公开(公告)号：KR100461002B1

公开(公告)日：2004-12-09

申请号：KR1020020063608

申请日：2002-10-17

Applicant: 삼성전자주식회사

Inventor： 송기무 ,  강석진 ,  정석환 ,  이문철 ,  정규동 ,  김종석 ,  전찬봉 ,  홍석우 ,  강정호

IPC: H01L21/28

CPC classification number: B81B7/0006 ,  H01L21/76877 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-milling the deposited thin metal film. By the ion-milling, the method is capable of connecting a metal wiring to a via hole having an undercut.

Abstract translation: 在MEMS封装工艺中用于底切的金属布线方法包括：将MEMS元件设置在硅衬底上，将玻璃晶片焊接到其上设置有MEMS元件的硅衬底的上部，所述玻璃晶片具有形成在其中的孔，用于 连接金属布线，在该孔中沉积用于金属布线的薄金属膜，以及离子铣削沉积的薄金属膜。 通过离子铣削，该方法能够将金属布线连接到具有底切的通孔。 ＆lt;图像＆GT;

公开(公告)号：KR1020040034949A

公开(公告)日：2004-04-29

申请号：KR1020020063608

申请日：2002-10-17

Applicant: 삼성전자주식회사

Inventor： 송기무 ,  강석진 ,  정석환 ,  이문철 ,  정규동 ,  김종석 ,  전찬봉 ,  홍석우 ,  강정호

IPC: H01L21/28

CPC classification number: B81B7/0006 ,  H01L21/76877 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PURPOSE: A metal line method is provided to connect the metal line to the via hole having the undercut by using an ion milling unit. CONSTITUTION: A MEMS(Micro-Electronic Mechanical System) device(23) is installed on an upper surface of a silicon substrate(22). A glass wafer is adhered to an upper surface of the silicon substrate(22) having the MEMS device(23). In a MEMS packaging process for adhering the glass to the silicon substrate, a metal layer is deposited on a hole(26) of the glass wafer(24). The deposited layer is redeposited by performing an ion milling process.

Abstract translation: 目的：提供金属线方法，通过使用离子铣削单元将金属线连接到具有底切的通孔。 构成：在硅衬底（22）的上表面上安装有MEMS（微电子机械系统）装置（23）。 玻璃晶片粘附到具有MEMS器件（23）的硅衬底（22）的上表面上。 在用于将玻璃粘合到硅衬底的MEMS封装工艺中，金属层沉积在玻璃晶片（24）的孔（26）上。 沉积层通过进行离子研磨工艺再沉积。

公开(公告)号：KR100408529B1

公开(公告)日：2004-01-24

申请号：KR1019960051456

申请日：1996-10-31

Applicant: 삼성전자주식회사

Inventor： 안승도 ,  이승섭 ,  송기무

IPC: G01C19/00

Abstract: PURPOSE: A seesaw-shape electrostatic drive micro gyroscope is provided to amplify and transmit Coriolis force and accordingly improve the sensing capacity for angular velocity by seesawing suspended structures of large and small masses if the mass of the suspended structure is small, the Coriolis force is reduce, and then sensing capacity is decreased. CONSTITUTION: A seesaw-shape electrostatic drive micro gyroscope is composed of first and second structures(1a,2b) driven in a seesaw type toward a third axis vertical to a substrate for forming a plane comprising a first axis and a second axis crossing the first axis of a rectangular coordinate to incline the center of gravity to one side and amplify and transmit displacement to the third axis; a first supporting beam for supporting the first suspended structure; a first fixing device for fixing the first supporting beam; a second supporting beam for connecting the first and second suspended structures; an exciting device for exciting the first suspended structure to the first axis; an angular velocity sensing device arranged on the substrate right under the first and second suspended structures to sense that the two suspended structures are displaced toward the third axis when rotary power around the second axis is generated; and a second fixing device connected to the center of gravity of the first and second suspended structures of the second supporting beam to reduce sensitivity for acceleration.

