公开(公告)号：JP2007325343A

公开(公告)日：2007-12-13

申请号：JP2006149981

申请日：2006-05-30

Applicant: Yazaki Corp ,  矢崎総業株式会社

Inventor： SATO HISAFUMI ,  ISHIDA YUICHI ,  ISHIGURO MASAAKI ,  NAKAMURA KAZUAKI

IPC: H02G3/16

CPC classification number: H05K7/026 ,  H01R9/226 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0382 ,  H05K2201/092

Abstract: PROBLEM TO BE SOLVED: To provide, at low cost, a small-sized and light-weighted electric connection box which is excellent in recyclability and soaking/heat dissipation, and besides not restricted in mounting position. SOLUTION: The electric connection box 11 is composed of a circuit board 14 where electric parts are mounted, and an upper case 12 and a lower case 13 which cover the circuit board 14. A metal core board where the surface of a plate-shaped metal core 24 is covered with an insulator 25 is used as the circuit board 14, and a part of the metal core 24 is bent to serve as a terminal 23 for heat radiation, and exposed to the outside at an engaging recess 21 which constitutes a socket 16 equipped with a heat radiating function formed in the case 12. A heat radiating member 41 is connected to the terminal 23 for heat radiation by connecting the connector 31 equipped with a heat radiating function to the socket 16 equipped with a heat radiating function. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：以低成本提供可回收性和浸泡/散热优良的小型轻质电连接盒，并且除了不受安装位置的限制。 电连接盒11由安装电气部件的电路板14和覆盖电路板14的上壳体12和下壳体13组成。金属芯板，其中板的表面 金属芯24被绝缘体25覆盖用作电路板14，并且金属芯24的一部分被弯曲以用作用于散热的端子23，并且在接合凹部21处暴露于外部 构成在壳体12上形成有散热功能的插座16.散热构件41通过将配备有散热功能的连接器31连接到配备有散热片的插座16而与端子23连接以进行散热 功能。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：EP2272103A1

公开(公告)日：2011-01-12

申请号：EP09734548.2

申请日：2009-04-14

Applicant: 3A Technology & Management AG

Inventor： BECHER, Christoph

IPC: H01L33/00 ,  H01L23/14

CPC classification number: H05K1/184 ,  F21K9/00 ,  F21V33/006 ,  F21W2111/00 ,  F21Y2115/10 ,  H05K2201/092 ,  H05K2201/10106

Abstract: The invention relates to a multilayer composite for power and/or signal supply comprising a multilayer board (21) and light-emitting diodes (30) that are arranged thereon and connected to a power conductor. Said multilayer board (21) comprises a plurality of layers (22) which are produced of metal, preferably aluminum or an aluminum alloy, and which are arranged at both sides of a plastic center layer (24) and that are covered by a cover layer (26) which is produced o corresponding material. The diodes (30) are arranged in respective recesses (28) of the board (21) are connected to the electroconductive metal layers (22) of the board via a plurality of metal layers (32) and plastic layers (36) that extend between them. The multilayer composite has at least three, preferably four, electroconductive layers (22, 32) that are insulated from each other by respective plastic layers (24, 36).

Abstract translation: 本发明涉及用于功率和/或信号源的多层复合材料，其包括布置在其上并连接到电力导体上的多层板（21）和发光二极管（30）。 所述多层板（21）包括多个层（22），其由金属制成，优选为铝或铝合金，并且布置在塑料中心层（24）的两侧并被覆盖层 （26），其产生相应的材料。 布置在板（21）的相应凹部（28）中的二极管（30）经由多个金属层（32）和塑料层（36）连接到板的导电金属层（22），塑料层（36） 他们。 多层复合材料具有至少三个，优选四个导电层（22,32），它们由相应的塑料层（24,36）彼此绝缘。

公开(公告)号：EP1639870A1

公开(公告)日：2006-03-29

申请号：EP04751551.5

申请日：2004-05-07

Applicant: Merix Corporation

Inventor： JOHNSON, Benny, H.

