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公开(公告)号：EP0666704B1
公开(公告)日：1997-08-27
申请号：EP95101438.0
申请日：1995-02-02
Applicant: DENSO CORPORATION
Inventor： Kato, Miki , Tamano, Yukinori , Kobayashi, Katsumi , Noba, Michiyuki
IPC: H05K1/00
CPC classification number: H05K1/028 , H05K1/189 , H05K2201/0311 , H05K2201/051 , H05K2201/057 , H05K2203/0271 , H05K2203/1105
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公开(公告)号：EP0652692A1
公开(公告)日：1995-05-10
申请号：EP94203162.6
申请日：1994-10-31
Applicant: Philips Patentverwaltung GmbH , PHILIPS ELECTRONICS N.V.
Inventor： Ziegler, Bernhard
CPC classification number: H05K1/0393 , H05K1/0366 , H05K1/141 , H05K1/145 , H05K1/189 , H05K3/3447 , H05K3/366 , H05K2201/057 , H05K2201/0715 , H05K2201/09172 , H05K2203/302
Abstract: Gemäß der Erfindung wird eine Leiterplatte (14) vorgeschlagen, die vorzugsweise in gebogenem Zustand verwendet wird, wobei gemäß der Erfindung diese Leiterplatte 14) aus einem Verbundwerkstoff hergestellt ist, der aus einem Epoxidharz und aus einem Glasfasergewebe besteht.
Abstract translation: 根据本发明，提出了一种电路板（14），其优选地以弯曲状态使用，根据本发明，该电路板14）由包含环氧树脂和玻璃纤维织物的复合材料制成。
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83.发明公开
公开(公告)号：EP0163581A1
公开(公告)日：1985-12-04
申请号：EP85401071.7
申请日：1985-05-30
Applicant: THOMSON-CSF
Inventor： Dezon, Lucien
CPC classification number: H05K3/4092 , H05K1/0281 , H05K1/0298 , H05K1/112 , H05K1/118 , H05K1/141 , H05K3/06 , H05K3/281 , H05K3/36 , H05K3/363 , H05K2201/0355 , H05K2201/0394 , H05K2201/057 , H05K2201/09472 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009 , H05K2203/063
Abstract: La présente invention concerne un dispositif de raccordement électrique entre deux cartes de circuit imprimés, réalisé à partir d'au moins deux substrats isolants (4 et 9) percés à leurs deux extrémités et à partir de rubans conducteurs (11) disposés entre ces deux substrats, sur toute leur longueur, de façon à ménager des zones (110) où les connexions électriques consituées par les rubans conducteurs sont dénudées.
Application aux cartes de circuits imprimés à haute densité.Abstract translation: 该装置从至少两个产生绝缘刺穿通过在它们的两个端部，并从在其全长之间论文两个衬布置导电带（11）底物（4和9），在寻求一种方法，以形成区（110） 其中由导电条带形成的电连接被剥离。 应用到高密度印刷电路板。
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公开(公告)号：EP0065154A3
公开(公告)日：1984-03-28
申请号：EP82103672
申请日：1982-04-29
Applicant: KRONE GMBH
Inventor： BECKER, PETER
CPC classification number: H05K1/189 , H05K1/028 , H05K3/28 , H05K2201/057 , H05K2201/09018 , H05K2201/10651 , H05K2203/302
Abstract: Gegenstand der Erfindung ist eine entsprechend der Kontur des Einbaugerätes gebogen ausgebildete Leiterplat te (1) aus dünnem Basismaterial, deren elektronische Bau elemente (2) vorzugsweise längs einer Richtung parallel zu einer Biegeachse (3) ausgerichtet sind.
Zur Vermeidung von Rißbildungen beim Biegen ist die Leiterplatte (1) mit Lötstoplack überzogen.-
公开(公告)号：EP3300467A1
公开(公告)日：2018-03-28
申请号：EP16190635.9
申请日：2016-09-26
Applicant: IMEC VZW , Universiteit Gent
Inventor： Vanfleteren, Jan , Plovie, Bart , Bossuyt, Mr. Frederick
CPC classification number: H05K3/0005 , H05K1/0283 , H05K1/189 , H05K3/0014 , H05K3/284 , H05K2201/0129 , H05K2201/057 , H05K2201/09018 , H05K2201/09263
Abstract: Methods are provided for manufacturing shape-retaining non-flat devices comprising elements such as components integrated on a device surface, the non-flat devices being made by deformation of a flat device. Based on the layout of a non-flat device, a layout of a flat device is first designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to unambiguously define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.
