公开(公告)号：WO2007092603A3

公开(公告)日：2008-04-17

申请号：PCT/US2007003515

申请日：2007-02-08

Applicant: LIFESYNC CORP

Inventor： GOBRON STEPHANE

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/365 ,  A61B5/04085 ,  A61B5/04286 ,  A61B2562/227 ,  H01R12/52 ,  H01R12/78 ,  H01R13/627 ,  H01R35/04 ,  H05K1/118 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/10053 ,  H05K2201/10598 ,  Y10S439/909

Abstract: The present invention comprises an inexpensive and simple means for electrically and mechanically connecting a plurality of printed circuits together. The present invention also comprised embodiments where the printed circuits can be moved relative to each other without breaking the electrical contact between them. Yet another embodiment contemplates a means for joining two linear printed circuits to make a longer circuit. In yet another embodiment, the printed circuits and connections are used to make an inexpensive, reliable electrical harness for contacting a patient-worn sensor to a patient monitor such as an ECG monitor.

Abstract translation: 本发明包括用于将多个印刷电路电连接和机械连接在一起的便宜且简单的装置。 本发明还包括其中印刷电路可相对于彼此移动而不破坏它们之间的电接触的实施例。 另一个实施例设想用于连接两个线性印刷电路以制造更长电路的装置。 在另一个实施例中，印刷电路和连接用于制造便宜且可靠的电气线束，用于将患者佩戴的传感器接触患者监护仪，例如ECG监测器。

公开(公告)号：WO2019043298A1

公开(公告)日：2019-03-07

申请号：PCT/FI2018/050618

申请日：2018-08-31

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： PENTIKÄINEN, Vesa ,  JOKELAINEN, Kimmo

IPC: H05K3/36 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K3/365 ,  H05K1/028 ,  H05K1/117 ,  H05K1/118 ,  H05K1/142 ,  H05K1/147 ,  H05K3/325 ,  H05K2201/048 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10393 ,  H05K2201/10568 ,  H05K2201/209 ,  H05K2203/0278 ,  H05K2203/167

Abstract: A flexible electronic foil (1, 1', 1") comprising a flexible substrate (2) and at least one electrically conductive portion (3) arranged to the substrate (2). The foil (1, 1', 1") comprises mechanical fastening means (6, 6', 7) for mechanical fastening of the electronic foil (1, 1', 1"), the mechanical fastening means being part of the substrate (2) of the electronic foil (1, 1', 1").

公开(公告)号：WO2017082502A1

公开(公告)日：2017-05-18

申请号：PCT/KR2016/005768

申请日：2016-05-31

Applicant: LG ELECTRONICS INC.

Inventor： RYU, Seunghak

IPC: G09G5/00 ,  H01B7/08 ,  H01B7/04 ,  G09F9/30 ,  G09F9/00 ,  H01L51/56 ,  G02F1/133

CPC classification number: H01R12/774 ,  H01R12/81 ,  H01R13/6205 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/09845

Abstract: A display device is disclosed. The display device includes a body, a housing separated from the body and configured to transmit/receive signals to/from the body, and a cable coupling the housing and the body, wherein the cable includes a flat cable located in at least part of the cable and having a flat shape, and a round cable located in at least another part of the cable and having a round shape. According to the present invention, the flat cable has a narrow width by including a plurality of layers, and thus wiring of signal terminals and power terminals can be easily changed between the flat cable and the round cable.

Abstract translation: 公开了一种显示装置。 该显示装置包括主体，与主体分离并且被配置为向/从主体发送信号/从主体接收信号的外壳，以及耦合外壳和主体的线缆，其中线缆包括位于至少部分 电缆并具有扁平形状，并且圆形电缆位于电缆的至少另一部分中且具有圆形形状。 根据本发明，扁平电缆通过包括多个层而具有窄的宽度，因此信号端子和电源端子的布线可以容易地在扁平电缆和圆形电缆之间改变。

公开(公告)号：WO2016040389A2

公开(公告)日：2016-03-17

申请号：PCT/US2015/049037

申请日：2015-09-08

Applicant: ALIPHCOM ,  SINGLETON, Chris ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  PANCHALAN, Prasad ,  NABANJA, Sheila ,  SHARMA, Sumit ,  HOU-YAN CHENG, Sylvia

Inventor： SINGLETON, Chris ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  PANCHALAN, Prasad ,  NABANJA, Sheila ,  SHARMA, Sumit ,  HOU-YAN CHENG, Sylvia

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/181 ,  A61B5/053 ,  A61B5/6831 ,  A61B2562/043 ,  A61B2562/125 ,  A61B2562/222 ,  H05K1/0283 ,  H05K1/0326 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/305 ,  H05K3/326 ,  H05K2201/042 ,  H05K2201/058 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2203/1147 ,  H05K2203/1305

Abstract: A strap band including a flexible wire bus having electrodes and wires coupled with the electrodes is described. The wire bus may be include in a strap band formed by molding an inner strap, mounting the wire bus in the inner strap, and injection molding an outer strap over the inner strap and wire bus to form a strap band. The electrodes may be positioned on the inner strap to accommodate a target range of a body portion the strap band may be worn on. A material of the strap band and a material the wire bus may be selected to allow a low coefficient of friction between the wire bus and strap band so that loads applied to the strap band may not be coupled with the wire bus or cause damage to wires due to pull and/or torsional load forces applied to the strap band.

