part is forced away (105, 240) against the bias from the second port such that an open circuit is created between the first port and the second port.

Abstract translation: 描述了互连元件（255），其包括用于连接到传输线（205）的第一端口的第一部分（405）和用于连接到传输线（210）的第二端口的第二柔性部分（410）， 其中在第一操作模式中，所述第一部分固定到所述第一端口，并且所述第二柔性部分被偏置，使得其接触所述第二端口以经由所述互连元件互连所述第一和第二端口; 并且在第二操作模式中，第一部分被固定到第一端口并且第二柔性部分被抵抗来自第二端口的偏压而被迫离开（105,240），使得在第一端口和第二端口之间产生开路 。

公开(公告)号：EP2648492A2

公开(公告)日：2013-10-09

申请号：EP13159887.2

申请日：2013-03-19

Applicant: Tellabs Oy

Inventor： Holma, Antti ,  Laihonen, Jari-Pekka

IPC: H05K3/34

CPC classification number: H05K1/11 ,  H05K1/0201 ,  H05K3/3447 ,  H05K13/04 ,  H05K2201/09781 ,  H05K2201/10303 ,  H05K2201/10765 ,  H05K2201/10856 ,  H05K2203/044

Abstract: A system provided with a solder joint comprises: a circuit board (101) provided with an aperture (102), an electrical component (103) comprising a conductor foot (104) protruding through the aperture, and soldering metal (105) inside the aperture and in contact with the conductor foot. The system further comprises a thermal conductor element (106) comprising a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty "cold" solder is decreased.

Abstract translation: 设置有焊接接头的系统包括：设置有孔（102）的电路板（101），包括突出穿过孔的导体脚（104）的电气部件（103）和孔内的焊接金属（105） 并与导体脚接触。 该系统还包括热导体元件（106），其包括孔外部的第一部分和孔内的第二部分并与焊接金属接触。 热导体元件能够传导热量，从而当熔融焊接金属能够被吸收到孔中时，其在预加热之前加热到加工阶段之前的热传递。 因此，提高了焊点的可靠性，即，存在故障“冷”焊料的风险降低。

公开(公告)号：EP0384326B1

公开(公告)日：1994-06-01

申请号：EP90103079.1

申请日：1990-02-17

Applicant: THOMSON CONSUMER ELECTRONICS, INC.

Inventor： Wignot, Leroy Samuel ,  Parker, Robert Preston

IPC: H01G5/18 ,  H03J1/00

CPC classification number: H01G5/16 ,  H03J3/20 ,  H05K1/18 ,  H05K2201/0792 ,  H05K2201/1003 ,  H05K2201/10765 ,  H05K2203/171

公开(公告)号：EP0148461B1

公开(公告)日：1988-08-10

申请号：EP84115598.9

申请日：1984-12-17

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Drekmeier, Karl Gerd

IPC: H01R9/09 ,  H05K7/10

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K3/366 ,  H05K7/1053 ,  H05K2201/1034 ,  H05K2201/10765 ,  H05K2201/10871 ,  H05K2201/10878

公开(公告)号：EP0213859A2

公开(公告)日：1987-03-11

申请号：EP86306329.3

申请日：1986-08-15

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Hasircoglu, Alexander William

IPC: H01R23/66 ,  H01R9/07 ,  H01R43/28 ,  H01R13/658

CPC classification number: H01R12/62 ,  H01R12/775 ,  H01R13/6592 ,  H01R13/6595 ,  H01R43/28 ,  H05K1/0218 ,  H05K1/0219 ,  H05K3/3405 ,  H05K2201/10356 ,  H05K2201/10765 ,  Y10T29/49124 ,  Y10T29/5145 ,  Y10T29/5193

Abstract: Cables (20) having interspersed co-planar signal and ground wires (22,24) in an insulating sheath (26) are terminated at a planar circuit board (40) by stripping back the insulation to expose the wires and by stapling the cable to the circuit board with a bus member (60). The signal wires (22) are soldered to signal wire termination sites (42) on the circuit board downstream from the bus member (60). The ground wires (24) are folded back over the bus member (60) and soldered thereto.

Abstract translation: 电缆（20），其具有在绝缘护套（26）在平面电路板（40）通过剥离背面的绝缘，以暴露导线终止，并由电缆装订到散布在共面的信号线和接地线（22,24） 所述电路板与总线构件（60）。 信号线（22）被焊接到在电路板的下游从总线构件（60）的信号线终止位点（42）。 接地导线（24）被向后折叠在所述总线部件（60）并焊接。

公开(公告)号：US09750139B2

公开(公告)日：2017-08-29

申请号：US15172744

申请日：2016-06-03

Applicant: CIRCOR AEROSPACE, INC.

Inventor： Brent Salamone

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0269 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10765

Abstract: A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.