公开(公告)号：KR100393183B1

公开(公告)日：2003-10-17

申请号：KR1019960051461

申请日：1996-10-31

Applicant: 삼성전자주식회사

Inventor： 이병렬 ,  오용수 ,  송기무

IPC: H03K3/00

Abstract: PURPOSE: A complementary electrostatic driver of a micro actuator is provided to prevent a mixing state of a vibration acceleration signal and a sensing signal and improve a signal to noise ratio by using an inverter. CONSTITUTION: A complementary electrostatic driver of a micro actuator includes a suspended vibration plate, a vibration acceleration plate, a vibration deceleration plate(22), a sensor(26), and an electrostatic driver. The vibration acceleration plate is formed with a first vibration acceleration plate and a second vibration acceleration plate separated from two comb groups. The electrostatic driver includes a power supply(25) and an inverter(27). The first vibration acceleration plate is connected to the power supply(25). The second vibration acceleration plate is connected to the power supply through the inverter(27).

公开(公告)号：KR100360477B1

公开(公告)日：2003-03-06

申请号：KR1019950040849

申请日：1995-11-11

Applicant: 삼성전자주식회사

Inventor： 송기무 ,  조한기 ,  백석순

IPC: G06F3/0354

Abstract: PURPOSE: A wireless electronic pen is provided to combine functions of a keyboard, a mouse, and a tablet so as to use as a multimedia device such as a computer, a facsimile-modem, ad a PDA. CONSTITUTION: A sensor structure(55) comprises three flexure type structures(55a,55b,55c) for measuring a speed of a pen and three comb type structures(55d,55e,55f) for measuring a rotation angle. Capacitance variations measured in each structure are transmitted to a main PCB(69) along a circuit line in a disk type PCB(68). A control unit(56) for controlling the sensor structure(55) and a pulse counter(57) for counting an output of the control unit(56) and outputting a signal in proportion to a speed and a rotation angle of the pen is mounted on the upper and lower surfaces in the main PCB(69). A buffer(70) temporarily stores an output of the pulse counter(57) and an up/down signal of the pen. A processing unit(58) reads data from the buffer(70), corrects a speed and a rotation angle, correct an error, and calculates a position of a pen-tip through integration. A RAM(71) temporarily stores data in a calculation process. A data memory(59) continuously stores inputted data. An interface unit(60) codes processed data for interfacing with a multimedia device. A transmitter(61) transmits coded data to a computer by wireless. A battery(62) supplies a power to electronic components.

公开(公告)号：KR1020020089787A

公开(公告)日：2002-11-30

申请号：KR1020010028689

申请日：2001-05-24

Applicant: 삼성전자주식회사

Inventor： 김종석 ,  송기무 ,  김정우 ,  이문철 ,  권영우 ,  김용권 ,  천창율

IPC: H01H59/00

Abstract: PURPOSE: An RF MEMS(Micro Electro Mechanical System) switch is provided to reduce an insertion loss when an RF switch is turned on and improve a signal separation characteristic when the RF switch is turned off. CONSTITUTION: An input signal line(112) and two output signal lines(114) are formed on a dielectric substrate(100). An RF ground is formed on both sides of the input signal line(112) and the output signal lines(114). A gap(116) is formed between the input signal line(112) and the output signal lines(114). A contact plate(130) is formed to an upper direction of the gap(116). A driving electrode(140) is formed at both sides of the gap(116). A plurality of anchors(142) are formed on the driving electrode(140). A plurality of driving beams(144) are extended to an opposite direction of the anchors(142). An insulating portion(160) is inserted between the driving beams(144) and the contact plate(130). An insulating layer is formed on an RF ground(120) contacted with the driving beams(144). The RF grounds(120) are connected each other with a bridge(150). The bridge(150) is formed with a pillar(152) and a beam(154).

Abstract translation: 目的：提供RF MEMS（微机电系统）开关，以在RF开关接通时减少插入损耗，并在RF开关关闭时提高信号分离特性。 构成：在电介质基板（100）上形成输入信号线（112）和两条输出信号线（114）。 在输入信号线（112）和输出信号线（114）的两侧形成RF接地。 在输入信号线（112）和输出信号线（114）之间形成间隙（116）。 接触板（130）形成在间隙（116）的上方。 驱动电极（140）形成在间隙（116）的两侧。 多个锚固件（142）形成在驱动电极（140）上。 多个驱动梁（144）延伸到锚固件（142）的相反方向。 绝缘部分（160）插入在驱动梁（144）和接触板（130）之间。 绝缘层形成在与驱动梁（144）接触的RF接地（120）上。 RF接地（120）通过桥（150）彼此连接。 桥（150）形成有支柱（152）和梁（154）。

