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公开(公告)号：KR101255892B1
公开(公告)日：2013-04-17
申请号：KR1020100103392
申请日：2010-10-22
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4647 , H05K1/0366 , H05K2201/0195 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/51
Abstract: 본 발명은 인쇄회로기판의 제조방법에 관련되며, 포스트 비아가 형성된 제1 절연층의 외면에 보강기재가 포함된 제2 절연층을 적층하는 단계, 상기 포스트 비아의 상측이 노출되도록 상기 제2 절연층의 상면을 연마하는 단계, 상기 포스트 비아를 커버하며 상기 제2 절연층이 압착되도록 상기 제2 절연층 상에 필름부재를 적층하는 단계, 상기 포스트 비아의 상측이 노출되도록 상기 필름부재의 상면을 연마하는 단계, 및 상기 필름부재의 상면에 상기 포스트 비아와 연결된 회로층을 형성하는 단계를 포함한다.
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公开(公告)号：KR1020120117456A
公开(公告)日：2012-10-24
申请号：KR1020110035218
申请日：2011-04-15
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0206 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K3/0094 , H05K3/181 , H05K3/205 , H05K3/4608 , H05K3/4644 , H05K2201/09563 , H05K2201/096 , H05K2201/09727 , H05K2201/10674 , H05K2203/1476 , Y10T29/49156 , H01L2924/00014
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a thermal via which is bigger than a signal via in a region which radiating is required, thereby increasing thermal effect. CONSTITUTION: A base substrate(100) includes a first via hole and a second via hole. Circuit layers(107,113) including connection pads(107a,107b,107c,107d) are formed in both sides of the base substrate. A first via(105) is composed of a conductive metal which is formed in an inside of the first via hole. A second via(103) is composed of the conductive metal which is formed in the inside of the second via hole. A diameter of the second via is bigger than the diameter of the first via.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以在需要辐射的区域中形成大于信号通道的热通孔，从而增加热效应。 构成：基底（100）包括第一通孔和第二通孔。 包括连接焊盘（107a，107b，107c，107d）的电路层（107,113）形成在基底基板的两侧。 第一通孔（105）由形成在第一通孔内部的导电金属构成。 第二通孔（103）由形成在第二通孔内部的导电金属构成。 第二通孔的直径大于第一通孔的直径。
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公开(公告)号：KR101038241B1
公开(公告)日：2011-06-01
申请号：KR1020080119779
申请日：2008-11-28
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: 인쇄회로기판 및 그의 제조방법이 개시된다. 완성품에서 제거되는 더미영역과 회로배선이 형성될 유닛의 경계를 따라 선택적으로 형성된 개구부를 포함하는 메탈층을 제공하는 단계; 메탈층의 양면에 절연재를 적층하여 메탈코어를 형성하는 단계; 메탈코어에 빌드업층을 형성하는 단계; 및 더미영역과 유닛의 경계를 따라 빌드업층과 메탈코어를 라우팅하여 더미영역을 제거하는 단계를 포함하는 인쇄회로기판 제조방법은 공정 중에 유닛이 더미영역으로부터 분리되는 것을 방지할 수 있고, 완성된 인쇄회로기판에서 측면으로 노출되는 메탈코어의 메탈층을 절연물질로 커버하여 쇼트 등의 전기적인 문제를 해결함과 동시에, 필요에 따라 부분적으로 측면에 메탈층을 노출시켜 방열효과를 높일 수 있다.
메탈코어, 라우팅, 외형가공선-
公开(公告)号：KR1020110029467A
公开(公告)日：2011-03-23
申请号：KR1020090087150
申请日：2009-09-15
Applicant: 삼성전기주식회사
IPC: H01L21/60
CPC classification number: H01L2224/11 , H01L2924/00012
Abstract: PURPOSE: A solder bump forming method is provided to expose and develop a solder resist layer and a dry film at once to form an opening by one process, thereby reducing costs and time for forming an opening on each layer. CONSTITUTION: At least one conductive pad(20) is placed on a substrate(10). A solder resist layer and a dry film are successively formed on the substrate. The formed solder resist layer and dry film are exposed and developed at once to form an opening which exposes a conductive pad. The opening is filled with a conductive paste. A solder bump of a desired shape is formed by reflowing the conductive paste.