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/4046 ,  H05K3/4611 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10416

Abstract: This disclosure suggests microelectronic substrates with thermally conductive pathways. In one implementation, such a substrate includes a body and a thermally conductive member. The Body has a first surface that includes a microelectronic component mounting site, a second surface separated from the first surface by a thickness, and an opening extending through at least a portion of the thickness. The opening is outwardly open at one or both of the surfaces and has a first portion having a first transverse dimension and a second portion having a larger second transverse dimension. The thermally conductive member includes a first thickness, which is received in the first portion of the opening , and a second thickness , which is received in the second portion of the opening. A transverse dimension of the second thickness of the thermally conductive member is greater than the first transverse dimension of the opening.

公开(公告)号：EP1146780A3

公开(公告)日：2003-05-14

申请号：EP01302775.0

申请日：2001-03-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Muramatsu, Shigetsugu, Shinko Elec. Ind. Co., Ltd. ,  Imai, Kazunari, Shinko Elec. Ind. Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/3447 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/4602 ,  H05K2201/092 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/1394 ,  Y10T29/49139

Abstract: A substrate (1,2,3) for mounting an electronic component (6) or components thereon. The substrate comprises a core substrate (20) and at least one insulation layer (22,22') on at least one side of the core substrate, and a patterned wiring line layer (24,24') formed on at least one insulation layer. The core substrate (20) includes holes (26a) in each of which a lead pin (6a) of an electronic component (6) may be inserted, and is provided with lands (10) each of which surround the opening of a hole and to which the lead pin (6a) inserted in the hole is bonded. The insulation layer (22,22') or layers has bores (11), which expose the land at their bottom ends, and thereby communicate with the holes. A method of manufacturing such a substrate is also disclosed.

Abstract translation: 一种用于安装其上的电子部件的基板，其包括在所述芯基板的至少一侧上形成在所述绝缘层上的芯基板和至少一组绝缘层和图案化布线线层，所述芯 具有孔的基板，其中每个要安装的电子部件的引脚插入，并且设置有围绕孔的开口并且插入孔中的引线销要被接合的焊盘， 其中所述芯基板的至少一侧的所述绝缘层或多个孔具有孔，其在其底部暴露所述焊盘并与所述孔连通。 还公开了制造这种基板的方法。

公开(公告)号：EP0956747B1

公开(公告)日：2001-10-04

申请号：EP97916344.1

申请日：1997-03-12

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： BUSCH, Georg

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0224 ,  H05K1/0237 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0715 ,  H05K2201/092 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845 ,  H05K2203/1438

Abstract: The invention aims to raise the packing density of electronic circuits and printed conductor structures on circuit boards intended for electrical apparatus having HF components, notably mobile radiocommunications equipment. To this end, a 'micro via' layer (M2) is first applied to one or both sides of a circuit board substrate (LPT4). Thereafter, especially HF circuits and HF printed conductor structures (LBS3HF) are placed onto at least part of the 'micro via' layer (M2). The HF circuits and HF printed conductor structures (LBS3HF) are protected in relation to an HF mass layer of the circuit board substrate by blocking zones arranged in a substrate layer (LPL2) of the circuit board layer situated directly below the 'micro via' layer (M2) against interfering influences which affect the HF parameters to be adjusted of the HF circuits or HF printed conductor structures LBS3HF).

公开(公告)号：EP0956747A1

公开(公告)日：1999-11-17

申请号：EP97916344.0

申请日：1997-03-12

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： BUSCH, Georg

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/0224 ,  H05K1/0237 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0715 ,  H05K2201/092 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09845 ,  H05K2203/1438

Abstract: The invention aims to raise the packing density of electronic circuits and printed conductor structures on circuit boards intended for electrical apparatus having HF components, notably mobile radiocommunications equipment. To this end, a 'micro via' layer (M2) is first applied to one or both sides of a circuit board substrate (LPT4). Thereafter, especially HF circuits and HF printed conductor structures (LBS3HF) are placed onto at least part of the 'micro via' layer (M2). The HF circuits and HF printed conductor structures (LBS3HF) are protected in relation to an HF mass layer of the circuit board substrate by blocking zones arranged in a substrate layer (LPL2) of the circuit board layer situated directly below the 'micro via' layer (M2) against interfering influences which affect the HF parameters to be adjusted of the HF circuits or HF printed conductor structures LBS3HF).

