中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

95 records (took 0.042 seconds)

    Configuration to reduce non-linear motion
    81.
    发明授权
    Configuration to reduce non-linear motion 有权

    公开(公告)号：US10527421B2

    公开(公告)日：2020-01-07

    申请号：US15814373

    申请日：2017-11-15

    Applicant: INVENSENSE, INC.

    Inventor： Ozan Anac ,  Joseph Seeger

    IPC: G01C19/5762 ,  G01C19/5733 ,  G01C19/5747 ,  G01P15/08 ,  B81B3/00

    Abstract: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized.

    MEMS sensor with high voltage switch
    82.
    发明授权
    MEMS sensor with high voltage switch 有权

    公开(公告)号：US10427930B2

    公开(公告)日：2019-10-01

    申请号：US15620619

    申请日：2017-06-12

    Applicant: InvenSense, Inc.

    Inventor： Matthew Thompson ,  Joseph Seeger

    IPC: B81B3/00 ,  B81B7/02 ,  H01H1/00

    Abstract: A system and/or method for utilizing microelectromechanical systems (MEMS) switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to MEMS sensors (e.g., to provide a drive signal to a MEMS gyroscope).

    DEMODULATION PHASE CALIBRATION USING EXTERNAL INPUT
    83.
    发明申请
    DEMODULATION PHASE CALIBRATION USING EXTERNAL INPUT 审中-公开

    公开(公告)号：US20190120657A1

    公开(公告)日：2019-04-25

    申请号：US16217509

    申请日：2018-12-12

    Applicant: INVENSENSE, INC.

    Inventor： Doruk Senkal ,  Houri Johari-Galle ,  Joseph Seeger

    IPC: G01C25/00 ,  B81B7/00

    Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.

    Demodulation phase calibration
    84.
    发明授权
    Demodulation phase calibration 有权

    公开(公告)号：US10267650B2

    公开(公告)日：2019-04-23

    申请号：US15173530

    申请日：2016-06-03

    Applicant: InvenSense, Inc.

    Inventor： Doruk Senkal ,  Joseph Seeger

    IPC: G01C25/00 ,  G01C19/5614 ,  G01C19/5649 ,  G01C19/5726 ,  G01C19/5776

    Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.

    MEMS device with improved spring system
    86.
    发明授权
    MEMS device with improved spring system 有权

    公开(公告)号：US09891053B2

    公开(公告)日：2018-02-13

    申请号：US14800612

    申请日：2015-07-15

    Applicant: InvenSense, Inc.

    Inventor： Joseph Seeger ,  Ozan Anac

    IPC: G01C19/00 ,  G01C19/5755 ,  G01C19/5733

    CPC classification number: G01C19/5755 ,  G01C19/5733

    Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction.

    DEMODULATION PHASE CALIBRATION
    88.
    发明申请
    DEMODULATION PHASE CALIBRATION 审中-公开

    公开(公告)号：US20170350722A1

    公开(公告)日：2017-12-07

    申请号：US15173530

    申请日：2016-06-03

    Applicant: InvenSense, Inc.

    Inventor： Doruk Senkal ,  Joseph Seeger

    IPC: G01C25/00

    CPC classification number: G01C25/005 ,  G01C19/5614 ,  G01C19/5649 ,  G01C19/5726 ,  G01C19/5776

    Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.

    Microelectromechanical system device with internal direct electric coupling
    90.
    发明授权
    Microelectromechanical system device with internal direct electric coupling 有权
    具有内部直接电耦合的微机电系统装置

    公开(公告)号：US09452920B2

    公开(公告)日：2016-09-27

    申请号：US14979194

    申请日：2015-12-22

    Applicant: InvenSense, Inc.

    Inventor： Matthew Julian Thompson ,  Joseph Seeger

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0006 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0264 ,  B81B2207/093 ,  B81B2207/098 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031 ,  B81C2203/035

    Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises providing a MEMS substrate which includes forming one or more cavities in a first semiconductor layer; forming a second semiconductor layer; and providing a dielectric layer between the first semiconductor layer and the second semiconductor layer The MEMS substrate providing step further includes bonding the first semiconductor layer to a second semiconductor layer; etching at least one via through the second semiconductor layer and the dielectric layer; and depositing a first conductive material onto the second semiconductor layer surface and filling the at least one via. The MEMS substrate providing step also includes depositing a second conductive material on top of the first conductive material; etching the second conductive material and the first conductive material to form at least one stand-off; the second semiconductor layer to define one or more MEMS structures; and the first semiconductor layer to create an opening to separate the first semiconductor layer into a first portion and a second portion. The method further comprises bonding the MEMS substrate to a base substrate using a eutectic bond between the second conductive material and metal pads of the base substrate.

    Abstract translation: 公开了一种在集成MEMS器件中制造电连接的方法。 该方法包括提供MEMS衬底，其包括在第一半导体层中形成一个或多个空腔; 形成第二半导体层; 以及在所述第一半导体层和所述第二半导体层之间提供介电层。所述MEMS衬底提供步骤还包括将所述第一半导体层接合到第二半导体层; 通过所述第二半导体层和所述电介质层蚀刻至少一个通孔; 以及将第一导电材料沉积到所述第二半导体层表面上并填充所述至少一个通孔。 MEMS衬底提供步骤还包括在第一导电材料的顶部上沉积第二导电材料; 蚀刻第二导电材料和第一导电材料以形成至少一个支座; 所述第二半导体层限定一个或多个MEMS结构; 以及第一半导体层，以形成用于将第一半导体层分离成第一部分和第二部分的开口。 该方法还包括使用第二导电材料和基底衬底的金属焊盘之间的共晶键将MEMS衬底接合到基底衬底。

Patent Agency Ranking