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    Method of making adhesive electrical interconnecting means
    82.
    发明授权
    Method of making adhesive electrical interconnecting means 失效
    制造粘合电气互连装置的方法

    公开(公告)号：US4588456A

    公开(公告)日：1986-05-13

    申请号：US657717

    申请日：1984-10-04

    Applicant: Ronald A. Dery ,  Warren C. Jones

    Inventor： Ronald A. Dery ,  Warren C. Jones

    IPC: H01R4/04 ,  H01R11/01 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01B13/06

    CPC classification number: H05K3/323 ,  H01R4/04 ,  H01R23/66 ,  H05K1/181 ,  H05K2201/09945 ,  H05K2201/10727 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K3/305 ,  H05K3/361 ,  Y10T428/24909 ,  Y10T428/2973

    Abstract: An adhesive interconnecting means is comprised of one or more conductors on an insulating substrate, a first adhesive layer, said first layer being anisotropically conductive and disposed over said conductors and substrate and a second adhesive layer said second layer being a flowable adhesive that extends over the first substrate and anisotropically conductive layer. The anisotropically conductive adhesive is comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder; the conductive particles, of random size and shape, are dispersed randomly throughout the mixture in noncontiguous conductive units, each unit being comprised of one or more individual particles, the units being sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate. The flowable adhesive extends over the surface of the first substrate and conductive units to provide insulation whereby upon positioning the first substrate conductors in an overlapping conducting relationship to the second substrate conductors and applying pressure to the positioned areas, the adhesive flows from the positioned areas and exposes the conductive units thus bringing the exposed units into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

    Abstract translation: 粘合剂互连装置包括绝缘基底上的一个或多个导体，第一粘合剂层，所述第一层各向异性导电并设置在所述导体和基底上，第二粘合剂层，所述第二层是可流动的粘合剂， 第一衬底和各向异性导电层。 各向异性导电粘合剂由非导电粘合剂粘合剂中的导电颗粒的非均匀混合物组成; 随机尺寸和形状的导电颗粒随机地分散在不连续导电单元中的整个混合物中，每个单元由一个或多个单独的颗粒组成，这些单元被充分间隔开以排除相同基底上的相邻导电区域之间的导电性 。 可流动粘合剂在第一基板和导电单元的表面上延伸以提供绝缘，由此在将第一基板导体以与第二基板导体重叠的导电关系定位并向定位区施加压力时，粘合剂从定位的区域流出， 暴露导电单元，从而使暴露的单元与第二基板导体接触和电互连，伴随着剩余的第一基板表面与第二基板的表面的粘合。

    BOAT FOR BALL ATTACH MANUFACTURING PROCESS AND METHOD OF FABRICATING RELIABLE FLIP-CHIP ASSEMBLY
    87.
    发明申请
    BOAT FOR BALL ATTACH MANUFACTURING PROCESS AND METHOD OF FABRICATING RELIABLE FLIP-CHIP ASSEMBLY 审中-公开
    用于球连接制造工艺的船和制造可靠的片芯组件的方法

    公开(公告)号：WO03023820A8

    公开(公告)日：2004-05-27

    申请号：PCT/US0226451

    申请日：2002-08-19

    Applicant: ADVANCED MICRO DEVICES INC

    Inventor： MASTER RAJ N ,  ALCID EDWARD S ,  DING DIONG-HING ,  CHAN CHEON-SENG ,  ONG OOI-TONG

    IPC: H01L21/673 ,  H05K3/34 ,  H01L21/00

    CPC classification number: H05K3/3478 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082

    Abstract: A boat (10) onto which solder balls (16) or columns are loaded for an attach process can be used in a universal attach line has a number of attach stations (32-44) to accommodate different types of attach processes. Depending on the process and the desired configuration and form factor of the array of solder balls (16) or columns, a template (14a, 14b) is selected that covers some of the holes (12) in the universal boat (10), and exposes other holes (12). The holes (12) are configured and sized to hold solder balls (16) in the holes (12) such that the solder balls (16) protrude above the top surface of the boat (10) by a predetermined height. This prevents damage to the solder balls (16) while ensuring that the solder balls (16) protrude enough to accommodate imperfectly flat packages that are placed on the array of solder balls (16) held in the boat (10). Vacuum applied through the holes (12) help to securely hold the balls (16) in place, and a substrate (18) is placed onto the solder balls (16). Once loaded with balls (16) or columns, the boat (10) is transported to only the appropriate attach stations in the universal attach line, where the different attach operations for a given attach process, such as high temperature ball attach, eutectic ball attach, or column attach, are performed. Also provided is a method of fabricating laminate assemblies that determines the ideal weight (W) of underfill to be dispensed, based on the size of the semiconductor die (144) and the gap (142) between the die (144) and the laminate substrate. Underfill (150) is dispensed in a single step in an amount between 1.1W and 1.3W to form fillets (52, 54) that cover at least 15% of the height of the semiconductor die (144) on all four sides of the die. The amount of underfill (150) ensures that the fillet coverage imbalance is 30% or less for each of the pairs of opposing sides of the die (144), thereby improving solder joint reliability.