Abstract translation: 描述了包括具有与电极耦合的电极和导线的柔性线总线的带带。 线总线可以包括在通过模制内带而形成的带带中，将线总线安装在内带中，以及将外带注射成型在内带和线总线上以形成带带。 电极可以定位在内带上以适应带带可能穿戴的身体部分的目标范围。 带带的材料和可选择的线总线的材料，以允许线总线和带带之间的低摩擦系数，使得施加到带带的负载可能不与线总线耦合或导致对线的损坏 由于施加到带带的拉力和/或扭转载荷力。

公开(公告)号：WO2014092633A1

公开(公告)日：2014-06-19

申请号：PCT/SE2013/051476

申请日：2013-12-10

Applicant: FLATFROG LABORATORIES AB

Inventor： NORDSTRÖM, Per ,  LANDAHL, Henrik

IPC: H05K3/36 ,  H05K1/14

CPC classification number: H05K3/368 ,  H05K1/142 ,  H05K3/4092 ,  H05K2201/055 ,  H05K2201/058

Abstract: The invention relates to a connection system for connection of PCBs comprising a first PCB provided with a flexible film with electrically conducting traces for electrical connection to a second PCB, wherein the flexible film is adapted to be folded along an oblique line extending from a side of the flexible film to another side of the flexible film such that when folded an end part of the flexible film is located outside a border of the first PCB and is connectable to the second PCB. The invention also relates to a method for connection of PCBs, and a method for manufacturing a system for connection of PCBs.

Abstract translation: 本发明涉及用于连接PCB的连接系统，该连接系统包括设置有柔性膜的第一PCB和用于与第二PCB电连接的导电迹线，其中柔性膜适于沿着从 柔性膜到柔性膜的另一侧，使得当折叠时，柔性膜的端部位于第一PCB的边界之外并且可连接到第二PCB。 本发明还涉及一种用于连接PCB的方法，以及一种用于制造用于连接PCB的系统的方法。

公开(公告)号：WO2013126349A1

公开(公告)日：2013-08-29

申请号：PCT/US2013/026746

申请日：2013-02-19

Applicant: DYNAMICS INC. ,  MULLEN, Jeffrey, D. ,  O'SHEA, Norman, E. ,  HARTWICK, David, J. ,  BATRA, Gautam ,  WORKLEY, James, H. ,  BRUNER, Kevin, D. ,  SHIPPEE, Geoffrey, D. ,  BOWERS, Allen, D. ,  VETER, Andrew

Inventor： MULLEN, Jeffrey, D. ,  O'SHEA, Norman, E. ,  HARTWICK, David, J. ,  BATRA, Gautam ,  WORKLEY, James, H. ,  BRUNER, Kevin, D. ,  SHIPPEE, Geoffrey, D. ,  BOWERS, Allen, D. ,  VETER, Andrew

IPC: H01L21/461

CPC classification number: H01L25/50 ,  G06K7/082 ,  G06K19/0716 ,  G06K19/0723 ,  G06K19/07707 ,  G06K19/07709 ,  G06K19/08 ,  G11B5/00808 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/07811 ,  H01L2924/1305 ,  H01L2924/1461 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10098 ,  H05K2203/163 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Die may be thinned using a thinning and/or a polishing process. Such thinned die may be flexible and may change operational characteristics when flexed. Detection circuitry may also be provided on the PCB and may be used to detect changed operational characteristics. The thinned die may be stacked, interconnected, and encapsulated between sheets of laminate material to form a flexible card or device. A powered card may include a circuit board with multiple layers, and may include multiple reader communication devices. One of the layers may include an RFID antenna. A powered card may include a plurality of types of sensors used to detect a read-head of a card reader.

Abstract translation: 可以使用减薄和/或抛光工艺来减薄模具。 这种薄的模具可以是柔性的并且可以在弯曲时改变操作特性。 也可以在PCB上提供检测电路，并且可以用于检测改变的操作特性。 薄的模具可以堆叠，互连并且封装在层压材料片之间以形成柔性卡或装置。 动力卡可以包括具有多层的电路板，并且可以包括多个读取器通信设备。 层之一可以包括RFID天线。 动力卡可以包括用于检测读卡器的读取头的多种类型的传感器。

公开(公告)号：WO2009112626A1

公开(公告)日：2009-09-17

申请号：PCT/FI2008/000041

申请日：2008-03-14

Applicant: ZIPIC OY ,  AALLOS, Sampo

Inventor： AALLOS, Sampo

IPC: H05K7/14 ,  H05K1/14 ,  H05K1/00

CPC classification number: H05K1/189 ,  H01L23/053 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/058 ,  H01L2924/00

Abstract: Method for packaging a component film (2) with several layers including electronic components in order to be a module equipped with a lid (1) which module comprises a connection area (5) with its one or several edge parts and a flexible film material is used as a component film (2) and it is bent up or downwards at its one edge comprising the connection area (5) approximately 90° in order to reduce the surface area required by the film (2) whereupon the connection area (5) belonging to the mentioned edge moves to the vertical part of the film in order to further reduce the surface area required by the connecting of the module. When the module is being formed, several component films (2 a - c) are located on top of each other and the bent edges belonging to them are directed to various sides of the module.