Abstract translation: 提供了用于制造形状保持非平坦装置的方法，所述装置包括诸如集成在装置表面上的部件等元件，所述非平坦装置通过平坦装置的变形而制成。 基于非平面设备的布局，首先设计平面设备的布局。 提供了一种用于设计这样的扁平装置的布局方法，其中该方法包括将对元件之间的机械互连，以明确地定义非平坦装置的表面上的元件的位置，从而留下零种或更小程度的 组件位置的自由度。 基于由此得到平坦的装置的布局，扁平装置通过热成型工艺来制造和下变换成形状保持非平面器件，从而精确地和可重复地定位在预定位置处的元件的表面上 非平坦的设备。
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Patent Agency Ranking86.发明公开
公开(公告)号：EP2921037A1
公开(公告)日：2015-09-23
申请号：EP13794857.6
申请日：2013-11-15
Applicant: JUMATECH GmbH
Inventor： WÖLFEL, Markus
CPC classification number: H05K1/028 , H05K1/0265 , H05K1/0278 , H05K1/111 , H05K3/0014 , H05K3/0017 , H05K3/202 , H05K2201/0275 , H05K2201/0355 , H05K2201/0376 , H05K2201/057 , H05K2201/09027 , H05K2201/0969 , H05K2201/1028 , Y10T29/49156
Abstract: The invention relates to an angle-adjustable and/or angled printed circuit board structure having at least two printed circuit board sections arrangeable or arranged angularly with respect to one another, wherein the printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two connection locations and is electrically conductively connected to said connection locations, wherein the two connection locations are situated on different printed circuit board sections, wherein the printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the connection locations and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. In order to improve the electrical and mechanical connection between the printed circuit board sections, the invention provides for the conduction element to have a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section. A corresponding method for producing this printed circuit board structure is likewise claimed.
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87.发明授权
公开(公告)号：EP1468042B1
公开(公告)日：2007-04-18
申请号：EP03731660.1
申请日：2003-01-23
Applicant: JENOPTIK Automatisierungstechnik GmbH
Inventor： FEISTEL, Ulf , DIENER, Roland , WEINZIERL, Uwe
CPC classification number: G02B6/4405 , G02B6/4226 , H05K1/0281 , H05K1/0289 , H05K3/4084 , H05K2201/0112 , H05K2201/057 , H05K2201/2009 , H05K2203/107 , H05K2203/1189
Abstract: The aim of the invention is to provide positioning and mounting options with improved handling characteristics even at places that are difficult to access or in other difficult conditions. Said aim is achieved by using functional elements comprising at least one area that can be foamed by supplying energy. At least one of said areas is used as a positioning element for positioning an object or for stiffening flexible or easily bendable materials in a shape-stabilizing manner.
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公开(公告)号：EP0294232A3
公开(公告)日：1990-11-28
申请号：EP88305112.0
申请日：1988-06-03
Applicant: SHIN-KOBE ELECTRIC MACHINERY CO LTD
Inventor： Noda, Masayuki , Kariya, Kenichi , Yamaguchi, Takahiro , Takahashi, Katsuji
CPC classification number: B32B15/14 , B32B5/022 , B32B5/024 , B32B5/26 , B32B5/28 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2457/08 , C08J5/24 , C08J2363/00 , H05K1/036 , H05K1/0366 , H05K1/0393 , H05K2201/0133 , H05K2201/0145 , H05K2201/0278 , H05K2201/057 , H05K2203/302 , Y10S428/901 , Y10S428/902 , Y10T428/31525 , Y10T428/31529 , Y10T442/3431 , Y10T442/3439 , Y10T442/3504 , Y10T442/3813
Abstract: A central layer (5) of glass fiber woven fabric is laminated between two layers of sheet-like material (6) more expansible and compressible than the glass fiber fabric, preferably as an organic fiber, e.g. of a polyester, aramid, polyamide or phenolic fiber, as woven or nonwoven fabric; the outer layers (6) are impregnated by treatment with a solution of an adduct between a copolymer of polybutadiene and acrylonitrile having terminal carboxyl groups with a polyfunctional epoxy resin which may be brominated, and optionally containing a curing agent, and the central layer is impregnated with the adduct or with a polyfunctional epoxy resin; heat and pressure are applied to make the laminate. A metal foil,e.g. of copper, is applied to the outer faces to provide a base of a printed circuit board, which can be bent to a desired shape.