公开(公告)号：KR1020010084239A

公开(公告)日：2001-09-06

申请号：KR1020000009103

申请日：2000-02-24

Applicant: 삼성전자주식회사

Inventor： 이은성 ,  김현철 ,  오용수 ,  송기무

IPC: B81C1/00

CPC classification number: B41J2/1433 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642

Abstract: PURPOSE: A monolithic fluidic nozzle assembly and a producing method thereof are provided to simplify structure and the producing method at a low cost through integrating entire structure in a silicon semiconductor process and an MEMS process. CONSTITUTION: A first mask is deposited on a silicon substrate to form an opening unit on the first mask in a photolithgraphy process. A second mask is deposited on the first mask to operates as a mask in etching a step unit. A third mask pattern is formed. Herein, a mask patterning operation is performed in a photo-resist to increase effect of etching selective rate. The second mask portion exposed by an opened portion of the third mask is etched. The third mask is eliminated to deposit a fourth mask material film. A fifth mask is formed on the fourth mask material film to form an opening portion. By etching the fourth mask material film by using the fifth mask, the opening portion is formed to perform a deep etching process. The deep etching process is performed through the opening of the fourth mask to form damper structure(217). After eliminating the fifth mask, protect films are formed to protect side walls of damper structure. An opening is formed through eliminating the protect film on a floor of the damper. By performing a wet etching on the exposed silicon substrate through the opening at the floor of the protect film to form a nozzle cone shaped unit. After depositing a nozzle cone shaped unit, a coating mask is deposited. After enlarging the opening portion of the fourth mask, the silicon substrate is etched to form a first step portion. The first mask is exposed by etching the silicon substrate to form a second step portion. A photo-resist mask pattern is formed at a vertex of the nozzle cone shaped portion while forming an opening portion of a nozzle discharge hole. After eliminating the photo-resist mask pattern, the silicon substrate is dry etched to form a nozzle discharge hole. A hydrophobic process is performed on walls of the nozzle discharge hole. By eliminating a vertex portion of the nozzle cone shaped portion coating mask, the nozzle discharge hole is completed.

Abstract translation: 目的：提供一种单片流体喷嘴组件及其制造方法，以通过将整个结构集成在硅半导体工艺和MEMS工艺中，以低成本简化结构和制造方法。 构成：第一掩模沉积在硅衬底上，以在光刻工艺中在第一掩模上形成开口单元。 在第一掩模上沉积第二掩模以在蚀刻步骤单元中作为掩模操作。 形成第三掩模图案。 这里，在光致抗蚀剂中进行掩模图案化操作以增加蚀刻选择率的效果。 蚀刻由第三掩模的开放部分露出的第二掩模部分。 消除第三掩模以沉积第四掩模材料膜。 在第四掩模材料膜上形成第五掩模以形成开口部分。 通过使用第五掩模蚀刻第四掩模材料膜，形成开口部分以进行深刻蚀处理。 通过打开第四掩模进行深刻蚀处理以形成阻尼结构（217）。 消除第五个掩模后，形成保护膜以保护阻尼器结构的侧壁。 通过消除阻尼器底板上的保护膜形成开口。 通过在保护膜的底板上的开口对暴露的硅衬底进行湿蚀刻以形成喷嘴锥形单元。 沉积喷嘴锥形单元后，沉积涂层掩模。 在扩大第四掩模的开口部分之后，蚀刻硅衬底以形成第一台阶部分。 通过蚀刻硅衬底来暴露第一掩模以形成第二台阶部分。 在形成喷嘴排出孔的开口部的同时，在喷嘴锥形部的顶点形成有光刻胶掩模图案。 在消除光刻胶掩模图案之后，将硅衬底干蚀刻以形成喷嘴排出孔。 在喷嘴排出孔的壁上进行疏水处理。 通过消除喷嘴锥形部分涂覆掩模的顶点部分，完成喷嘴排出孔。

公开(公告)号：KR1020000031676A

公开(公告)日：2000-06-05

申请号：KR1019980047827

申请日：1998-11-09

Applicant: 삼성전자주식회사

Inventor： 김호석 ,  고윤일 ,  강석진 ,  송기무

IPC: H01L21/314

Abstract: PURPOSE: A method is provided to produce an integrated electro mechanical system for being compatible while releasing a Micro Electro Mechanical System(MEMS) structure, for protecting the MEMS structure in hot oxygen atmosphere, and for reducing stress caused by a thermal budget. CONSTITUTION: A protecting film(15) of four layers is formed on a suspension structure(14) and an exposed sacrifice layer(13). And a CMOS circuit is formed on a circuit unit of a silicon wafer(11). Herein, an Al leading wire(16) is formed for electrically connecting the circuit unit with a micro mechanical unit. And the leading wire forms contacts(16a,16b) contacting to the circuit unit and to the micro mechanical unit. Then, a protecting film is formed on the circuit unit and the suspension structure is completed by etching the protecting film of four layers and the sacrifice layer.

