公开(公告)号：US07554795B2

公开(公告)日：2009-06-30

申请号：US11597880

申请日：2005-06-03

Applicant: Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

Inventor： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC: H01G9/15

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: An electronic component has an element, a pair of terminal portions which are disposed on the element, and an external covering material which covers a part of the terminal portions and the element. The electronic component is configured such that inclined portions are disposed on corner portions of a bottom surface and side surfaces of the external covering material, and the terminal portions are protruded from corner portions where the inclined portions and the bottom surface of the external covering material intersect.

Abstract translation: 电子部件具有元件，设置在元件上的一对端子部分和覆盖端子部分和元件的一部分的外部覆盖材料。 电子部件被构造成使得倾斜部分设置在外包覆材料的底表面和侧表面的角部上，并且端子部分从外部覆盖材料的倾斜部分和底表面相交的角部突出 。

公开(公告)号：US20080024960A1

公开(公告)日：2008-01-31

申请号：US11597880

申请日：2005-06-03

Applicant: Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

Inventor： Akio Hidaka ,  Shouichi Ikebe ,  Yuuichi Murano ,  Hirozumi Kazitani ,  Mika Ikeda ,  Yoshitaka Mizoguchi

IPC: B29C45/14 ,  H05K7/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

Abstract translation: 本发明的目的是提供一种以低成本制造工艺制造的电子部件，同时实现耐冲击性，耐久性，抗弯曲性，安装可靠性等的改善，而不需要微调等。本发明是 具有元件2的电子部件1，设置在元件2上的一对端子部4和覆盖端子部4的一部分和元件2的外部覆盖材料5， 倾斜部分10设置在底面9的角部和外部覆盖材料5的侧面的方式，端子部4从外部覆盖材料的倾斜部10和底面9的角部突出 相交。

公开(公告)号：US07279784B2

公开(公告)日：2007-10-09

申请号：US11049863

申请日：2005-02-04

Applicant: Sheng Tsung Liu

Inventor： Sheng Tsung Liu

IPC: H01L23/02

CPC classification number: H05K3/3426 ,  H01L23/3107 ,  H01L23/49555 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead portion exposed out of the lower surface of the semiconductor package and an outer lead portion formed substantially parallel to and adjacent to one of the side surfaces of the semiconductor package. The semiconductor chip has a plurality of bonding pads electrically coupled to the inner lead portions of the L-shaped leads. The semiconductor package is provided with a package body formed over the semiconductor chip and the inner lead portions of the L-shaped leads.

Abstract translation: 半导体封装主要包括半导体芯片和布置在半导体芯片周边的多个L形引线。 每个L形引线具有暴露在半导体封装的下表面之外的内引线部分和形成为基本上平行于并邻近半导体封装的一个侧表面的外引线部分。 半导体芯片具有电连接到L形引线的内引线部分的多个接合焊盘。 半导体封装设置有形成在半导体芯片上的封装体和L形引线的内引线部分。

公开(公告)号：US20060216970A1

公开(公告)日：2006-09-28

申请号：US10907297

申请日：2005-03-28

Applicant: Slobadan Pavlovic

Inventor： Slobadan Pavlovic

IPC: H05K1/00

CPC classification number: H01R43/0256 ,  H01R4/023 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A blade terminal for a surface mount electrical connector is provided. A first elongate member of a terminal body cooperates with a housing of the electrical connector to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having a hole therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.

Abstract translation: 提供了一种用于表面安装电连接器的刀片端子。 终端主体的第一细长构件与电连接器的壳体协作以将终端主体固定到连接器壳体。 终端主体的第二细长构件包括具有穿过其中的孔的弯曲部分。 弯曲部分包括有助于自动组装操作的凸面，并且该孔有助于克服液体焊料中的表面张力，由此促进安全的电连接。

公开(公告)号：US20050221636A1

公开(公告)日：2005-10-06

申请号：US11006067

申请日：2004-12-07

Applicant: Kai-Hung Huang ,  Chin-Chi Kuo ,  Tscn-En Li

Inventor： Kai-Hung Huang ,  Chin-Chi Kuo ,  Tscn-En Li

IPC: H01R4/02 ,  H01R12/00 ,  H01R12/55 ,  H01R12/57 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A circuit board assembly includes a first circuit board, at least one surface mount connector, and a second circuit board. The first circuit board has at least a first contact. The surface mount connector is substantially a solid rod and includes a first conducting part coupled to the contact of the first circuit board and a second conducting part having a curvy raised portion at the top surface thereof. The second circuit board has at least a second contact coupled to the second conducting part of the surface mount connector.

