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公开(公告)号:KR101835904B1
公开(公告)日:2018-03-07
申请号:KR1020130109787
申请日:2013-09-12
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: G03F7/16 , G03F7/3021 , G03F7/3092 , H01L21/67017
Abstract: 본발명의과제는포지티브형현상액에의한현상처리와네거티브형현상액에의한현상처리의양쪽을행할수 있는현상처리장치에있어서, 탑재하는모듈수를감소시킴으로써, 장치의소형화를가능하게하는것이다. 스핀척(40)과, 웨이퍼(W)에대해포지티브형레지스트용현상액을공급하는포지티브형현상액공급노즐과, 웨이퍼(W)에대해네거티브형레지스트용현상액을공급하는네거티브형현상액공급노즐과, 가동컵(45)을갖고, 가동컵을상승시킴으로써내주유로(48b)에포지티브형또는네거티브형레지스트용의한쪽의비산된현상액을도입시키고, 가동컵을하강시킴으로써외주유로(48a)에포지티브형또는네거티브형레지스트용의다른쪽의비산된현상액을도입시킨다. 내주유로에도입된현상액은한쪽의드레인배출구(49b)로부터배출되고, 외주유로에도입된현상액은다른쪽의드레인배출구(49a)로부터배출된다.
Abstract translation: 由本发明的显影过程和显影剂的目的,显影装置,可以同时执行与由负显影溶液的处理的正型显影液,减少模块的数量将被安装,以使装置的小型化。 用于将抗蚀剂的正显影剂供应到晶片W的正显影剂供应喷嘴;用于将晶片W的负显影剂供应到晶片W的负显影剂供应喷嘴; 具有杯(45),通过提高可动杯内,并引入侧向散射开发用于在流路中的正或负性抗蚀剂溶液(48B),通过降低可动杯正或负的外周流路(48A) 介绍了另一种用于抗蚀剂的散射显影剂。 被引入到内圆周流动路径中的显影剂从排出口49b中的一个排出,并且引入到外圆周流动路径中的显影剂从另一排出口49a排出。
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公开(公告)号:KR1020140035281A
公开(公告)日:2014-03-21
申请号:KR1020130109787
申请日:2013-09-12
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: G03F7/16 , G03F7/3021 , G03F7/3092 , H01L21/67017 , H01L21/0274
Abstract: The project of the present invention is to reduce the number of modules by miniaturizing a development processing device capable of performing development processing by both positive and negative developers. The device includes a spin chuck (40), a positive developer supply nozzle supplying a developer for a positive resist for a wafer (W), a negative developer supply nozzle supplying a developer for a negative resist for the wafer (W), and an operating cup (45). One of the developers for the positive or negative resist is inserted into an inner path (48b) by raising the operating cup up and one of the developers for the positive or negative resist is inserted into an outer path (48a) by taking the operating cup down. The developer inserted into the inner path is discharged from a drain outlet (49b) and the developer inserted into the outer path is discharged from the other drain outlet (49a).
Abstract translation: 本发明的项目是通过正面和负面的开发者能够进行开发处理的开发处理装置的小型化来减少模块的数量。 该装置包括旋转卡盘(40),向晶片(W)提供正性抗蚀剂的显影剂的正显影剂供应喷嘴,为晶片(W)供给负性抗蚀剂的显影剂的负极显影剂供应喷嘴,以及 操作杯(45)。 将正或负抗蚀剂的显影剂中的一个通过将操作杯向上升起而插入到内部路径(48b)中,并且通过将操作杯(48a)插入到正面或负面抗蚀剂中的一个显影剂被插入外部路径(48a) 下。 插入到内部路径中的显影剂从排出口49b排出,并且插入到外部路径中的显影剂从另一个排出口49a排出。
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公开(公告)号:KR101633066B1
公开(公告)日:2016-06-23
申请号:KR1020110000820
申请日:2011-01-05
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302 , H01L21/027
Abstract: 저온의처리액을이용한처리에서처리액노즐의결로의발생을방지하여, 처리를기판면내에서균일하게행한다. 현상처리장치(1)는기판을보지하는보지부재와, 기판상으로현상액, 린스액, 처리액을공급하는복합노즐체(42)와, 보지부재상에서퇴피한복합노즐체(42)를대기시키는노즐배스(44)를가지고있다. 노즐배스(44) 내에는복합노즐체(42)의선단부가수용된다. 노즐배스(44)는대기중인복합노즐체(42)를사이에두고설치되며, 당해복합노즐체(42)에서노즐배스(44)로부터노출된노출부를둘러싸도록수평방향으로연장되는한 쌍의퍼지가스노즐(93, 93)을가지고있다. 한쌍의퍼지가스노즐(93, 93)은복합노즐체(42)의노출부에대하여수분을포함하지않는퍼지가스를공급한다.
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公开(公告)号:KR1020110087212A
公开(公告)日:2011-08-02
申请号:KR1020110000820
申请日:2011-01-05
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302 , H01L21/027
CPC classification number: H01L21/302 , G03F1/60 , G03F7/2041 , G03F7/70341 , G03F7/70583 , G03F7/70691 , H01L21/0274
Abstract: PURPOSE: A processing apparatus for processing a substrate, a processing method thereof, a program, and a computer storage device are provided to prevent a processing liquid nozzle from dew condensation using processing liquid with low temperature and uniformly process the inner side of a substrate. CONSTITUTION: A retention member is a processing unit which processes a substrate(G) using processing liquid with lower preset temperature than room temperature and holds the substrate. A processing liquid nozzle supplies processing liquid on a substrate. A nozzle bath(44) accepts the tip end part of the processing liquid nozzle, which is retreated in the upper part of the retention member, and makes the processing liquid nozzle wait. A pair of purge gas nozzles is arranged between the processing liquid nozzle, which waits in the nozzle bath, and is extended longer than the length of a horizontal direction in an exposed part which is exposed from the nozzle bath of the processing liquid nozzle. Purge gas which does not contain moisture is supplied to the exposed part.
Abstract translation: 目的:提供一种用于处理基板的处理装置,其处理方法,程序和计算机存储装置,以防止处理液喷嘴使用低温处理液进行结露,并均匀地处理基板的内侧。 构成:保持构件是使用具有比室温低的预设温度的处理液处理基板(G)并保持基板的处理单元。 处理液喷嘴在基板上提供处理液。 喷嘴槽(44)接受在保持构件的上部退避的处理液喷嘴的前端部,使处理液喷嘴等待。 一对吹扫气体喷嘴布置在处理液喷嘴之间,该喷嘴在喷嘴槽中等待,并且在从处理液喷嘴的喷嘴槽露出的暴露部分中延伸长于水平方向的长度。 将不含有水分的吹扫气体供给到暴露部分。
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