公开(公告)号：US20160316569A1

公开(公告)日：2016-10-27

申请号：US15104452

申请日：2014-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Yasunobu YAMADA ,  Morio SEKIGUCHI ,  Susumu KUMAKURA

IPC: H05K3/22 ,  H05K3/32 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6≦B/A≦1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Abstract translation: 一种用于制造安装体的方法，包括：安装步骤，通过包含具有环氧树脂作为主要成分的粘合剂的各向异性导电膜和压缩硬度（K）为500kgf的导电颗粒将电子部件安装到布线板上 压缩变形10％时，粘合剂的厚度（A）与平均粒径（B）之间的关系为0.6≤B/A≤1.5，固化后的粘合剂的弹性模量为50 100℃以上MPa以上。 以及在安装安装步骤时发生问题的情况下机械剥离以拆卸电子部件和布线板的重新安装步骤，并重新使用布线板来执行安装步骤。

公开(公告)号：US20040238910A1

公开(公告)日：2004-12-02

申请号：US10850262

申请日：2004-05-20

Inventor： Shoji Fujii ,  Toshiharu Fukui ,  Tetsuo Murakami

IPC: H01L027/10

CPC classification number: G06F3/041 ,  H05K3/245 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/035

Abstract: A transparent touch panel is structured by forming connecting layers that contain conductive metal powder dispersed in a resin, on ends of wiring patterns on a wiring board to which upper electrodes and lower electrodes are to be bonded. This structure can provide a transparent touch panel that ensures bonding of upper and lower substrates and the wiring board and stable electrical connection.

Abstract translation: 通过在上部电极和下部电极要被接合的布线基板上的布线图案的端部上形成包含分散在树脂中的导电金属粉末的连接层来构成透明触摸面板。 该结构可以提供透明的触摸面板，确保上下基板和布线板的接合以及稳定的电连接。

公开(公告)号：US20040087128A1

公开(公告)日：2004-05-06

申请号：US10415193

申请日：2003-04-24

Inventor： Herbert J Neuhaus ,  Bin Zou

IPC: H01L021/44

CPC classification number: H01L24/83 ,  H01B1/16 ,  H01B1/22 ,  H01L21/4853 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/11505 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29411 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15747 ,  H05K1/095 ,  H05K3/245 ,  H05K3/247 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/023 ,  H05K2201/035 ,  H05K2201/0367 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The disclosed invention relates to materials and processes for creating particle-enhanced bumps on electrical contact surfaces through stencil or screen printing processes. The materials are mixtures of conductive ink, conductive paste, or conductive adhesive and conductive hard particles (104). The process involves depositing the mixture (108) onto electrical contact surfaces by stencil printing, screen printing, or other dispensing techniques (110). In another embodiment, the ink, paste, or adhesive is first stenciled or screen printed and the particles are then applied on top of the ink, paste, or adhesive deposit. Once cured (114), the deposition provides a hard, electrical contact bump on the contact surface with a rough, conductive, sandpaper-like surface that can be easily connected to an opposing contact surface without any further surface preparation of either surface.

Abstract translation: 所公开的发明涉及通过模板或丝网印刷工艺在电接触表面上产生颗粒增强的凸块的材料和工艺。 这些材料是导电油墨，导电浆料或导电粘合剂和导电硬颗粒（104）的混合物。 该方法包括通过模板印刷，丝网印刷或其它分配技术（110）将混合物（108）沉积到电接触表面上。 在另一个实施方案中，首先将油墨，糊剂或粘合剂模版或丝网印刷，然后将颗粒施加在油墨，糊剂或粘合剂沉积物的顶部上。 一旦固化（114），沉积在接触表面上提供硬的电接触凸块，其具有粗糙的，导电的砂纸状表面，其可以容易地连接到相对的接触表面，而无需任何表面的任何进一步的表面制备。

公开(公告)号：US06646708B1

公开(公告)日：2003-11-11

申请号：US09857582

申请日：2001-06-05

Applicant: Eiji Muramatsu

Inventor： Eiji Muramatsu

IPC: G02F11345

CPC classification number: G02F1/13452 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/023 ,  H01L2924/00

Abstract: A liquid crystal device having high reliability and permitting recognition of a connection state using ACF, and an electronic apparatus including the liquid crystal device, in which a pair of substrates 11a and 11b having electrodes 15a and 15b formed on the opposite surfaces thereof are opposed to each other, an overhang portion 30 is provided on the substrate 11a to project outward from the substrate 11b, terminals 31 are formed on the overhang portion 30 to extend from the electrodes 15a, and output terminals 25a of an external circuit are electrically connected to the terminals 31 through AFC 32 so that conductive particles 32b contained in the AFC 32 cut into the terminals 31 to form nicks or gouges which are visible through the transparent substrate 11a.

