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    Method for contacting high-current connecting elements of an electrical component, and assembly made by such a method
    73.
    发明授权
    Method for contacting high-current connecting elements of an electrical component, and assembly made by such a method 失效
    用于接触电气部件的大电流连接元件的方法和通过这种方法制成的组件

    公开(公告)号：US5847937A

    公开(公告)日：1998-12-08

    申请号：US809005

    申请日：1997-03-10

    Applicant: Frank Cepa ,  Erich Vojta

    Inventor： Frank Cepa ,  Erich Vojta

    IPC: B23K9/00 ,  B23K31/02 ,  B23K33/00 ,  H01H1/58 ,  H01H11/00 ,  H01H11/06 ,  H01R43/02 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40 ,  H05K7/02

    CPC classification number: H01H1/58 ,  B23K31/02 ,  B23K33/00 ,  H01H11/0056 ,  H01R43/0256 ,  H05K3/328 ,  H01H2011/0087 ,  H05K2201/10916 ,  H05K2203/095 ,  H05K2203/107 ,  H05K3/202 ,  H05K3/4092 ,  Y10T29/49142

    Abstract: In order to make contact from heavy-current connecting elements of a component, in particular a relay, to connecting conductors of an insulating mount (1), the blade terminals of the component, in the form of connecting tongues (10) are welded to bent connecting tabs (12) of the connecting conductors (13), which are embedded in a mount, for example a printed circuit board. In order to protect the plastic located in the vicinity against damage from the welding energy, the end sections of the connecting tabs (12) and of the connecting tongues (10) are provided with a tooth contour, such that the individual teeth (16, 17) are welded successively. Having a reduced area with which to conduct the current, the teeth reach a high thermal load. In consequence, the teeth rapidly reach the melted phase, without the adjacent plastic being caused to melt via the heat conduction in the short welding time.

    Abstract translation: PCT PCT / DE95 / 01203 371日期1997年3月10日 102（e）1997年3月10日PCT PCT 1995年9月5日PCT公布。 公开号WO96 / 08023 日期1996年3月14日为了使部件特别是继电器的大电流连接元件与绝缘安装件（1）的连接导体接触，部件的叶片端子以连接舌片的形式（ 10）焊接到嵌入在例如印刷电路板的安装件中的连接导体（13）的弯曲连接突片（12）。 为了保护位于附近的塑料免受来自焊接能量的损伤，连接翼片（12）的端部和连接舌片（10）的端部设置有齿轮廓，使得各齿 17）连续焊接。 通过减小面积来传导电流，牙齿达到高热负荷。 因此，齿快速地达到熔化相，而不会使相邻的塑料在短的焊接时间内通过热传导而熔化。

    High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact
    75.
    发明授权
    High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact 失效
    高速CCD传感器安装系统，具有改进的信噪比操作和热接触

    公开(公告)号：US5043845A

    公开(公告)日：1991-08-27

    申请号：US422183

    申请日：1989-10-16

    Applicant: Bruce C. McDermott ,  Leslie G. Moore, Jr. ,  John D. Meierdiercks ,  James R. Milch

    Inventor： Bruce C. McDermott ,  Leslie G. Moore, Jr. ,  John D. Meierdiercks ,  James R. Milch

    IPC: H01L23/467 ,  H01L23/40 ,  H01L27/14 ,  H01L31/024 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K7/20

    CPC classification number: H05K3/3447 ,  H01L31/024 ,  H05K1/0204 ,  H01L2224/48091 ,  H05K1/182 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10916 ,  Y02P70/611

    Abstract: The present image sensor mounting system is particularly adapted to the mounting of a linear sensor array, of the type having a transparent window on a front surface and a thermal and electrically conductive back surface. The system provides superior electrical and thermal transfer characteristics. A heat sink having at least one flat surface is positioned to make thermal contact with the back surface of the image sensor. A multilayer circuit board having layers of conductive material separated by layers of insulating material and having an opening therethrough sufficient in size to accept the heat sink provides the system support. A metal plating extends from one surface of the board through the opening in the board to the opposite surface of the board with selected ones of the layers of conductive material making electrical contact with the metal plating. The heat sink is mounted in the multilayer circuit board opening in thermal and electrical contact with the metal plating. A layer of thermal and electrically conductive grease is layered between the at least one surface of the heat sink and the conductive back surface of the linear sensor array.