Abstract translation: 电路板组件包括第一电路板，至少一个表面安装连接器和第二电路板。 第一电路板至少具有第一接触。 表面安装连接器基本上是实心杆，并且包括耦合到第一电路板的触点的第一导电部分和在其顶表面处具有弯曲的凸起部分的第二导电部分。 第二电路板具有耦合到表面安装连接器的第二导电部分的至少第二触点。

公开(公告)号：US20050127494A1

公开(公告)日：2005-06-16

申请号：US11049863

申请日：2005-02-04

Applicant: Sheng Liu

Inventor： Sheng Liu

IPC: H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H05K3/34 ,  H01L21/44 ,  H01L23/48

CPC classification number: H05K3/3426 ,  H01L23/3107 ,  H01L23/49555 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead portion exposed out of the lower surface of the semiconductor package and an outer lead portion formed substantially parallel to and adjacent to one of the side surfaces of the semiconductor package. The semiconductor chip has a plurality of bonding pads electrically coupled to the inner lead portions of the L-shaped leads. The semiconductor package is provided with a package body formed over the semiconductor chip and the inner lead portions of the L-shaped leads.

Abstract translation: 半导体封装主要包括半导体芯片和布置在半导体芯片周围的多个L形引线。 每个L形引线具有暴露在半导体封装的下表面之外的内引线部分和形成为基本上平行于并邻近半导体封装的一个侧表面的外引线部分。 半导体芯片具有电连接到L形引线的内引线部分的多个接合焊盘。 半导体封装设置有形成在半导体芯片上的封装体和L形引线的内引线部分。

公开(公告)号：US06380513B1

公开(公告)日：2002-04-30

申请号：US09554685

申请日：2000-10-13

Applicant: Christian Remy De Graffenried

Inventor： Christian Remy De Graffenried

IPC: B23K2620

CPC classification number: B23K1/0056 ,  B23K2101/40 ,  G02B6/4238 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0373 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/101 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A process for fastening a miniaturized component (2), in particular assembled in a modular manner, on a baseplate (1) by a solder joint is described. A side (4) of the component (2) is coated with a layer (5) of solder material, and the baseplate (1) is at least partly coated with a layer of metal (6, 6′, 6″). The component (2) is arranged above the baseplate (1), the metal layer and the layer (5) of solder material being a vertical distance apart and not in contact with one another. Heat energy is then supplied from the side of the baseplate (1) for melting solder material of the layer (5) of solder material on the side (4) of the component (2) until a drop forms, with the result that the drop (5′) of solder material fills the space between the component (2) and the baseplate (1) for mutual fastening.

Abstract translation: 描述了通过焊接接头将小型化部件（2）紧固在基板（1）上的模块化方式的方法。 组件（2）的一侧（4）涂覆有焊料材料层（5），底板（1）至少部分地涂有一层金属（6,6'，6“）。 组件（2）布置在基板（1）的上方，金属层和焊料层的层（5）彼此垂直距离并且不彼此接触。 然后从基板（1）的侧面提供热能，以熔化组件（2）侧面（4）上的焊料材料层（5）的焊料材料，直到形成液滴，结果是下降 （5'）填充组件（2）和基板（1）之间的空间，用于相互紧固。

公开(公告)号：US5917245A

公开(公告)日：1999-06-29

申请号：US777944

申请日：1996-12-23

Applicant: Hisao Tomizawa

Inventor： Hisao Tomizawa

IPC: H01L23/367 ,  H01L29/06 ,  H05K1/02 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/31 ,  H01L23/367 ,  H05K3/341 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/48 ,  H01L29/0657 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/10158 ,  H05K1/0203 ,  H05K2201/0373 ,  H05K2201/066 ,  H05K2201/10568 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/613

Abstract: A mount 2 is secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.

