公开(公告)号：JP2009135500A

公开(公告)日：2009-06-18

申请号：JP2008304440

申请日：2008-11-28

Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

Inventor： CHO BEOM JOON ,  LEE JONG MYEON

IPC: H05K3/46 ,  C04B35/64 ,  H01L23/12 ,  H01L23/15

CPC classification number: B32B18/00 ,  C04B38/0022 ,  C04B2111/00844 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/252 ,  C04B35/10 ,  C04B38/0054 ,  C04B38/0675 ,  C04B38/068

Abstract: PROBLEM TO BE SOLVED: To provide a constraining green sheet and a manufacturing method of a multi-layer ceramic substrate using the same. SOLUTION: There is provided the constraining green sheet including: a first constraining layer having a surface disposed on one of the top and bottom surfaces of a ceramic laminated body and containing first inorganic powder; and a second constraining layer disposed on the top of the first constraining layer and containing second inorganic powder and a fly ash. Also, there is provided the manufacturing method of the multi-layer ceramic substrate including: a step of providing a non-sintered ceramic laminated body including a plurality of ceramic green sheets; a step of providing at least one constraining green sheet including the first constraining layer containing the first inorganic powder and the second constraining layer containing the second inorganic powder and the combustion material; a step of disposing the constraining green sheet by bonding a surface of the first constraining layer to one of top and bottom parts of the ceramic laminated body; and a step of sintering the ceramic laminated body at a predetermined sintering temperature. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供约束生片和使用其的多层陶瓷基片的制造方法。 解决方案：提供约束生片，其包括：第一约束层，其具有设置在陶瓷层压体的顶表面和底表面中的一个表面并包含第一无机粉末的表面; 以及第二约束层，其设置在所述第一约束层的顶部并且包含第二无机粉末和飞灰。 另外，提供了多层陶瓷基板的制造方法，其特征在于，具备：提供包含多个陶瓷生片的非烧结陶瓷层叠体的工序; 提供包含含有第一无机粉末的第一约束层和含有第二无机粉末和燃烧材料的第二约束层的至少一个约束生片的步骤; 通过将第一约束层的表面粘合到陶瓷层叠体的顶部和底部之一来设置约束生片; 以及在预定烧结温度下烧结陶瓷层叠体的步骤。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：EP2928080B1

公开(公告)日：2018-11-28

申请号：EP15161767.7

申请日：2015-03-30

Applicant: TPK Universal Solutions Limited

Inventor： Kao, Kuo-Feng ,  Huang, Sung-Chien ,  Leong, Wee-Hong ,  Wu, Shiang-Ting

IPC: H03K17/96 ,  C09J9/02 ,  H05K3/32

CPC classification number: G06F3/044 ,  C09J9/02 ,  H03K17/962 ,  H03K2217/94094 ,  H03K2217/960755 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0269

Abstract: A capacitive touch-sensitive device includes a sensor electrode layer, a signal trace layer, a flexible circuit board and an electrically-conductive adhesive layer. The sensor electrode layer includes electrically isolated sensor lines. The signal trace layer includes electrically isolated signal lines, each having an outer terminal portion coupled to a respective one of the sensor lines. The flexible circuit board has isolated mutually bonding pads, each corresponding to the outer terminal portion. The electrically-conductive adhesive layer includes a plurality of zones, each having a first adhesive matrix and first conductors dispersed therein. The first conductors bridge the outer terminal portion to the bonding pad.

公开(公告)号：EP3166372A4

公开(公告)日：2017-08-02

申请号：EP15821293

申请日：2015-07-10

Applicant: MAT CONCEPT INC

Inventor： KOIKE JUNICHI ,  ANDO DAISUKE ,  SUTOU YUJI

IPC: H05K3/38 ,  H01G2/06 ,  H01L31/0224 ,  H05K1/09

CPC classification number: H05K1/09 ,  H01G2/06 ,  H01G4/008 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K3/10 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4007 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2203/086 ,  H05K2203/087

Abstract: To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.