Abstract translation: 一种具有高可靠性并且能够识别使用ACF的连接状态的液晶装置，以及包括液晶装置的电子设备，其中在其相对表面上形成有电极15a和15b的一对基板11a和11b与 彼此之间，在基板11a上设置有从基板11b向外突出的突出部30，在突出部30上形成有从电极15a延伸的端子31，外部电路的输出端25a电连接到 端子31至AFC 32，使得包含在AFC32中的导电颗粒32b切入端子31以形成通过透明基板11a可见的切口或沟槽。

公开(公告)号：US6110399A

公开(公告)日：2000-08-29

申请号：US98885

申请日：1998-06-17

Applicant: Ciaran Bernard McArdle ,  Joseph Burke

Inventor： Ciaran Bernard McArdle ,  Joseph Burke

IPC: H05K1/09 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B5/00 ,  H01B5/16 ,  H01F1/44 ,  H01F41/16 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  H01B1/02

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01R4/04 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347

Abstract: The invention provides a composition (3) comprising:(i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and(ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid.Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry.The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles.The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

Abstract translation: 本发明提供一种组合物（3），其包含：（i）含有非磁性载体液体中的铁磁颗粒的胶体悬浮液（4）的铁磁流体，和（ii）具有基本均匀的多个导电颗粒 尺寸和形状，分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒（5）。 通过磁体装置（8）对组合物（3）施加基本均匀的磁场使得导电颗粒（5）形成规则图案（9）。 该组合物用于在电子工业中的两组导体（2a，2b; 7a，7b）之间提供各向异性导电通路（9a，9b）。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。

公开(公告)号：US5494730A

公开(公告)日：1996-02-27

申请号：US193297

申请日：1994-02-08

Applicant: Cylde D. Calhoun ,  Maurice J. Fleming ,  George D. Foss ,  Richard L. Renstrom

Inventor： Cylde D. Calhoun ,  Maurice J. Fleming ,  George D. Foss ,  Richard L. Renstrom

IPC: H01B5/16 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01B5/00 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B32B3/08 ,  B32B5/16

CPC classification number: H01B1/22 ,  C09J7/02 ,  C09J9/02 ,  H01R4/04 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K3/361 ,  Y10S428/906 ,  Y10T428/1429 ,  Y10T428/2438 ,  Y10T428/24413 ,  Y10T428/24545 ,  Y10T428/24843 ,  Y10T428/24893 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2857

Abstract: Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 .mu.m thick.

Abstract translation: 两个基板上的导电元件可以通过包含以预定图案单独定位在粘合剂层中的导电等轴晶粒的胶带电连接。 每个颗粒比要互连的元件更硬，从而手压使颗粒进入元件，从而产生可靠的电连接。 特别有用的颗粒是具有0.1至2μm厚的金属涂层的玻璃珠。

公开(公告)号：US5455893A

公开(公告)日：1995-10-03

申请号：US309351

申请日：1994-09-20

Applicant: Jacques A. Sirat

Inventor： Jacques A. Sirat

IPC: G06F15/18 ,  G06N3/04 ,  G06N3/08 ,  G06N99/00 ,  H05K3/00

CPC classification number: G06N3/04 ,  G06N3/08 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023

Abstract: The invention relates to a norms computation procedure applied within a neuronal network structure or a computer. It permits determination of the norm of the new synaptic coefficients without necessitating their explicit computation. To this end, the structure comprises a processing unit 10 which determines output potentials y.sub.k and variation .DELTA..sub.k, a storage unit 13 for the old and new norms and a computational unit 15 for the new norms. The latter are thus rapidly determined without needing to call the synaptic coefficients in memory. The procedure can be utilized with certain algorithms which necessitate a computation of norms.