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公开(公告)号：EP0294232A2
公开(公告)日：1988-12-07
申请号：EP88305112.0
申请日：1988-06-03
Applicant: SHIN-KOBE ELECTRIC MACHINERY CO LTD
Inventor： Noda, Masayuki , Kariya, Kenichi , Yamaguchi, Takahiro , Takahashi, Katsuji
CPC classification number: B32B15/14 , B32B5/022 , B32B5/024 , B32B5/26 , B32B5/28 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2457/08 , C08J5/24 , C08J2363/00 , H05K1/036 , H05K1/0366 , H05K1/0393 , H05K2201/0133 , H05K2201/0145 , H05K2201/0278 , H05K2201/057 , H05K2203/302 , Y10S428/901 , Y10S428/902 , Y10T428/31525 , Y10T428/31529 , Y10T442/3431 , Y10T442/3439 , Y10T442/3504 , Y10T442/3813
Abstract: A central layer (5) of glass fiber woven fabric is laminated between two layers of sheet-like material (6) more expansible and compressible than the glass fiber fabric, preferably as an organic fiber, e.g. of a polyester, aramid, polyamide or phenolic fiber, as woven or nonwoven fabric; the outer layers (6) are impregnated by treatment with a solution of an adduct between a copolymer of polybutadiene and acrylonitrile having terminal carboxyl groups with a polyfunctional epoxy resin which may be brominated, and optionally containing a curing agent, and the central layer is impregnated with the adduct or with a polyfunctional epoxy resin; heat and pressure are applied to make the laminate.
A metal foil,e.g. of copper, is applied to the outer faces to provide a base of a printed circuit board, which can be bent to a desired shape.Abstract translation: 玻璃纤维织物的中心层（5）层压在比玻璃纤维织物更可膨胀和可压缩的两层片状材料（6）之间，优选作为有机纤维，例如玻璃纤维织物。 的聚酯，芳族聚酰胺，聚酰胺或酚醛纤维，作为机织或非织造织物; 通过用聚丁二烯共聚物与末端羧基的共聚物与可能被溴化的多官能环氧树脂和任选地含有固化剂的加成物溶液处理来浸渍外层（6），并且中心层被浸渍 与加合物或多官能环氧树脂; 施加热和压力以制造层压板。 金属箔，例如 的铜被施加到外表面以提供可以弯曲成所需形状的印刷电路板的基部。
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公开(公告)号：EP0065154A2
公开(公告)日：1982-11-24
申请号：EP82103672.0
申请日：1982-04-29
Applicant: KRONE Aktiengesellschaft
Inventor： Becker, Peter
CPC classification number: H05K1/189 , H05K1/028 , H05K3/28 , H05K2201/057 , H05K2201/09018 , H05K2201/10651 , H05K2203/302
Abstract: © Gegenstand der Erfindung ist eine entsprechend der Kontur des Einbaugerätes gebogen ausgebildete Leiterplatte (1) aus dünnem Basismaterial, deren elektronische Bauelemente (2) vorzugsweise längs einer Richtung parallel zu einer Biegeachse (3) ausgerichtet sind.
Zur Vermeidung von Rißbildungen beim Biegen ist die Leiterplatte (1) mit Lötstoplack überzogen.Abstract translation: 印刷电路板包括由柔性材料形成的板1，并在其上安装有组件2.部件的轴线设置成基本上平行于弯曲轴3，弯曲轴3在使用中板弯曲。 该板还带有涂有阻焊剂的印刷导体，以在板弯曲时最小化破裂。
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