Abstract translation: 本发明提供一种电子部件，该电子部件在无机材料基板上具有铜电极，该基板与铜电极之间的密合强度高，能够提高铜电极的密合性。 以及该电子部件的制造方法。 一种电子部件，在无机材料基板上具有铜电极，在基板和铜电极的界面设置含有铜，锰，硅和氧的界面层，界面层含有主要形成的晶粒 的铜并分散在界面层中。 该电子部件的制造方法包括：界面层形成工序，在基板上形成界面层; 以及用于在界面层上形成铜电极的电极形成步骤。

公开(公告)号：EP2525398A4

公开(公告)日：2017-03-15

申请号：EP11732925

申请日：2011-01-13

Applicant: KYOCERA CORP

Inventor： ISHIMINE YUUSAKU ,  MORIYAMA MASAYUKI ,  KOMATSUBARA KENJI

IPC: H01L23/15 ,  H01L23/13 ,  H01L23/373 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: Provided is a silicon nitride substrate capable of enhancing the bond strength when a member made of a metal is bonded to the substrate, and a circuit substrate and an electronic device capable of improving reliability by using the silicon nitride substrate. The silicon nitride substrate 1 comprises a substrate 1a comprising a silicon nitride sintered body, and a plurality of granular bodies 1b containing silicon and integrated to a principal surface of the substrate 1a, wherein a plurality of needle crystals 1c or column crystals 1d comprising mainly silicon nitride are extended from a portion of the granular bodies 1b. A brazing material is applied to a principal surface of the substrate 1a, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies 1b integrated to the principal surface of the substrate 1a, and a plurality of the needle crystals 1c or the column crystals 1d extended from a portion of the granular bodies 1b, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate 1.

Abstract translation: 提供一种当由金属制成的构件结合到基板上时能够提高结合强度的氮化硅衬底，以及能够通过使用氮化硅衬底提高可靠性的电路衬底和电子器件。 氮化硅衬底1包括包括氮化硅烧结体的衬底1a和包含硅的多个粒状体1b，并与衬底1a的主表面一体化，其中主要包含硅的多个针状晶体1c或柱状晶体1d 氮化物从颗粒体1b的一部分延伸。 将钎焊材料施加到基板1a的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘结。 由于在基体1a的主面上形成有多个粒状体1b，并且从粒状体1b的一部分延伸的多个针状结晶体1c或柱状结晶体1d，产生高的锚效应， 电路构件和散热构件牢固地结合到氮化硅衬底1上。

公开(公告)号：EP2773169A4

公开(公告)日：2016-02-10

申请号：EP12842736

申请日：2012-09-28

Applicant: KYOCERA CORP

Inventor： NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  SHIKATA KUNIHIDE

IPC: H05K1/09 ,  C04B41/00 ,  C04B41/52 ,  C04B41/90 ,  C04B111/00 ,  H01L23/15 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/38

CPC classification number: H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

公开(公告)号：EP2763513A4

公开(公告)日：2015-10-21

申请号：EP12836336

申请日：2012-09-29

Applicant: KYOCERA CORP

Inventor： HAYASHI KATSURA

IPC: H05K3/46 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H05K1/05 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15321 ,  H05K1/056 ,  H05K1/185 ,  H05K3/4608 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a wiring substrate that meets the demand for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure in which an electronic component is mounted on the wiring substrate or the component embedded substrate. [Solution] The wiring substrate is provided with a metal plate (2), and a wiring layer (5) that has a plurality of insulating layers (3) and a conductive layer (4) arranged on the plurality of insulating layers (3) and is arranged on at least one principal surface of the metal plate (2). The plurality of insulating layers (3) in the wiring layer (5) has a first insulating layer (6) which is provided so as to contact the principal surface of the metal plate (2) and has a larger thermal expansion rate in the planar direction than the metal plate (2) and a second insulating layer (7) which is laminated on the first insulating layer (6) so as to contact the first insulating layer (6) and has smaller thermal expansion rate in the planar direction than the metal plate (2). The first insulating layer (6) includes a resin (8). The second insulating layer (7) includes a plurality of first particles (10) that are made of an inorganic insulating material and mutually connected, and has a part of the first insulating layer (6) arranged in a gap between the plurality of first particles (10).

公开(公告)号：EP2928080A1

公开(公告)日：2015-10-07

申请号：EP15161767.7

申请日：2015-03-30

Applicant: TPK Universal Solutions Limited

Inventor： Kao, Kuo-Feng ,  Huang, Sung-Chien ,  Leong, Wee-Hong ,  Wu, Shiang-Ting

IPC: H03K17/96 ,  C09J9/02 ,  H05K3/32

CPC classification number: G06F3/044 ,  C09J9/02 ,  H03K17/962 ,  H03K2217/94094 ,  H03K2217/960755 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0269

Abstract: A capacitive touch-sensitive device includes a sensor electrode layer, a signal trace layer, a flexible circuit board and an electrically-conductive adhesive layer. The sensor electrode layer includes electrically isolated sensor lines. The signal trace layer includes electrically isolated signal lines, each having an outer terminal portion coupled to a respective one of the sensor lines. The flexible circuit board has isolated mutually bonding pads, each corresponding to the outer terminal portion. The electrically-conductive adhesive layer includes a plurality of zones, each having a first adhesive matrix and first conductors dispersed therein. The first conductors bridge the outer terminal portion to the bonding pad.