Abstract translation: 安装件2固定在电路板1上以在其上支撑二极管芯片3。 形成在安装件2上的多个支脚7,12与电路板1上的电极4接触以形成至少凹陷14.支架2还具有形成在周边的与电极4相对的倾斜表面8 焊料9填充在支腿7,12之间的凹陷14和电路板1与安装件2的倾斜表面8之间的扩口区域13中，以防止支架从电极4剥离或脱离。

公开(公告)号：US5421081A

公开(公告)日：1995-06-06

申请号：US59967

申请日：1993-05-13

Applicant: Suguru Sakaguchi ,  Toshiharu Ishida ,  Kooji Serizawa ,  Hiroyuki Tanaka ,  Ichiro Miyano ,  Hiroshi Nakamura

Inventor： Suguru Sakaguchi ,  Toshiharu Ishida ,  Kooji Serizawa ,  Hiroyuki Tanaka ,  Ichiro Miyano ,  Hiroshi Nakamura

IPC: H05K3/34 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/144 ,  H05K1/113 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/0215 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10515 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0455 ,  H05K3/0094 ,  H05K3/4069 ,  Y02P70/613 ,  Y10T156/1062 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method for producing an electronic part mounting structure in which electronic parts such as IC packages are electrically connected to the surface of a printed circuit board utilizes a low-melting point metal. More particularly, the method provides an electronic part mounting structure capable of sufficiently and assuredly supplying solder to a portion between the terminal of a printed circuit board and the leads of an electric part while maintaining a predetermined thickness required to connect the printed circuit board and the electronic part to each other. By arranging the structure such that a gap, in which a solder layer having a predetermined thickness can be formed between the terminal of the printed circuit board and the lead of the electronic part to be connected to the terminal, is formed, the solder required to solder-connect the two elements can be sufficiently and assuredly supplied to the gap. Therefore, a reliable solder connection can be established.

Abstract translation: 一种电子部件安装结构的制造方法，其中诸如IC封装的电子部件电连接到印刷电路板的表面上使用低熔点金属。 更具体地，该方法提供一种电子部件安装结构，其能够充分且可靠地将焊料供应到印刷电路板的端子与电气部件的引线之间的部分，同时保持连接印刷电路板所需的预定厚度和 电子部件相互对应。 通过这样构造，可以形成在印刷电路板的端子与要连接到端子的电子部件的引线之间形成具有预定厚度的焊料层的间隙， 可以充分且可靠地将两个元件焊接在间隙上。 因此，可以建立可靠的焊接连接。

公开(公告)号：US4626478A

公开(公告)日：1986-12-02

申请号：US592220

申请日：1984-03-22

Applicant: Herman F. van Dyk Soerewyn

Inventor： Herman F. van Dyk Soerewyn

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/495 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/80 ,  H01L21/4853 ,  H01L21/4878 ,  H01L23/49548 ,  H05K3/3405 ,  H05K3/3426 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/1034 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K3/3421 ,  Y02P70/613 ,  Y10S428/929 ,  Y10T428/12361 ,  Y10T428/1241 ,  Y10T428/12493

Abstract: Spacing elements are integrally formed on the constituent surfaces of conductive interfaces of electronic circuit device components for providing uniform thickness solder or other bonding film between the surfaces. The interfaces may be electrically conductive interfaces such as those defined between leads and substrate contact pads as well as thermally conductive interfaces such as those defined between heat sinks and substrates. Any suitable spacers which maintain the constitutent surfaces a selected distance apart when the components are pressed together may be employed such as edge and corner flanges, convex dimples, annular protrusions, tangs, among others. A tool is disclosed for forming the annular protrusions that is advantageously employed with comparatively thick electronic circuit device components and with laminated electronic circuit device components having a comparatively hard layer.

Abstract translation: 间隔元件整体形成在电子电路器件部件的导电界面的组成表面上，用于在表面之间提供均匀的厚度的焊料或其它接合膜。 界面可以是诸如在引线和衬底接触焊盘之间限定的那些的导电接口，以及诸如在散热器和衬底之间限定的那些导热接口。 当组件被压在一起时，任何合适的间隔件可以使组件表面保持选定的距离，例如边缘和角部凸缘，凸起凹坑，环形突起，柄脚等等。 公开了一种用于形成环形突起的工具，其有利地用于比较厚的电子电路器件部件和具有相对较硬层的层压电子电路器件部件。