Abstract translation: 用于将包括电子部件的多层的部件膜（2）包装以便成为具有盖（1）的模块的方法，该模块包括具有其一个或多个边缘部分的连接区域（5）和柔性膜材料 用作部件膜（2），并且在其包括连接区域（5）的大约90°的一个边缘处向上或向下弯曲，以减少膜（2）所需的表面积，从而连接区域（5） 属于上述边缘的部分移动到膜的垂直部分，以便进一步减小模块连接所需的表面积。 当模块被形成时，几个部件膜（2a-c）位于彼此的顶部，并且属于它们的弯曲边缘被引导到模块的各个侧面。

公开(公告)号：WO2019055438A1

公开(公告)日：2019-03-21

申请号：PCT/US2018/050534

申请日：2018-09-11

Applicant: KNOWLES CAZENOVIA, INC.

Inventor： BATES, David

IPC: H05K1/14 ,  H05K3/46 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66 ,  H05K1/18 ,  H05K1/02 ,  H05K3/36 ,  H01L25/11

CPC classification number: H01P5/16 ,  H01L23/5387 ,  H01L23/552 ,  H01L23/66 ,  H01L25/0655 ,  H01L25/105 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2225/1047 ,  H01L2225/107 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/351 ,  H01P1/20 ,  H01P3/081 ,  H01P11/003 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/115 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/22 ,  H05K3/32 ,  H05K3/361 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/058 ,  H05K2201/10053 ,  H05K2201/1006

Abstract: A method for manufacturing a microwave or radio frequency (RF) device (300) including stacked printed circuit boards (PCBs) (102, 152) mounted on a flexible PCB (206) having at least one ground plane and signal terminals is disclosed. Each of the stacked PCBs includes through-holes (120) the sidewalls of which are coated with a conductive material. The first PCB and the second PCB are bonded to the flexible PCB, the first PCB spaced apart from the second PCB exposing a bend portion of the flexible PCB. Microwave components (110, 112, 154, 156) are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to respective signal terminals of the flexible PCB. A conductive cover (132, 228) is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover (132) of one PCB (102) faces the cover (228) of the second PCB (152). The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.

公开(公告)号：WO2015012611A1

公开(公告)日：2015-01-29

申请号：PCT/KR2014/006735

申请日：2014-07-24

Applicant: 주식회사 엘지화학

Inventor： 오덕수 ,  박성수 ,  강민수

IPC: H01L51/52 ,  H05B33/06 ,  G09F9/00

CPC classification number: H05K3/363 ,  H01L51/0097 ,  H01L51/5246 ,  H05K1/115 ,  H05K1/14 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/09563 ,  H05K2201/10128

Abstract: 본 명세서의 일 실시예는 양극， 음극 및 상기 양극과 음극 사이에 배치된 1층 이상의 유기물 층을 포함하는 발광부와 이의 외측에 위치하는 비발광부를 포함하는 기판， 상기 비발광부에 위치되는 2 이상의 연성인쇄회로기판， 및 상기 연성인쇄회로기판들 중 단부가 서로 이웃하는 것을 통전하는 납램부 및 와이어 본딩부 중 어느 하나 이상을 포함하는 유기 발광 소자를 제 공한다.

Abstract translation: 提供一种有机发光元件，根据本说明书的一个实施方案，包括：具有包括阴极，阳极和布置在其间的一个或多个有机材料层的发光部分的基板和非发光部分 在发光部的外侧; 位于非发光部分上的两个或多个柔性印刷电路板; 以及用于电连接柔性印刷电路板的相邻端的焊接部分和引线接合部分中的任何一个或多个。

公开(公告)号：WO2015012610A1

公开(公告)日：2015-01-29

申请号：PCT/KR2014/006734

申请日：2014-07-24

Applicant: 주식회사 엘지화학

Inventor： 오덕수 ,  강민수

IPC: H01L51/52 ,  H05B33/26

CPC classification number: H01L51/5246 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/5203 ,  H05K1/028 ,  H05K1/11 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/189 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/049

Abstract: 본 명세서는 기판 상에 설치된 연성인쇄회로기판의 구조체를 포함하는 유기 발광 소자에 관한 것이다.

Abstract translation: 本说明书涉及一种包括设置在基板上的柔性印刷电路板结构的有机发光元件。