Abstract translation: 电容式触敏装置包括传感器电极层，信号迹线层，柔性电路板和导电粘合剂层。 传感器电极层包括电隔离的传感器线。 信号迹线层包括电隔离的信号线，每条信号线都具有耦合到相应传感器线之一的外部端子部分。 柔性电路板具有隔离的相互接合的焊盘，每个对应于外部端子部分。 导电粘合剂层包括多个区域，每个区域具有分散在其中的第一粘合剂基质和第一导体。 第一导体将外部端子部分桥接到接合焊盘。

公开(公告)号：EP2763513A1

公开(公告)日：2014-08-06

申请号：EP12836336.3

申请日：2012-09-29

Applicant: Kyocera Corporation

Inventor： HAYASHI, Katsura

IPC: H05K1/05 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15321 ,  H05K1/056 ,  H05K1/185 ,  H05K3/4608 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a wiring substrate that meets the demand for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure in which an electronic component is mounted on the wiring substrate or the component embedded substrate. [Solution] The wiring substrate is provided with a metal plate (2), and a wiring layer (5) that has a plurality of insulating layers (3) and a conductive layer (4) arranged on the plurality of insulating layers (3) and is arranged on at least one principal surface of the metal plate (2). The plurality of insulating layers (3) in the wiring layer (5) has a first insulating layer (6) which is provided so as to contact the principal surface of the metal plate (2) and has a larger thermal expansion rate in the planar direction than the metal plate (2) and a second insulating layer (7) which is laminated on the first insulating layer (6) so as to contact the first insulating layer (6) and has smaller thermal expansion rate in the planar direction than the metal plate (2). The first insulating layer (6) includes a resin (8). The second insulating layer (7) includes a plurality of first particles (10) that are made of an inorganic insulating material and mutually connected, and has a part of the first insulating layer (6) arranged in a gap between the plurality of first particles (10).

Abstract translation: 为了提供一种能够满足提高与电子部件的连接可靠性的要求的布线基板，将布线基板中嵌入有嵌入部件的部件嵌入基板以及将电子部件安装在布线基板或部件上的封装结构 嵌入式基板。 [解决方案]布线基板设置有金属板（2）和布置在多个绝缘层（3）上的多个绝缘层（3）和导电层（4）的布线层（5） 并布置在金属板（2）的至少一个主表面上。 布线层（5）中的多个绝缘层（3）具有第一绝缘层（6），其设置成与金属板（2）的主表面接触，并且在平面上具有较大的热膨胀率 方向比金属板（2）和第二绝缘层（7）层叠在第一绝缘层（6）上以与第一绝缘层（6）接触，并且在平面方向上的热膨胀率比 金属板（2）。 第一绝缘层（6）包括树脂（8）。 第二绝缘层（7）包括由无机绝缘材料制成并相互连接的多个第一颗粒（10），并且具有布置在多个第一颗粒之间的间隙中的第一绝缘层（6）的一部分 （10）。

公开(公告)号：EP0568930B1

公开(公告)日：1998-03-04

申请号：EP93107031.2

申请日：1993-04-30

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hatakeyama, Akihito ,  Sogo, Hiroshi ,  Kojima, Tamao ,  Horio, Yasuhiko ,  Tsukamoto, Masahide ,  Fukumura, Yasushi

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/28 ,  H05K3/4069 ,  H05K3/4623 ,  H05K2201/0116 ,  H05K2201/0269 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

公开(公告)号：EP0568930A2

公开(公告)日：1993-11-10

申请号：EP93107031.2

申请日：1993-04-30

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hatakeyama, Akihito ,  Sogo, Hiroshi ,  Kojima, Tamao ,  Horio, Yasuhiko ,  Tsukamoto, Masahide ,  Fukumura, Yasushi

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/28 ,  H05K3/4069 ,  H05K3/4623 ,  H05K2201/0116 ,  H05K2201/0269 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the free tackness films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the free tackness films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste (4) are connected for electrical connection between the metal foils (5).

Abstract translation: （2）设置有覆盖薄膜（1）并且具有压缩收缩性导电浆料制造用于印刷电路的有机基板的方法，该方法包括通孔的多孔原材料（3）形成的步骤 （4）插入到通孔（3），分离;从其通孔从所述多孔原材料（2）填充有在其通孔（3）的导电浆料（4）（1）中，施加金属箔 （5）在多孔原材料的表面（2），从该在覆盖薄膜（1）被分离，并通过加热和加压，从而压缩施加有金属箔（5）（2）的多孔原材料 在导电浆料（4）的导电物质相连接的金属箔（5）之间的电连接。