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公开(公告)号：KR100999526B1
公开(公告)日：2010-12-08
申请号：KR1020080119592
申请日：2008-11-28
Applicant: 삼성전기주식회사
IPC: H05K1/02
Abstract: 특정 주파수 대역의 노이즈 차폐를 위한 전자기 밴드갭 구조물이 제공된다. 본 발명의 실시예에 따른 전자기 밴드갭 구조물은, 복수개의 제1 도전판; 상기 제1 도전판들과는 다른 평면 상에 상기 제1 도전판들 각각과 오버랩되게 위치하는 복수개의 제2 도전판; 상기 제1 도전판들과 상기 제2 도전판들 사이에 개재되는 유전층; 및 상기 제1 도전판들 및 상기 제2 도전판들 중 오버랩된 도전판 간을 제외한 어느 2개의 도전판들 간 마다를 전기적으로 연결하되, 일부분이 상기 어느 2개의 도전판과는 다른 평면 상을 경유하도록 제작되는 스티칭 비아를 포함한다.
전자기 밴드갭 구조, 노이즈, 차폐, 회로 기판.Abstract translation: 提供了用于特定频带的噪声屏蔽的电磁带隙结构。 根据本发明实施例的电磁带隙结构包括：多个第一导电板; 多个第二导电板，在与所述第一导电板不同的平面上与每个所述第一导电板重叠; 介于第一导电板和第二导电板之间的介电层; 并且在除了重叠的导电板之外的任何两个导电板之间将每个第一导电板和第二导电板彼此电连接， 并缝制过孔通过。
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公开(公告)号：KR100797674B1
公开(公告)日：2008-01-23
申请号：KR1020060099450
申请日：2006-10-12
Applicant: 삼성전기주식회사
IPC: H05K13/08
Abstract: A heater of an apparatus for measuring substrate temperature is provided to improve work efficiency for installing the heater at the time of measuring the temperatures and the reliability of a measured result. A heater of an apparatus for measuring substrate temperature includes a heater unit(10), and a magnet(20). The heater unit generates heat with an electric heating wire(13) connected to a side thereof. The heater unit has an integrated contact plate(12) made of a magnetic material and having a flat surface in contact with a mounting surface(p') of a heat generating element of a circuit board(p). The magnet is placed on an opposite surface of the circuit board and applies a magnetic force to the contact plate. The heater unit includes a tube-shaped body(11) having the electric heating wire and the contact surface and made of a non-magnetic metal material.
Abstract translation: 提供了用于测量基板温度的装置的加热器，以提高在测量温度和测量结果的可靠性时安装加热器的工作效率。 用于测量基板温度的装置的加热器包括加热器单元（10）和磁体（20）。 加热器单元通过与其一侧连接的电加热丝（13）产生热量。 加热器单元具有由磁性材料制成并具有与电路板（p）的发热元件的安装表面（p'）接触的平坦表面的集成接触板（12）。 将磁体放置在电路板的相对表面上，并向接触板施加磁力。 加热器单元包括具有电加热丝和接触表面并由非磁性金属材料制成的管状本体（11）。
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公开(公告)号：KR101072591B1
公开(公告)日：2011-10-11
申请号：KR1020090073444
申请日：2009-08-10
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: EMI 노이즈저감인쇄회로기판이개시된다. 상기인쇄회로기판은, 대역저지주파수특성을갖는전자기밴드갭구조가내부에삽입되는다층인쇄회로기판으로서, 그라운드층과전원층이마련되는제1 영역과; 상기제1 영역의측면에위치하여, 상기제1 영역의측면을통해외부로방사되는 EMI 노이즈를차폐하도록상기전자기밴드갭구조가마련되는제2 영역을포함하되, 상기전자기밴드갭구조는, 상기인쇄회로기판의가장자리를따라위치하는복수개의제1 도전판과; 상기제1 도전판과다른평면상에, 상기제1 도전판과교번하도록배치되는복수개의제2 도전판과; 상기제1 도전판과상기제2 도전판을연결하는비아를포함한다.
Abstract translation: 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿板的边缘放置的多个第一导电板，多个第二导电板，设置在不同于第一导电板的平面上，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。
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公开(公告)号：KR100722597B1
公开(公告)日：2007-05-28
申请号：KR1020050059763
申请日：2005-07-04
Applicant: 삼성전기주식회사
IPC: H01L23/485
CPC classification number: H01L23/49811 , H01L2924/0002 , H01L2924/00
Abstract: 본 발명은 더미 영역(dummy area)에 소정 형상의 구리 패턴을 형성함으로써, 전체 반도체 패키지 기판의 휨을 개선하는 구리 패턴이 형성된 더미 영역을 구비한 반도체 패키지 기판에 관한 것이다.