Abstract translation: 目的：提供一种制造集成电机系统的方法，用于在释放微机电系统（MEMS）结构时兼容，用于在热氧气氛中保护MEMS结构，并减少热预算引起的应力。 构成：在悬挂结构（14）和暴露的牺牲层（13）上形成四层保护膜（15）。 并且在硅晶片（11）的电路单元上形成CMOS电路。 这里，形成用于将电路单元与微机械单元电连接的铝导线（16）。 并且引导线形成与电路单元和微机械单元接触的触点（16a，16b）。 然后，在电路单元上形成保护膜，通过蚀刻四层保护膜和牺牲层来完成悬浮结构。

公开(公告)号：KR1019980083156A

公开(公告)日：1998-12-05

申请号：KR1019970018323

申请日：1997-05-12

Applicant: 삼성전자주식회사

Inventor： 이승섭 ,  안승도 ,  송기무

IPC: G01C19/00

Abstract: 본 발명은 실리콘과 내열 유리(pyrex glass; 상품명)와의 양극 접합(anodic bonding) 기술, Deep RIE etching 기술, Bulk etching 기술 등 초미세 가공 기술을 이용하여 두꺼운 마이크로구조물(MEMS; Micro Electro Mechanical System)을 제조하는 마이크로구조물의 제조 방법에 관한 것이다. 본 발명에 따른 마이크로구조물의 제조 방법은, 마이크로구조물용 실리콘 기판을 선택적으로 식각하여 예비 마이크로구조물을 형성하는 단계; 유리 기판에 상기 예비 마이크로구조물의 도전막에 대응하는 전극을 형성하는 단계; 상기 전극이 형성된 유리 기판에 상기 예비 마이크로구조물을 접착하는 단계; 및 상기 예비 마이크로구조물의 홈이 노출되도록 불필요한 실리콘 기판부를 제거하여 상기 마이크로구조물을 완성하는 단계;를 포함한다. 따서, 마이크로구조물의 재료로 가공안된 실리콘 웨이퍼 자체를 이용하므로 잔류응력과 같은 문제가 존재하지 않으며, 다른 여러 가지 기계적 특성도 사용하는 웨이퍼를 한정하게 되면 항상 일정하게 된다. 따라서 마이크로구조물의 안정된 기계적 특성을 도모할 수 있다.

公开(公告)号：KR1019970028974A

公开(公告)日：1997-06-26

申请号：KR1019950040849

申请日：1995-11-11

Applicant: 삼성전자주식회사

Inventor： 송기무 ,  조한기 ,  백석순

IPC: G06F3/0354

Abstract: 본 발명은 무선 전자 펜에 관한 것이다.
본 발명은 전자부품들을 내장할 수 있는 공간을 제공하는 한편 내장된 전자 부품들을 보호하기 위한 하우징과, 상기 하우징에 내장되며 펜의 움직임을 검출하여 펜의 속도 및 회전 각도를 측정하기 위한 센서부와, 상기 하우징에 내장되며 상기 센서부로부터의 출력을 입력받아 실질적인 펜-팁의 위치를 계산하는 연산부와, 상기 연산부로부터의 출력을 호스트 기기에 전송하는 전송부를 구비한다.
이와 같은 본 발명은 컴퓨터에서는 키보드나 마우스, 팩스-모뎀에서는 스캐너, PDA에서는 태블릿 기능을 발휘할 수 있어 컴퓨터, 팩스-모뎀 및 PAD등에 자유롭게 사용할 수 있는 장점이 있다. 또한, 공간적인 제한없이 종이, 흑판, 허공중에서 문자, 숫자, 그림, 기호 등을 입력할 수 있고, 독립적인 정보저장 능력을 가지고 있어 별도의 호스트 기기없이 정보를 입력장치에 저장할 수 있는 장점이 있다.