Abstract translation: 本发明涉及应用在神经元网络结构或计算机内的规范计算程序。 它允许确定新的突触系数的规范，而不需要它们的显式计算。 为此，该结构包括一个处理单元10，其确定输出电位yk和变化量DELTA k，用于旧的和新的范数的存储单元13以及用于新规范的计算单元15。 因此，后者被快速确定，而不需要在存储器中调用突触系数。 该过程可以利用需要计算规范的某些算法来使用。

公开(公告)号：US5235741A

公开(公告)日：1993-08-17

申请号：US928036

申请日：1992-08-11

Applicant: Akira Mase

Inventor： Akira Mase

IPC: H01R4/04 ,  H05K1/00 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K1/0393 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49201

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

Abstract translation: 描述形成在第一和第二基板上的电极布置之间的电连接。 将第一衬底放置在第二衬底上，在它们之间具有UV光可固化粘合剂。 UV光固化型粘合剂携带分散在其中的第一和第二颗粒。 将第一和第二基板彼此挤压并暴露于UV光以使粘合剂硬化。 第一颗粒由导电颗粒制成并且优选地是弹性的并且用于在第一和第二基板的电极之间形成电流路径。 第二颗粒起到防止第一颗粒被过度变形破坏的作用。

公开(公告)号：US5225966A

公开(公告)日：1993-07-06

申请号：US735231

申请日：1991-07-24

Applicant: Nagesh R. Basavanhally ,  Benjamin H. Cranston

Inventor： Nagesh R. Basavanhally ,  Benjamin H. Cranston

IPC: H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/31 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0266 ,  H05K2201/10719 ,  H05K3/3473 ,  H05K3/386

Abstract: A compliant element (23, 25) is provided between an integrated circuit (11) and a substrate (19) which are bonded and interconnected by an anisotropic conductive adhesive (20) comprising conductive particles (21) in a polymer matrix (22). In one embodiment, one set of bonding pads (12, FIG. 2) is coated with a layer (23) of a metal that is significantly softer than the metal from which the conductive particles are made, which permits an oversized conductive particle (21a) to indent into the soft metal layer (23). In another embodiment, one of the sets of bonding pads (15, FIG. 3) is arranged on a relatively thick layer of adhesive (25) which is sufficiently viscous at the temperature at which contact is made to permit the bonding pad (15) to pivot in response to pressure from an oversized conductive particle (21d).

Abstract translation: 柔性元件（23,25）设置在集成电路（11）和基板（19）之间，所述集成电路（11）和基板（19）通过在聚合物基体（22）中包含导电颗粒（21）的各向异性导电粘合剂（20）结合并互连。 在一个实施例中，一组接合焊盘（图2中的12）涂覆有金属层（23），其比制成导电颗粒的金属显着更软，这允许过大的导电颗粒（21a ）压入软金属层（23）中。 在另一个实施例中，一组接合焊盘（图3中的15个）布置在相对较厚的粘合剂层25上，粘合剂层25在接触的温度下具有足够的粘性以允许接合焊盘（15） 响应于来自过大导电颗粒（21d）的压力而枢转。

公开(公告)号：US5183593A

公开(公告)日：1993-02-02

申请号：US533682

申请日：1990-06-04

Applicant: David Durand ,  David P. Vieau ,  Tai S. Wei ,  Ang-Ling Chu

Inventor： David Durand ,  David P. Vieau ,  Tai S. Wei ,  Ang-Ling Chu

IPC: C08K3/08 ,  C08G59/00 ,  C08K3/02 ,  C08K7/00 ,  C08K9/02 ,  C08L63/00 ,  C08L75/00 ,  C08L75/04 ,  C08L83/04 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

Abstract translation: 用于粘合导电配合表面的导电胶粘剂在高湿度条件下提供基本稳定的导电特性; 包括提供超过约6.8％（体积）的体积收缩率的载体和包含附聚物，颗粒，粉末，薄片，涂覆的镍颗粒和涂覆的玻璃球的导电填料，其具有保持稳定的电气的尺寸和表面特性 通过与电气部件引线形成防潮接触来进行接触。 具有大于约6.8％（vol）的未固化状态和固化状态之间的体积收缩率的载体似乎会影响填料颗粒的压实，导致颗粒被强制与要连接的表面增强的电接触并提供一种 测量颗粒本身之间的压实度以增强颗粒到颗粒的传导。 在固化期间聚合物载体的收缩使内部颗粒在足够的压力下被压缩以促使颗粒彼此接合，并且使颗粒渗透可能存在于组分引线上的非导电氧化物。