    Abstract translation: 本发明的图像传感器安装系统特别适用于在前表面上具有透明窗口的类型的线性传感器阵列的安装以及导热和导电的背面。 该系统提供卓越的电和热传递特性。 具有至少一个平坦表面的散热器被定位成与图像传感器的后表面进行热接触。 具有由绝缘材料层隔开并具有足够尺寸的开口以接纳散热器的导电材料层的多层电路板提供了系统支撑。 金属电镀从板的一个表面延伸穿过板中的开口到板的相对表面，其中选定的导电材料层与金属电镀电接触。 散热器安装在多层电路板开口中，与金属电镀层进行热电接触。 一层热导电润滑脂层叠在散热片的至少一个表面和线性传感器阵列的导电后表面之间。

    Surface mountable electronic device
    76.
    发明授权
    Surface mountable electronic device 失效
    可表面安装的电子设备

    公开(公告)号：US4801912A

    公开(公告)日：1989-01-31

    申请号：US742452

    申请日：1985-06-07

    Applicant: Donald C. McElheny ,  Dale A. Ponivas ,  David A. Syracuse ,  Stephen H. Chandler ,  Robert H. Nareau

    Inventor： Donald C. McElheny ,  Dale A. Ponivas ,  David A. Syracuse ,  Stephen H. Chandler ,  Robert H. Nareau

    IPC: H01F27/36 ,  H01C1/14 ,  H01F17/00 ,  H01F27/02 ,  H01F27/06 ,  H01F27/29 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01F15/04 ,  H01F15/10

    CPC classification number: H05K3/30 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A surface mountable electronic device and method of making same wherein a discrete electronic device is encapsulated in a body of electrical insulating material having opposite ends and mounting surface extending between the ends, and an electrode is provided on each end. Each electrode includes a portion on the end of the body in electrical contact with the corresponding lead of the discrete electronic device and a contact portion extending along the mounting surface for making electrical connection to a circuit portion defined on a surface to which the device is mountable. The discrete electronic device is manufactured, prior to encapsulation, by known techniques. Preferably the body is a rectangular solid with each of the four sides having electrode contact portions thereon to serve as one of four possible mounting surfaces each with substantial mechanical stability. When the discrete electronic device is an inductor, interruption of the magnetic field is minimized by spacing the ends of the inductor core from the ends of the encapsulating body, separating the electrode contact portions, having the area of the electrode end portion less than the area of the end of the encapsulating body, and having the cross-sectional area of the most narrow section of the electrode end portion no less than the cross sectional area of the magnetic wire of the inducator winding. In the case of a shielded inductor, phenolic core inductor or non-inductive device, electrodes or diode, solid metal electrode can be employed.

    Abstract translation: 一种可表面安装的电子器件及其制造方法，其中分立的电子器件封装在具有相对端的电绝缘材料体和在端部之间延伸的安装表面，并且在每个端部上设置电极。 每个电极包括在主体的端部与分立的电子设备的相应引线电接触的部分和沿着安装表面延伸的接触部分，用于与限定在该装置可安装的表面上的电路部分进行电连接 。 离散电子器件在封装之前通过已知技术制造。 优选地，主体是矩形固体，其中四边中的每一个在其上具有电极接触部分，以用作四个可能的安装表面之一，每个具有相当大的机械稳定性。 当分立电子设备是电感器时，通过将电感器芯的端部与封装体的端部间隔开来，使电场端部的面积小于面积的电极接触部分 并且电极端部的最窄部分的横截面面积不小于感应线圈的磁线的横截面面积。 在屏蔽电感的情况下，可以使用酚醛芯电感器或非感应器件，电极或二极管，固体金属电极。

    Mounting of components on metallic printed circuit boards
    77.
    发明授权
    Mounting of components on metallic printed circuit boards 失效
    金属印刷电路板组件的安装

    公开(公告)号：US3573707A

    公开(公告)日：1971-04-06

    申请号：US3573707D

    申请日：1969-09-05

    Applicant: AMP INC

    Inventor： REYNOLDS CHARLES EDWARD

    IPC: H01R12/58 ,  H05K1/05 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K13/04 ,  H01B17/20 ,  H05K1/08

    CPC classification number: H01R12/58 ,  H05K1/056 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/445 ,  H05K13/0478 ,  H05K2201/10401 ,  H05K2201/10916

    Abstract: Component mounting system for metallic printed circuit boards having insulating coatings on their surfaces is disclosed in which the drilled hole in the metallic board is lined with a thin walled liner of plastic tubing. A metallic receptacle is positioned in the liner so that the liner electrically insulates the receptacle from the metallic portion of the printed circuit board. The lead wire from the component is inserted into the receptacle and the board is solder-dipped to electrically connect the lead wire to a connecting path on the board. The heat from the soldering operation causes the liner to radially expand so that it achieves a tight fit in the hole. The board acts as a heat sink for the components mounted thereon but the board is electrically isolated from the components excepting where it is used as a grounding plane.

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