公开(公告)号：US06577503B2

公开(公告)日：2003-06-10

申请号：US10191701

申请日：2002-07-08

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片。

公开(公告)号：US06531764B2

公开(公告)日：2003-03-11

申请号：US09939849

申请日：2001-08-27

Applicant: Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H01L23495

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicular from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract translation: 一种可垂直安装的半导体器件，包括从其底部边缘垂直延伸的多个短截线触头。 互补对准装置包括用于接收垂直安装的半导体器件的插座。 对准装置可附接到载体基板。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，接触元件向垂直安装的半导体器件施加向下的力，以建立并保持可垂直安装的半导体器件与 载体衬底。

公开(公告)号：US06512290B2

公开(公告)日：2003-01-28

申请号：US09873869

申请日：2001-06-04

Applicant: Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H01L2348

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

公开(公告)号：US06418023B2

公开(公告)日：2002-07-09

申请号：US09944232

申请日：2001-08-30

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片。

公开(公告)号：US20020054484A1

公开(公告)日：2002-05-09

申请号：US09205796

申请日：1998-12-04

Inventor： SALMAN AKRAM ,  WARREN M. FARNWORTH ,  ALAN G. WOOD ,  J. MICHAEL BROOKS ,  EUGENE H. CLOUD

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10 ,  H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

Abstract translation: 一种装置，包括电路，具有连接到所述电路并具有第二端的第一端的引线和连接到所述引线的第二端的可变形结构。 本发明可以实现在电路板上，使得电路板包括基板和连接到所述基板的可变形结构。 还公开了一种包括具有有源侧和非有源侧的电路的装置，封装电路的有源侧的封装件，并且不包围电路的非有源侧的一部分，以及具有第一端 通过芯片上引线连接到电路的有源侧，并具有从封装延伸的第二端。 还公开了一种包括由柔性导体形成的电路和引线的器件，其中引线具有连接到电路的第一端。

公开(公告)号：US06268651B1

公开(公告)日：2001-07-31

申请号：US09442034

申请日：1999-11-17

Applicant: Eva Hellgren ,  Mats Eriksson

Inventor： Eva Hellgren ,  Mats Eriksson

IPC: H01L2348

CPC classification number: H05K3/366 ,  H05K3/303 ,  H05K13/046 ,  H05K2201/10386 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a “Single-In-Line” technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

Abstract translation: 电子行业倾向于可以表面安装在诸如电路板的载体上的部件。 通过使用“单列直插”技术在部件上使用表面可安装引线，可以将表面安装在电路板（7）上的部件（5），并将元件引线表面安装在电路板上。 引线（8）可以在它们的下端弯曲并且设置有用于与板有效接触的脚（10）。 引导和支撑销可用于在安装和连接部件时将部件保持在适当位置，并在安装在电路板上时将部件上的导线支撑。

公开(公告)号：US06265773B1

公开(公告)日：2001-07-24

申请号：US09416357

申请日：1999-10-12

Applicant: Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H01L21302

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

公开(公告)号：US6075288A

公开(公告)日：2000-06-13

申请号：US93295

申请日：1998-06-08

Applicant: Salman Akram

Inventor： Salman Akram

IPC: H01L23/433 ,  H01L23/495 ,  H05K1/18 ,  H01L23/02 ,  H01L23/28 ,  H01L23/34 ,  H05K7/02 ,  H05K7/20

CPC classification number: H01L24/73 ,  H01L23/4334 ,  H01L23/4951 ,  H01L24/29 ,  H01L24/33 ,  H05K1/18 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83805 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15763 ,  H01L2924/181 ,  H05K2201/10151 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10696

Abstract: A semiconductor package includes a semiconductor die, a lead frame wire bonded to the die, and a plastic body encapsulating the die. The package also includes a first heat sink attached to a face of the die, and a second heat sink attached to a back side of the die. Thermally conductive adhesive layers attach the heat sinks to the die, and provide a thermal path therebetween. In addition, the heat sinks project from the plastic body, and have end portions that are sized and shaped to interlock with heat sinks on an adjacent package to form an electronic assembly. In the electronic assembly, the interlocking heat sinks maintain contact surfaces on the heat sinks in physical contact and improve heat dissipation from the packages. An alternate embodiment package includes a thermally conductive encapsulant which attaches a pair of heat sinks, and encapsulates the die.

Abstract translation: 半导体封装包括半导体管芯，结合到管芯的引线框架引线和封装管芯的塑料体。 该包装还包括附接到模具的表面的第一散热器和附接到模具的背面的第二散热器。 导热粘合剂层将散热器附接到模具，并且在它们之间提供热路径。 此外，散热器从塑料体突出，并且具有尺寸和形状的端部，以与相邻封装上的散热器互锁以形成电子组件。 在电子组件中，互锁散热器保持物理接触的散热器上的接触表面并改善封装的散热。 替代实施例包装包括附接一对散热器并封装管芯的导热密封剂。

公开(公告)号：US6010920A

公开(公告)日：2000-01-04

申请号：US977235

申请日：1997-11-24

Applicant: Eva Hellgren ,  Mats Eriksson

Inventor： Eva Hellgren ,  Mats Eriksson

IPC: H05K3/30 ,  H05K3/36 ,  H05K13/04 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/366 ,  H05K13/046 ,  H05K3/303 ,  H05K2201/10386 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

Abstract translation: 电子行业倾向于可以表面安装在诸如电路板的载体上的部件。 通过使用“单列直插”技术在部件上使用表面可安装引线，可以将表面安装在电路板（7）上的部件（5），并将元件引线表面安装在电路板上。 引线（8）可以在它们的下端弯曲并且设置有用于与板有效接触的脚（10）。 引导和支撑销可用于在安装和连接部件时将部件保持在适当位置，并在安装在电路板上时将部件上的导线支撑。

公开(公告)号：US5619067A

公开(公告)日：1997-04-08

申请号：US236768

申请日：1994-05-02

Applicant: Goh J. Sua ,  Chan M. Yu

Inventor： Goh J. Sua ,  Chan M. Yu

IPC: H01L25/10 ,  H05K3/30 ,  H05K3/32 ,  H01L23/04 ,  H01L23/32

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10537 ,  H05K2201/10696 ,  H05K3/325 ,  Y02P70/613 ,  Y10T29/4913

Abstract: The invention is to an array of stacked devices utilizing vertical surface mounted semiconductor devices stacked side by side and inserting the stack of devices into a casing. The packaged stack of devices creates a cube package which is capable of replacing SIMM boards, and saves considerable space. The casing dissipates heat generated in the devices, and may be of metal or thermally conductive plastic.

Abstract translation: 本发明涉及利用垂直平面安装的半导体器件并排堆叠并将器件堆叠插入到壳体中的堆叠器件的阵列。 封装的设备堆叠创建了一个立方体包，可以替代SIMM板，并节省了相当多的空间。 套管消散器件中产生的热量，并且可以是金属或导热塑料。