Abstract:
A programmable logic array (PLA) has at least an AND plane comprising an array of transistors arranged in rows and columns, the transistors belonging to a same column being connected in series with each other, the two end current terminals of said series of transistors being coupled to the supply voltage rail (VDD) and to a reference (GND), respectively, the transistors of the first row and of the last row of the array having their control terminals coupled to respective opposite enabling/disabling potentials. To each row of said array, with the exception of the first and the last row, are associated three control lines, the first line being coupled to a first input value, the second line being coupled to the inverted logic value of the first input value and the third line being coupled to a voltage sufficient to keep in a state of conduction the transistors of the row connected to it. Each transistor of each row except the first and the last row has its control terminal connected to one of the three control lines associated to the row. An OR plane comprises at least an array of transistors arranged in rows and columns, the transistors belonging to a same column having their respective control terminals connected to a control line and a first current terminal coupled to a reference potential (GND), each transistor of each row of the array having a second current terminal connected or not to a respective output line. The second current terminal of each transistor of the array that is not connected to a respective output line is short-circuited to the first current terminal of the same transistor.
Abstract:
The read circuit (1') comprises an array branch (6) having an input array node (22) connected, via an array bit line (8), to an array cell (10); a reference branch (12) having an input reference node (32) connected, via a reference bit line (14), to a reference cell (16); a current-to-voltage converter (18) connected to an output array node (56) of the array branch (6) and to an output reference node (58) of the reference branch (12) to supply on the output array node (56) and the output reference node (58) the respective electric potentials (V M , V R ) correlated to the currents flowing in the array memory cell (10) and, respectively, in the reference memory cell (16); and a comparator (19) connected at input to the output array node (56) and output reference node (58) and supplying as output a signal (OUT) indicative of the contents stored in the array memory cell (10); and an array decoupling stage (80) arranged between the input array node (22) and the output array node (56) to decouple the electric potentials of the input and output array nodes (22, 56) from one another.
Abstract:
The row decoder includes, for each word line (WL) of the memory (2), a respective biasing circuit (54) receiving at the input a row selection signal (SR ) switching, in preset operating conditions, between a supply voltage (V CC ) and a ground voltage (V GND ) and supplying at the output a biasing signal (R ) for the respective word line (WL) switching between a first operating voltage (V PC ), in turn switching at least between the supply voltage (V CC ) and a programming voltage (V PP ) higher than the supply voltage (V CC ), and a second operating voltage (V NEG ), in turn switching at least between the ground voltage (V GND ) and an erase voltage (V ERN ) lower than the ground voltage (V GND ). Each biasing circuit (54) includes a level translator circuit (58) receiving at the input the row selection signal (SR ) and supplying as output a control signal (CM ) switching between the first and the second operating voltages (V PC , V NEG ) and an output driver circuit (60) receiving as input the control signal (CM ) and supplying at the output the biasing signal (R ).
Abstract:
The switch circuit (40) receives a first supply voltage (V CC ) and a second supply voltage (V PP ) different from each other; a control input (41a) receiving a control signal that may be switched between the first supply voltage and ground; a driving inverter stage (44) supplied by the second supply voltage (V PP ) and defining the output (70) of the circuit; a feedback inverter stage (43) supplied by the second supply voltage and including a top transistor (51) and a bottom transistor (53) defining an intermediate node (58) and having respective control terminals. The control terminal of the top transistor (51) is connected to the output node (70), the control terminal of the bottom transistor (53) is connected to the control input (41a), and the intermediate node is connected to the input (58) of the driving inverter stage. An activation element (80, 71) helps switching of the intermediate node (58) from the second supply voltage to ground; current limiting transistors (52, 62) are arranged in the inverter stages to limit the current flowing during switching and to reduce the consumption of the circuit.
Abstract:
The invention relates to a circuit device for carrying out a hierarchic form of row decoding in semiconductor memory devices of the non-volatile type and comprising at least one matrix of memory cells (5) with sectors (3,4) organized into columns, wherein each sector has a specific group of local word lines (LWL) individually connected to a main word line (MWL) running through all of the matrix sectors which have rows in common. The device comprises a first transistor (M1) of the PMOS type having its conduction terminals connected, the one to the main word line (MWL) and the other to the local word line (LWL), and a second transistor (M3) of the NMOS type having its conduction terminals connected, the one to the local word line (LWL) and the other to a reference voltage (GND).
Abstract:
The invention relates to a row decoding circuit for an electronic memory cell device, particularly in low supply voltage applications, being of the type adapted to boost, through at least one boost capacitor (Cboost), a read voltage to be applied to a memory column containing a memory cell to be read. The circuit is powered between a first supply voltage reference (Vpcx) and a second ground potential reference (GND), and comprises a hierarchic structure (13) of cascade connected inverters (15,16) and a circuit means of progressively raising the read voltage level dynamically. First means (Cboost0,D1) are provided for raising the read voltage level to a value equal to the supply voltage (Vpcx) plus a threshold voltage (Vtp), and second means (Cboost1,D2) are provided for raising the read voltage level to a value equal to the supply voltage (Vpcx) plus twice said threshold voltage (Vtp).
Abstract:
The invention relates to an integrated structure (1) for memory cells formed over a semiconductor substrate (2) doped with a first dopant type and including at least one memory cell (CM) in turn formed in a conductive well (3) provided in said semiconductor substrate (2) and doped with a second dopant type, said conductive well (3) having an additional well (4) formed therein which is doped with the first dopant type and comprises active areas (5,6) of the memory cell (CM). According to the invention, a substrate bias terminal (8), formed in the additional well (4), is further associated with the memory cell (CM) to receive a suitable bias voltage (Vpol) to lower the threshold voltage (Vth) of the memory cell (CM) by body effect. The invention also relates to a biasing device (13) for a memory cell (CM) which has at least one substrate bias terminal (8) associated therewith, the biasing device comprising at least a first sub-threshold circuitry block (A) adapted to supply an appropriate current during the device standby phase through a restore transistor (M1) connected between a supply voltage reference (Vcc) and the substrate bias terminal (8) of the memory cell (CM), and having a control terminal connected to a bias circuit (14), in turn connected between the supply voltage reference (Vcc) and a ground voltage reference (GND) to drive the restore transistor (M1) with a current of limited value. The device according to the invention further comprises a second feedback block (B) for fast charging the substrate bias terminal (8), being connected between the supply voltage reference (Vcc) and the ground voltage reference (GND) and comprising a first bias transistor (M2) having a control terminal connected to the ground voltage reference (GND) via a stabilization transistor (M3), having in turn a control terminal connected to an output node (OC), and to the control terminal of a first regulation transistor (M4) connected between the supply voltage reference (Vcc) and the ground voltage reference (GND), the stabilization transistor (M3) and first regulation transistor (M4) providing feedback for the bias transistor (M2), thereby to restrict the voltage range of the output node (OC).
Abstract:
The invention relates to a method of protecting data in a semiconductor electronic memory comprising a memory matrix (2) and respective matrix address decoding (3) and predecoding (4) blocks. The method consists of using a protected memory portion (5) within said matrix (2) and respective dedicated decoding portions (6,7) for storing, into the protected portion (5), a protection code (CP) external to the address area of the matrix (2). The protection code (CP) can only be written and/or read through a command interpreter (8).