본 발명에 따른 구리 패턴은 반도체 패키지 기판의 길이 방향으로 형성된 빔 영역과, 폭 방향으로 형성된 리브 영역으로 형성된 것을 기술적 특징으로 한다.
반도체 패키지 기판, 더미 영역, 솔더 레지스트, 빔, 리브-
公开(公告)号：KR1020140074637A
公开(公告)日：2014-06-18
申请号：KR1020120142817
申请日：2012-12-10
Applicant: 삼성전기주식회사
Abstract: Disclosed are a multilayer printed circuit board and a manufacturing method thereof. The multilayer printed circuit board manufacturing method includes the following steps of: (a) forming an inner layer circuit pattern on an inner layer substrate with first metal; (b) laminating a barrier layer on the surface of the inner layer circuit pattern with second metal; (c) laminating an outer layer substrate on the inner substrate in order to cover the inner layer circuit pattern; (d) making a part of the barrier layer exposed by perforating a via hole on the outer layer substrate; (e) making the inner circuit pattern exposed by removing the exposed barrier layer; and (f) filling the via hole. The multilayer printed circuit board manufacturing method is able to protect an inner layer pad when removing an outer layer copper film by plating the inner layer pad with a material which is not etched by copper (Cu) etching solution including nickel (Ni). Like the forementioned, a dimple which can be generated on the outer layer can be stably managed by protecting the inner layer pad.
Abstract translation: 公开了一种多层印刷电路板及其制造方法。 多层印刷电路板的制造方法包括以下步骤：（a）在第一金属的内层基板上形成内层电路图案; （b）用第二金属在内层电路图案的表面上层叠阻挡层; （c）在内部基板上层叠外层基板以覆盖内层电路图案; （d）通过在外层基板上穿孔通孔而使阻挡层的一部分暴露出来; （e）通过去除暴露的阻挡层使内部电路图案暴露; 和（f）填充通孔。 多层印刷电路板的制造方法能够通过用不含铜（Cu）蚀刻溶液（包括镍（Ni））蚀刻的材料对内层焊盘进行镀覆来除去外层铜膜来保护内层焊盘。 如前所述，通过保护内层垫可以稳定地管理在外层上产生的凹坑。
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Patent Agency Ranking
公开(公告)号：KR101021551B1
公开(公告)日：2011-03-16
申请号：KR1020090089611
申请日：2009-09-22
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H05K2201/09309 , H05K2201/09627
Abstract: PURPOSE: A printed circuit board with an electromagnetic band gap structure is provided to reduce noise of various frequency bands, thereby minimizing manufacturing costs. CONSTITUTION: A printed circuit board is inserted into an electromagnetic band gap structure. The second conductive plate(20) is arranged on a plane different from the first conductive plate(10). The third conductive plate(30) is arranged on the same plane as the first conductive plate. A connection pattern unit is arranged on a plane different from the second conductive plate. The first stitching via unit connects the first conductive plate with one end of the connection pattern unit. The second stitching via unit connects the third conductive plate with one end of the connection pattern unit. The first induction pattern is electrically separated from the second conductive plate. A via electrically connects the first induction pattern, the first conductive plate, and the connection pattern unit.
Abstract translation: 目的：提供具有电磁带隙结构的印刷电路板，以减少各种频带的噪声，从而最大限度地降低制造成本。 构成：将印刷电路板插入到电磁带隙结构中。 第二导电板（20）布置在与第一导电板（10）不同的平面上。 第三导电板（30）设置在与第一导电板相同的平面上。 连接图案单元布置在不同于第二导电板的平面上。 第一缝合通孔单元将第一导电板与连接图案单元的一端连接。 第二缝合通孔单元将第三导电板与连接图案单元的一端连接。 第一感应图案与第二导电板电分离。 A通孔电连接第一感应图案，第一导电板和连接图案单元。
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公开(公告)号：KR1020100060830A
公开(公告)日：2010-06-07
申请号：KR1020080119592
申请日：2008-11-28
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H05K1/115 , H05K2201/09627
Abstract: PURPOSE: An electromagnetic band gap structure and a circuit board are provided to be applied to various products by implementing various band gap frequency bands. CONSTITUTION: A second conductive plate(635-1,635-2) is positioned on the different plane from a first conductive plate(630-1,630-2). The second conductive plate is overlapped with the first conductive plate. A dielectric layer(620) is interposed between the first and second conductive plates. A stitching via includes a first via, a second via, and a conductive connection pattern. One end of the first via is connected to the first conductive plate. One end of the second via is connected to the second conductive plate. The conductive connection pattern connects the other end of the first via and the other end of the second via.