公开(公告)号：EP0428870A2

公开(公告)日：1991-05-29

申请号：EP90119995.0

申请日：1990-10-18

Applicant: HITACHI, LTD.

Inventor： Imabayashi, Shinichiro ,  Oka, Hitoshi ,  Tanaka, Isamu ,  Kikuchi, Hiroshi ,  Watanabe, Makio

IPC: G03F7/038 ,  H05K3/46 ,  H05K3/18 ,  G03F7/004

CPC classification number: H05K3/185 ,  G03F7/004 ,  G03F7/028 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0145 ,  H05K2201/092 ,  H05K2201/09845

Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photo­polymerization initiator, a thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunc­tional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

Abstract translation: 用于形成导体图案，其包括光固化树脂，光聚合引发剂，热固性树脂，光敏半导体颗粒，以及如果需要，多官能不饱和化合物的树脂组合物是适合于在增层法形成非常精细的导体图案。

公开(公告)号：US08888504B2

公开(公告)日：2014-11-18

申请号：US13264892

申请日：2010-03-26

Applicant: Erich Pischler

Inventor： Erich Pischler

IPC: H01R12/00 ,  H01L23/00 ,  H05K1/18 ,  H01L23/498 ,  H05K1/02 ,  H01R24/40 ,  H01R103/00 ,  H01R24/38

CPC classification number: H01L24/10 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/6622 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/13 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/16106 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81898 ,  H01L2224/83136 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01R23/26 ,  H01R24/40 ,  H01R2103/00 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/184 ,  H05K2201/09036 ,  H05K2201/092 ,  H05K2201/09809 ,  H05K2201/09845 ,  Y10T29/49117 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A male connection component (120) for connection with a correspondingly configured female connection component (140) having a recess (144) extending into a main surface (170) of a female Substrate (142) of the female connection component (140), wherein the female connection component (140) comprises a plurality of electrically conductive female contacts (146) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (170) of the female Substrate (142), the male connection component (120) comprising a male Substrate (102), a Protrusion (104) protruding from a main surface (160) of the male Substrate (102) and comprising a plurality of electrically conductive male contacts (106) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (160) of the male Substrate (102), wherein the male connection component (120) is adapted for connection with the female connection component (140) so that upon connection, each of the plurality of electrically conductive male contacts (106) is brought in contact with one of the plurality of electrically conductive female contacts (146) for providing electric contactation at different height levels, wherein the male Substrate (102) forms at least part of one of a chip, a chip package and a circuit board.

Abstract translation: 用于与相应配置的阴连接部件（140）连接的阳连接部件（120），该阴连接部件具有延伸到阴连接部件（140）的阴基板（142）的主表面（170）的凹部（144），其中 阴连接部件（140）包括多个导电阴触头（146），它们彼此电分离并相对于阴基板（142）的主表面（170）布置在不同的高度水平处， 阳连接部件（120），包括阳基底（102），从阳基底（102）的主表面（160）突出的突起（104），并且包括多个导电的阳触头（106），电接头 并且相对于阳性基板（102）的主表面（160）布置在不同的高度水平处，其中阳连接部件（120）适于与阴连接 连接部件（140），使得在连接时，多个导电阳触头（106）中的每一个与多个导电阴触头（146）中的一个接触，用于在不同的高度级别提供电接触，​​其中 阳基板（102）形成芯片，芯片封装和电路板之一的至少一部分。

公开(公告)号：US08809689B2

公开(公告)日：2014-08-19

申请号：US13539677

申请日：2012-07-02

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。

公开(公告)号：US20120273260A1

公开(公告)日：2012-11-01

申请号：US13539677

申请日：2012-07-02

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。