Abstract translation: 目的：提供一种焊料凸块形成方法，以一次曝光和显影阻焊层和干膜以形成开口，从而降低在每层上形成开口的成本和时间。 构成：至少一个导电焊盘（20）被放置在衬底（10）上。 在基板上依次形成阻焊层和干膜。 形成的阻焊层和干膜一次曝光和显影以形成暴露导电焊盘的开口。 开口填充有导电膏。 通过回流导电浆料形成所需形状的焊料凸块。
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公开(公告)号：KR1020100138209A
公开(公告)日：2010-12-31
申请号：KR1020090056633
申请日：2009-06-24
Applicant: 삼성전기주식회사
Inventor： 박호식
Abstract: PURPOSE: A metal core substrate, a multilayer PCB thereof, and a manufacturing method thereof are provided to reduce lead time and to reduce costs by removing an additional process in order to form a via hole on an insulation layer. CONSTITUTION: An IVH(Interstitial Via Hole)(20) is formed in a metal core layer(10). A first insulating resin layer(30) is formed in both sides of the metal core layer and the IVH. A circuit pattern(41) is formed on the first insulating resin layer. A second insulating resin layer is formed in both sides of the metal core substrate. An outer layer circuit pattern is formed on the second insulating resin layer.
Abstract translation: 目的：提供金属芯基板，其多层PCB及其制造方法，以通过去除附加工艺以在绝缘层上形成通孔来减少交货时间并降低成本。 构成：在金属芯层（10）中形成IVH（间隙通孔）（20）。 在金属芯层和IVH的两侧形成第一绝缘树脂层（30）。 电路图案（41）形成在第一绝缘树脂层上。 第二绝缘树脂层形成在金属芯基板的两侧。 外层电路图案形成在第二绝缘树脂层上。
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Patent Agency Ranking
公开(公告)号：KR1020090103542A
公开(公告)日：2009-10-01
申请号：KR1020080029210
申请日：2008-03-28
Applicant: 삼성전기주식회사
CPC classification number: B32B37/185 , B29C65/02 , B29C66/001 , B29C66/1122 , B29C66/342 , B29C66/45 , B29C66/472 , B29C66/71 , B29C66/7212 , B29C66/723 , B29C66/72321 , B29C66/73111 , B29C66/73115 , B29C66/73116 , B29C66/73161 , B29C66/7392 , B29C66/742 , B29C66/82661 , B29C66/9141 , B29C66/91933 , B29C66/929 , B29K2067/00 , B29K2101/12 , B29K2105/0079 , B29K2105/06 , B29K2267/00 , B29K2277/00 , B29K2305/00 , B29K2305/02 , B29K2305/10 , B29K2305/12 , B29L2009/00 , B29L2009/003 , B29L2031/3425 , B32B3/266 , B32B5/022 , B32B5/024 , B32B5/147 , B32B5/26 , B32B7/02 , B32B15/08 , B32B15/14 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/12 , B32B27/18 , B32B27/20 , B32B27/28 , B32B27/36 , B32B27/40 , B32B38/0008 , B32B2255/02 , B32B2255/10 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/0269 , B32B2262/0276 , B32B2262/10 , B32B2262/101 , B32B2305/08 , B32B2307/30 , B32B2307/538 , B32B2307/734 , B32B2310/14 , B32B2367/00 , B32B2457/08 , H05K1/0366 , H05K1/056 , H05K3/445 , H05K3/4608 , H05K2201/0129 , H05K2201/0141 , H05K2201/068 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T156/10 , Y10T156/1056 , Y10T428/24331 , Y10T428/31504 , Y10T428/31786 , B29K2309/08
Abstract: PURPOSE: An insulation sheet, a manufacturing method thereof, a printed circuit board using the same, and a method for manufacturing the printed circuit board are provided to prevent the warpage or twist of the printed circuit board by making an insulation substrate similar to the thermal expansion coefficient of a semiconductor chip. CONSTITUTION: A reinforcing substrate(10) stacking a thermoplastic resin layer is provided. A thermoplastic resin layer(20) stacked on the reinforcing substrate is stacked on a core substrate(32). The reinforcing substrate and the thermoplastic resin layer are thermally pressed on the core substrate. The thermal expansion coefficient of the transverse direction of the core substrate is between -20 and 9 ppm/°C.
Abstract translation: 目的：提供一种绝缘片，其制造方法，使用该印刷电路板的印刷电路板以及印刷电路板的制造方法，以通过使与印刷电路板类似的绝缘基板来防止印刷电路板的翘曲或扭曲 半导体芯片的膨胀系数。 构成：提供堆叠热塑性树脂层的增强基板（10）。 层叠在增强基板上的热塑性树脂层（20）堆叠在芯基板（32）上。 将增强基板和热塑性树脂层热压在芯基板上。 核心基板的横向的热膨胀系数为-20〜9ppm /℃。
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公开(公告)号：KR100867148B1
公开(公告)日：2008-11-06
申请号：KR1020070098383
申请日：2007-09-28
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4614 , H05K1/113 , H05K3/108 , H05K3/205 , H05K3/243 , H05K3/281 , H05K3/4647 , H05K3/4658 , H05K2203/0152 , H05K2203/066 , H05K2203/0733 , H05K2203/1189 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
Abstract: A printed circuit board and a manufacturing method thereof are provided to remove a drilling process for punching a via hole and increase degree of freedom in designing the circuit by implementing connection between layers through a conductive post. A solder resist layer is laminated on one side of a carrier(S100). A first circuit pattern including a first electrode pad is formed in the solder resist layer(S200). A conductive post is formed in the first electrode pad(S300). The carrier is laminated and pressurized in the insulating layer of the inner layer so that the conductive post faces the insulating layer(S400). The carrier is removed(S500).