Abstract translation: 目的：通过实现各种带隙频带，提供电磁带隙结构和电路板，以应用于各种产品。 构成：第二导电板（635-1,635-2）位于与第一导电板（630-1,630-2）不同的平面上。 第二导电板与第一导电板重叠。 介电层（620）介于第一和第二导电板之间。 缝合通孔包括第一通孔，第二通孔和导电连接图案。 第一通孔的一端连接到第一导电板。 第二通孔的一端连接到第二导电板。 导电连接图案连接第一通孔的另一端和第二通孔的另一端。
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公开(公告)号：KR101158237B1
公开(公告)日：2012-06-19
申请号：KR1020110002250
申请日：2011-01-10
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A printed circuit board is provided to effectively reduce a bending phenomenon of the printed circuit board after mounting a chip by reducing plating deviation between a package region and a dummy region. CONSTITUTION: All kinds of electrical devices are mounted on a package region(110). The package region forms a circuit pattern. A copper pattern(121) is an adjacent region of the package region. The copper pattern is formed within 100 to 400micrometers from the outer-most side of the package region. The copper pattern is formed in a dummy region(120) in order to surround the package region. The copper pattern covers about 15-60% of the dummy region area.
Abstract translation: 目的：提供一种印刷电路板，通过减少封装区域和虚拟区域之间的电镀偏差，安装芯片后有效减少印刷电路板的弯曲现象。 规定：各种电气设备安装在包装区域（110）上。 封装区域形成电路图案。 铜图案（121）是封装区域的相邻区域。 铜图案从包装区域的最外侧形成在100至400微米的范围内。 为了包围封装区域，在虚拟区域（120）中形成铜图案。 铜图案覆盖了虚拟区域的大约15-60％。
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公开(公告)号：KR1020110032601A
公开(公告)日：2011-03-30
申请号：KR1020090090166
申请日：2009-09-23
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: The printed circuit board equipped with the electromagnetic band gap structure easily reduces the various frequency bands of noises. In that way the power consumption can be reduced. CONSTITUTION: The first and the second electric conductor part are arranged on the each other different plane. The third electric conductor part is arranged on the second electric conductor part and the different plane. The first stitching via part(90) interlinks the first conductor part and the third electric conductor part via the plane in which the second electric conductor part is arranged.
Abstract translation: 目的：配备电磁带隙结构的印刷电路板可以轻松减少各种频段的噪音。 这样可以降低功耗。 构成：第一和第二导电体部分布置在彼此不同的平面上。 第三导体部分布置在第二导电体部分和不同的平面上。 第一缝合通孔部（90）经由配置有第二导电体部的平面将第一导体部和第三导电体部互相连接。
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公开(公告)号：KR101023541B1
公开(公告)日：2011-03-21
申请号：KR1020090089799
申请日：2009-09-22
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: A printed circuit board for reducing an EMI noise is provided to shield a radiation noise by inserting an electromagnetic bandgap structure into the substrate. CONSTITUTION: A ground layer and a power layer are formed on a first region(100). A second region is positioned on the side of the first region and includes an electromagnetic bandgap structure to shield an EMI noise emitted to the outside through the side of the first region. A first conductive plate(220a) and a second conductive plate(220b) are formed on the same plane along the side of the first region. A stitching via part(250) electrically connects the first and second conductive plates.
Abstract translation: 目的：提供用于降低EMI噪声的印刷电路板，通过将电磁带隙结构插入基板来屏蔽辐射噪声。 构成：在第一区域（100）上形成接地层和功率层。 第二区域位于第一区域的侧面，并且包括电磁带隙结构，以屏蔽通过第一区域的一侧发射到外部的EMI噪声。 第一导电板（220a）和第二导电板（220b）沿着第一区域的一侧形成在同一平面上。 缝合通孔部分（250）电连接第一和第二导电板。
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