公开(公告)号：US08315035B2

公开(公告)日：2012-11-20

申请号：US12629646

申请日：2009-12-02

Applicant: Masaaki Togashi ,  Sunao Masuda ,  Hiroshi Abe

Inventor： Masaaki Togashi ,  Sunao Masuda ,  Hiroshi Abe

IPC: H01G4/228 ,  H01G2/20 ,  H01G4/06

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10636 ,  H05K2201/10856 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41

Abstract: A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.

Abstract translation: 提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。 即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。 接头表面形成有切口，从而可以完全确保其柔性。 在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。 因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。 焊接圆角的状态从外部容易看出，也可以确保连接良率。

公开(公告)号：US20120156898A1

公开(公告)日：2012-06-21

申请号：US13319744

申请日：2010-05-07

Applicant: Werner Kallee

Inventor： Werner Kallee

IPC: H01R12/52

CPC classification number: H05K3/368 ,  H01R12/523 ,  H01R12/585 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10856

Abstract: In order to mechanically and electrically connect two printed circuit boards (26, 27) in a parallel arrangement, a plurality of connecting elements (1) is arranged in an insulating member (22) having parallel faces, said connecting elements projecting from both opposite faces of the insulating member. The projecting part of the connecting elements is designed as a contact element (6), thus allowing said contact elements to be plugged into plated-through bores (28) of the printed circuit boards. The contact elements are secured within the plated-through bores by means of a clamping force acting transverse to the plugging direction. The clamping force causes the contact elements to be pressed against the walls of the plated-through bores and thus both mechanically secures the contact elements and establishes an electric connection. According to the invention, the clamping force of the connecting elements is greater for one printed circuit board than the clamping force of the connecting elements for the other printed circuit board so as to ensure that the insulating member remains plugged in one of the printed circuit boards along with the connecting elements contained in the insulating member when the connection is released.

Abstract translation: 为了以平行布置机械地和电气地连接两个印刷电路板（26,27），多个连接元件（1）被布置在具有平行面的绝缘构件（22）中，所述连接元件从两个相对面 的绝缘构件。 连接元件的突出部分被设计为接触元件（6），从而允许所述接触元件插入印刷电路板的穿通孔（28）中。 接触元件通过横向于插入方向的夹紧力固定在镀通孔内。 夹紧力使得接触元件被压靠在穿通孔的壁上，因此两者都机械地固定接触元件并建立电连接。 根据本发明，一个印刷电路板的连接元件的夹持力比用于另一个印刷电路板的连接元件的夹持力大，以便确保绝缘构件保持插入其中一个印刷电路板 以及当连接被释放时包含在绝缘构件中的连接元件。

公开(公告)号：US08094461B2

公开(公告)日：2012-01-10

申请号：US11892600

申请日：2007-08-24

Applicant: Masahiro Tagano ,  Teruyuki Kitahara

Inventor： Masahiro Tagano ,  Teruyuki Kitahara

IPC: H01R9/00

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H01R12/707 ,  H05K1/0263 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/1446 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

Abstract translation: 印刷电路板包括具有第一侧，与第一侧相对的第二侧和通孔的印刷电路板主体; 布置在所述印刷电路板主体的第一侧上的印刷导体; 以及布置在印刷电路板主体的第二侧上的母线，母线包括延伸穿过通孔的端子。 端子在与通孔内部相对应的位置处包括多个分支端子部分，并且至少一个分支端子部分弯曲并附着到印刷导体。

公开(公告)号：US20100188798A1

公开(公告)日：2010-07-29

申请号：US12629646

申请日：2009-12-02

Applicant: Masaaki TOGASHI ,  Sunao MASUDA ,  Hiroshi ABE

Inventor： Masaaki TOGASHI ,  Sunao MASUDA ,  Hiroshi ABE

IPC: H01G4/228 ,  H01L21/00

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10636 ,  H05K2201/10856 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41

Abstract: A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided.Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.

