Abstract:
이미지 센서의 형성 방법을 제공한다. 이 방법에서, 고전압 영역에서 두꺼운 게이트 절연막이 먼저 형성되고, 상기 두꺼운 게이트 절연막이 게이트 전극막으로 덮인 상태에서 저전압 영역에서 질소를 포함하는 분위기하에서 얇은 게이트 절연막이 형성되므로, 질소가 확산하여 상기 두꺼운 게이트 절연막 내부로 침투되는 것을 방지할 수 있다. 이로써, 계면 트랩의 증가 및 이에 따른 플리커 노이즈등의 문제를 방지할 수 있다. 이미지 센서
Abstract:
A method for forming an image sensor is provided to prevent the generation of flicker noises by restraining nitrogen from penetrating into a gate insulating layer using an enhanced dual gate insulating layer structure with a second gate insulating layer formed under nitrogen gas atmosphere. A first region and a second region are defined on a semiconductor substrate(1). A first gate electrode layer(9) is formed on the first region of the substrate via a first gate insulating layer(7) and a second gate electrode layer is formed on the second region of the substrate via a second gate insulating layer(15). A first gate pattern and a second gate pattern are formed within the first and the second regions by performing selectively a patterning process on the resultant structure. The second gate insulating layer is formed under nitrogen atmosphere.
Abstract:
PURPOSE: A CMOS image sensor comprising PNP triple layers, and a method for fabricating the same image sensor are provided to secure uniform photo response by forming an N type intermediate layer over a pixel region. CONSTITUTION: A substrate(100) is classified into a pixel region(A) and a peripheral circuit region(B). A PNP three layers(120) comprises a P-type sub-layer(122), an N type intermediate layer(124), and a P type top layer. An element isolation region(125), and a photo diode(130) and a well region(170) are formed within the P-type of the top part. The photo diode comprises an IR photo diode(130b) and a visible light photo diode(130a) for detecting infrared ray. The visible light photo diode comprises a PPD domain(132) and an NPD domain(134).
Abstract:
PURPOSE: An epitaxial wafer manufacturing method and an epi wafer thereof, and an image sensor thereof are provided to form a high concentration boron layer inside a wafer. CONSTITUTION: A wafer which includes boron is provided by cutting a single crystal silicon ingot(S110). An oxide film is grown in the front and the rear surface of the wafer(S120). The wafer is heat-treated(S130). An insulating layer which is formed in one side of the wafer is removed(S140). One side of the wafer is calender-grinded(S150). An epitaxial layer is formed in the front side of the wafer(S160).
Abstract:
PURPOSE: CMOS image sensor and a method for manufacturing the same are provided to prevent the generation of a white spot by forming an impurity layer on a photodiode area and a floating diffusion area and blocking a metal contamination material. CONSTITUTION: A semiconductor substrate(100) is divided into a photodiode area, a floating diffusion area, an active pixel sensor(APS) array circuit area and a peripheral circuit area. An epi-layer(105) includes a first conductive impurity formed on the semiconductor substrate. An impurity photodiode(140) is formed in the photodiode area. A transfer transistor includes a first channel(125) and a second channel(130) in the epi-layer floating diffusion area. A plurality of CMOS transistors is formed on the APS array circuit area and the peripheral circuit area. An impurity filtering layer(155) is formed between the transfer transistor electrode and the APS array circuit area.
Abstract:
An image sensor and a manufacturing method thereof are provided to prevent the etching damage of the photodiode surface by forming the upper body of the pattern for the photo diode protection with the silicon nitride film. An image sensor comprises photodiodes(112,114) which are formed within a substrate(101), and accumulate the photo-charge; a floating diffusion area(120) detecting the photo-charge accumulated in the photo diode; a transfer gate(130) delivering the photo-charge accumulated in the photo diode to the floating diffusion area; a pattern(220a) for the photodiode protection which is extended to one side wall and the upper side of the transfer gate conformably; the first spacer(220b) formed in the other sidewall of the transfer gate; the second spacers(240a,240b) formed in the pattern for the photodiode protection.
Abstract:
An image sensor, a manufacturing method thereof, and an image sensing method are provided to suppress a crosstalk due to a random drift of charges by forming a potential barrier on a lower substrate region. A photoelectric converter(110) is formed in a semiconductor substrate(101) with a depth between 1 and 3 mum and includes a photodiode with a second conductivity type and a capping layer with a first conductivity type. The photodiode accumulates charges corresponding to an incident beam. The capping layer is formed on the photodiode. A charge detector(120) receives the accumulated charges from the photoelectric converter and converts the charges into an electrical signal. A charge transfer part(130) delivers the accumulated charges to the charge detector. A voltage application unit(Vb) applies voltages on the capping layer and a lower portion of the semiconductor substrate, such that a width of a depletion layer is adjusted. The depletion layer is formed on the photodiode.
Abstract:
A method for fabricating an image sensor is provided to reduce a potential barrier generated by an impurity density difference between regions in a transfer gate pattern by forming an image sensor after impurities of a first conductivity type are implanted into a transfer gate pattern. A gate insulation layer and a gate conductive layer doped with impurities of a first conductivity type are formed on a semiconductor substrate(102). The gate insulation layer and the gate conductive layer are patterned to form a transfer gate pattern. A photodiode of the first conductivity type is formed at one side of the transfer gate pattern and a photodiode of a second conductivity type is formed on the photodiode of the first conductivity type. A floating diffusion region of the first conductivity type is formed in the substrate at the other side of the transfer gate pattern to complete a transfer gate electrode. In forming a gate conductive layer, the impurities of the first conductivity type can be doped at a dosage that can invert the impurities in the photodiode of the second conductivity type.