    Abstract translation: 可以在通用连接线中使用装载有焊球（16）或列的船（10），其具有多个附接站（32-44）以适应不同类型的附接过程。 根据工艺和焊球（16）或列阵列的期望配置和形状因素，选择覆盖通用船（10）中的一些孔（12）的模板（14a，14b），以及 露出其他孔（12）。 孔（12）的构造和尺寸被设计成将焊球（16）保持在孔（12）中，使得焊球（16）突出在船（10）的顶表面上预定高度。 这防止了焊球（16）的损坏，同时确保焊球（16）足够突出以容纳放置在保持在舟皿（10）中的焊球（16）阵列上的不完全平坦的封装。 通过孔（12）施加的真空有助于将球（16）牢固地保持就位，并且将衬底（18）放置在焊球（16）上。 一旦装载了球（16）或列，船只（10）只能被传送到通用连接线中的适当的附属站，在给定的附着过程中，例如高温球附着，共晶球附着 或列附加。 还提供了一种制造叠层组件的方法，其基于半导体管芯（144）的尺寸和模具（144）和层叠基板之间的间隙（142）确定待分配的底部填充物的理想重量（W） 。 底部填充物（150）以1.1W和1.3W之间的量分散在单个步骤中以形成在模具的所有四个侧面上覆盖半导体管芯（144）的至少15％的高度的圆角（52,54） 。 底部填充物（150）的量确保了模具（144）的每对相对侧中的每一对的圆角覆盖不平衡为30％以下，从而提高焊点可靠性。

    PROCESS FOR THE FORMATION OF COMPOSITE FILMS
    88.
    发明申请
    PROCESS FOR THE FORMATION OF COMPOSITE FILMS 审中-公开
    形成复合膜的方法

    公开(公告)号：WO99009795A1

    公开(公告)日：1999-02-25

    申请号：PCT/US1998/016614

    申请日：1998-08-10

    IPC: H01R43/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

    CPC classification number: H05K3/4069 ,  H01R43/007 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0126 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1572 ,  Y10T156/1057

    Abstract: A process for the preparation of an anisotropic conducting material, which process comprises the steps of: (i) providing a strip or sheet (10) of a non-conducting matrix and laminating to each side thereof at least one layer of a release material (11, 12) in order to form a composite matrix (13); (ii) forming an array of holes (14) in a predetermined pattern in the composite matrix (13) from step (i); (iii) passing the matrix (13) from step (ii) through a coating head (1) which simultaneously fills the holes (14) of the array in the composite matrix (13) from both sides of the said matrix (13) with a conducting material (15); (iv) curing or drying the composite filled matrix from step (iii); and (v) removing at least one layer of release material (11, 12) from each side of the matrix.

    Abstract translation: 一种用于制备各向异性导电材料的方法，该方法包括以下步骤：（i）提供非导电基体的条或片（10），并且将至少一层剥离材料 11），以形成复合矩阵（13）; （ii）从步骤（i）在所述复合矩阵（13）中以预定图案形成孔阵列（14）; （iii）将来自步骤（ii）的基质（13）通过涂覆头（1），涂覆头同时从所述基体（13）的两侧填充复合基体（13）中的阵列的孔（14） 导电材料（15）; （iv）固化或干燥步骤（iii）的复合填充基质; 和（v）从基质的每一侧去除至少一层释放材料（11,12）。

    ANISOTROPIC CONDUCTIVE FILM
    90.
    发明申请
    ANISOTROPIC CONDUCTIVE FILM 审中-公开
    各向异性导电膜

    公开(公告)号：WO1997045893A1

    公开(公告)日：1997-12-04

    申请号：PCT/US1997009422

    申请日：1997-05-29

    Applicant: THE WHITAKER CORPORATION ,  ISHIBASHI, Kazuo

    Inventor： THE WHITAKER CORPORATION

    IPC: H01R04/04

    CPC classification number: H05K3/323 ,  H01R4/04 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2203/0338 ,  H05K2203/0726

    Abstract: The anisotropic conductive film (ACF) (1) comprises a sheet-like insulating adhesive film (2) and plural rows of electrically conductive particles (3). Any one electrically conductive particle (3a) is disposed equidistant from 6 surrounding adjacent electrically conductive particles (3b-3g). This particular configuration provides high density of electrically conductive particles (3) and a large current carrying capacity. The direction of each row of the electrically conductive particles (3) is slanted at a predetermined angle with respect to the normal to one side of the ACF (1) or the sides of the electrodes to be interconnected. This minimizes the number of the electrically conductive particles (3) on the sides of the electrodes and thus maintains large current carrying capacity.

    Abstract translation: 各向异性导电膜（ACF）（1）包括片状绝缘粘合膜（2）和多排导电颗粒（3）。 任何一个导电颗粒（3a）与6个相邻的导电颗粒（3b-3g）等距设置。 这种特定的配置提供高密度的导电颗粒（3）和大的载流能力。 导电颗粒（3）的每一行的方向相对于ACF（1）的一侧的法线或要互连的电极的侧面以预定角度倾斜。 这使得电极侧面上的导电颗粒（3）的数量最小化，从而保持大的载流能力。

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