Abstract translation: 提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。 即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。 接头表面形成有切口，从而可以完全确保其柔性。 在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。 因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。 焊接圆角的状态从外部容易看出，也可以确保连接良率。

公开(公告)号：US07621759B2

公开(公告)日：2009-11-24

申请号：US12320545

申请日：2009-01-29

Applicant: Dai Ito ,  Takayoshi Honda

Inventor： Dai Ito ,  Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10856 ,  Y10T29/49144

Abstract: An electronic apparatus is disclosed that includes a board and an electronic component having a body. The board has multiple through-holes and multiple lands covering multiple through-holes. The electronic component has multiple terminals. The terminals are respectively coupled with the lands while a part of each terminal being inserted into a through-hole. A shape of the through-hole is generally circular and different from a part of the land on a back surface of the board. The part of the land on the back surface has a width and the width is different in directions.

Abstract translation: 公开了一种包括板和具有主体的电子部件的电子设备。 该板具有多个通孔和多个覆盖多个通孔的焊盘。 电子元件具有多个端子。 端子分别与平台接合，而每个端子的一部分插入到通孔中。 通孔的形状通常是圆形的，并且不同于板的背面上的一部分焊盘。 后表面上的部分区域具有宽度，宽度方向不同。

公开(公告)号：US20080080154A1

公开(公告)日：2008-04-03

申请号：US11892600

申请日：2007-08-24

Applicant: Masahiro Tagano ,  Teruyuki Kitahara

Inventor： Masahiro Tagano ,  Teruyuki Kitahara

IPC: H01R9/22 ,  H01R12/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H01R12/707 ,  H05K1/0263 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/1446 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

Abstract translation: 印刷电路板包括具有第一侧，与第一侧相对的第二侧和通孔的印刷电路板主体; 布置在所述印刷电路板主体的第一侧上的印刷导体; 以及布置在印刷电路板主体的第二侧上的母线，母线包括延伸穿过通孔的端子。 端子在与通孔内部相对应的位置处包括多个分支端子部分，并且至少一个分支端子部分弯曲并附着到印刷导体。

公开(公告)号：US20070211443A1

公开(公告)日：2007-09-13

申请号：US11371838

申请日：2006-03-09

Applicant: David Wechter ,  Richard Lukaszewski ,  Sharon Renard ,  Jon Simons ,  David Danek ,  Michael Kreiter ,  Thomas Fuller

Inventor： David Wechter ,  Richard Lukaszewski ,  Sharon Renard ,  Jon Simons ,  David Danek ,  Michael Kreiter ,  Thomas Fuller

IPC: H05K7/00

CPC classification number: H05K7/1432 ,  H05K1/0286 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10856

Abstract: A method and product produced includes a power layer board that is manufactured by providing a printed circuit board having an input configured to receive an input power and an output configured to deliver an output power conditioned to power a motor. The method also includes soldering a first component to the printed circuit board. Thereafter, a request to manufacture the power layer board is received that includes parameters of the input power and/or the output power. Therefrom, characteristics of a second component including a resistor, a capacitor, and/or an inductor is identified based on the parameters of the input power and/or the output power. Accordingly, the identified second component is mounted to the printed circuit board through a solder-less cold-weld connector to complete the power layer board.

Abstract translation: 所生产的方法和产品包括功率层板，其通过提供具有被配置为接收输入功率的输入的印刷电路板和被配置为递送调节以为电动机供电的输出功率的输出而制造。 该方法还包括将第一组件焊接到印刷电路板。 此后，接收到包括输入功率和/或输出功率的参数的制造功率层板的请求。 因此，基于输入功率和/或输出功率的参数来识别包括电阻器，电容器和/或电感器的第二部件的特性。 因此，所识别的第二部件通过无焊料冷焊接连接器安装到印刷电路板，以完成电源层板。

公开(公告)号：US07189081B2

公开(公告)日：2007-03-13

申请号：US10341468

申请日：2003-01-14

Applicant: Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

Inventor： Yoshiyuki Tanaka ,  Hiroyuki Ashiya ,  Yayoi Maki

IPC: H01R12/00

CPC classification number: B60R16/0238 ,  H01R9/2466 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0979 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10856 ,  H05K2201/2036 ,  Y10S439/949

Abstract: The terminal mounting structure includes a board (21). The structure includes a terminal (26) mounted on the board. The terminal includes a first end (26a) removably connected to a connection component (16, 17, 18). The terminal includes a second end (26b) soldered to the board in a raised position. The terminal includes a bent portion (26d) at intermediate of the terminal and at respective angles relative to respective first and second ends. The structure includes a retaining member (30, 40) facing the board with a space therebetween, and retaining the bent portion.