Abstract translation: 提供一种印刷电路板及其制造方法，以通过通过导电柱实现层之间的连接来去除用于冲压通孔的钻孔工艺并提高设计电路的自由度。 在载体的一侧层叠阻焊层（S100）。 在阻焊层中形成包括第一电极焊盘的第一电路图案（S200）。 在第一电极焊盘中形成导电柱（S300）。 载体在内层的绝缘层中层叠并加压，使得导电柱面对绝缘层（S400）。 搬运车（S500）。
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公开(公告)号：KR100796979B1
公开(公告)日：2008-01-22
申请号：KR1020070010054
申请日：2007-01-31
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0353 , H05K3/28 , H05K3/4691
Abstract: A rigid-flexible printed circuit board and a method for manufacturing the same are provided to improve a flexibility remarkably without using a thermosetting adhesive of a cover lay. A rigid-flexible printed circuit board includes a flexible insulation layer(104), a circuit pattern(102), and a rigid insulation layer(105). The circuit pattern is laid inside the flexible insulation layer. The rigid insulation layer covers a part of the flexible insulation layer. The flexible insulation layer and the rigid insulation layer are stacked sequentially. The rigid-flexible printed circuit board further includes a protection insulation material for covering the circuit pattern. The circuit pattern is formed by an additive method and transferred to the flexible insulation layer by a roll-to-roll method.
Abstract translation: 提供了一种刚性柔性印刷电路板及其制造方法，以在不使用覆盖层的热固性粘合剂的情况下显着地改善柔性。 柔性柔性印刷电路板包括柔性绝缘层（104），电路图案（102）和刚性绝缘层（105）。 电路图案铺设在柔性绝缘层的内部。 刚性绝缘层覆盖柔性绝缘层的一部分。 柔性绝缘层和刚性绝缘层依次层叠。 刚性柔性印刷电路板还包括用于覆盖电路图案的保护绝缘材料。 电路图案通过添加方法形成，并通过卷对卷方式转移到柔性绝缘层。
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公开(公告)号：KR1020160090626A
公开(公告)日：2016-08-01
申请号：KR1020150010658
申请日：2015-01-22
Applicant: 삼성전기주식회사
CPC classification number: H05K1/187 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K3/007 , H05K3/025 , H05K3/181 , H05K3/188 , H05K3/4007 , H05K3/4038 , H05K3/4697 , H01L2924/00014 , H01L2924/00 , H05K1/185
Abstract: 본발명의전자부품내장형인쇄회로기판은, 절연층의일면에접속단자가노출되도록매립된전자부품및 상기절연층의일면에상기전자부품의노출된접속단자에형성된금속범프를포함하여, 전자부품의접속단자가노출된상태에외장부품과비아홀을가공할필요없이직접연결됨으로써신호전달에유리하여전송손실을최소화할 수있다.
Abstract translation: 根据本发明，具有嵌入式电子部件的印刷电路板包括：埋入以暴露绝缘层的一个表面上的连接端子的电子部件; 以及形成在绝缘层的表面上的电子部件的暴露的连接端子中的金属凸块。 在电子部件的连接端子露出的状态下，外部部件直接连接到通孔而不进行处理，从而有利于信号传输并使传输损失最小化。
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公开(公告)号：KR1020120041960A
公开(公告)日：2012-05-03
申请号：KR1020100103392
申请日：2010-10-22
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4647 , H05K1/0366 , H05K2201/0195 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/51
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the intensity of a printed circuit board by arranging an insulation layer and a film layer including reinforcement material between circuit layers connected to a post via. CONSTITUTION: A first circuit layer(15) is formed on the upper side of a first insulation layer(10). A second insulation layer(30) including a reinforcement material is formed on the first insulation layer. A film layer(40) is formed on the second insulation layer. A post via(20) is formed on the first circuit layer via the second insulation layer and the film layer. A second circuit layer is formed on the upper side of the film layer via the post via.
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过在连接到柱通孔的电路层之间布置绝缘层和包括增强材料的膜层来提高印刷电路板的强度。 构成：在第一绝缘层（10）的上侧形成有第一电路层（15）。 在第一绝缘层上形成包括增强材料的第二绝缘层（30）。 在第二绝缘层上形成膜层（40）。 通过第二绝缘层和膜层在第一电路层上形成柱（20）。 通过柱通孔在膜层的上侧形成第二电路层。
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