Abstract translation: 端子安装结构包括板（21）。 该结构包括安装在板上的端子（26）。 端子包括可移除地连接到连接部件（16,17,18）的第一端部（26a）。 端子包括在升高位置焊接到板的第二端（26b）。 端子包括在端子的中间并相对于相应的第一和第二端成各个角度的弯曲部分（26d）。 该结构包括面对板的保持构件（30,40），并且保持弯曲部分。

公开(公告)号：US20060107523A1

公开(公告)日：2006-05-25

申请号：US10996935

申请日：2004-11-24

Applicant: Mike Blossfeld ,  Luis Sanchez

Inventor： Mike Blossfeld ,  Luis Sanchez

IPC: H05K3/36

CPC classification number: H05K3/3415 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49163

Abstract: a method of making a printed circuit board including the steps of: providing a board with electrical conductor traces; applying a solder material to at least one selected location on a first side of the board; placing a first component on the first side of the board; heating the board and solder material to reflow the solder applied to the first side of the board to provide an electrical connection of the first component with a first conductor trace portion of the board; and then connecting a second component to the board and providing a nonsoldered electrical connection between the second component and a second electrical conductor trace portion of the board.

Abstract translation: 一种制造印刷电路板的方法，包括以下步骤：为电路板提供导电迹线; 将焊料材料施加到所述板的第一侧上的至少一个选定位置; 将第一个部件放在电路板的第一面上; 加热板和焊料材料以回流焊接到板的第一侧的焊料，以提供第一部件与板的第一导体迹线部分的电连接; 然后将第二部件连接到电路板上，并在第二部件和电路板的第二电导体迹线部分之间提供非复杂的电连接。

公开(公告)号：US06875056B1

公开(公告)日：2005-04-05

申请号：US10668793

申请日：2003-09-22

Applicant: Gioni Bianchini ,  Iggoni Fajardo

Inventor： Gioni Bianchini ,  Iggoni Fajardo

IPC: H01R12/57 ,  H05K3/30 ,  H01R13/648

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K2201/10371 ,  H05K2201/10856

Abstract: A package for a fiber optic transceiver that integrates the intermediate rear gasket into the lower body of the transceiver package. As such, the EMI fingers are much thicker than current art EMI fingers, 0.010″ thick as compared to current art 0.002″ thick. In current art devices, providing such robust EMI fingers is not possible. The connecting pins that secure the transceiver cage to the PCB are self-centering press-fit pins formed from a plurality of legs. At least one of the legs provides an electrical connection point for the transceiver on which the pins are used. The connecting pin is formed so that the legs act as leaf springs to securely hold the connector in place in the proper installation hole in the board on which the transceiver is installed. The pins are stamped from sheet metal with a progressive die process. By changing the amount of flexion in the legs of the pin, the pressure required to insert the pin into a connection hole, and hence the retaining pressure, can be varied.

Abstract translation: 用于光纤收发器的封装，将中间后垫圈集成到收发器封装的下部。 因此，与现有技术的0.002“厚度相比，EMI指状物比当前的EMI指针厚0.010英寸厚。 在当前的艺术设备中，提供这种鲁棒的EMI指针是不可能的。 将收发器笼固定到PCB的连接销是由多个腿形成的自定心压配销。 腿中的至少一个提供用于其上使用销的收发器的电连接点。 连接销形成为使得腿部用作板簧，以将连接器牢固地保持在安装有收发器的板的正确安装孔中的适当位置。 这些销钉是用金属板冲压成型的。 通过改变销的腿部的弯曲量，可以改变将销插入连接孔所需的压力以及因此的保持压力。