자기 기억 소자
    1.
    发明授权
    자기 기억 소자 有权
    磁记忆装置

    公开(公告)号:KR101684915B1

    公开(公告)日:2016-12-12

    申请号:KR1020100072051

    申请日:2010-07-26

    Abstract: 자기기억소자를제공한다. 이소자에따르면, 자유패턴내에자유패턴의일 면에비평행한원자-자기모멘트들을증가시킬수 있다. 이로써, 임계전류밀도를감소시켜저소비전력화및/또는고집적화에최적화된자기기억소자를구현할수 있다.

    Abstract translation: 提供了磁存储器件,电子系统和包括其的存储卡,其制造方法以及控制磁性图案的磁化方向的方法。 在磁存储器件中,不平行于自由图案的一个表面的原子磁矩在自由图案中增加。 因此,可以减小磁存储器件的临界电流密度,使得磁存储器件的功耗被降低或最小化,和/或磁存储器件被改进或优化以达到更高的集成度。

    자기 메모리 소자 및 자기 메모리 소자의 제조 방법
    2.
    发明公开
    자기 메모리 소자 및 자기 메모리 소자의 제조 방법 无效
    磁记忆体装置及其制造方法

    公开(公告)号:KR1020130078456A

    公开(公告)日:2013-07-10

    申请号:KR1020110147416

    申请日:2011-12-30

    CPC classification number: H01L43/12 G11C11/161 H01L27/228

    Abstract: PURPOSE: A magnetic memory device and a manufacturing method of the magnetic memory device are provided to pattern an upper magnetic pattern by using an insulating layer as an etching stop film, thereby preventing the failure of an electrical short circuit. CONSTITUTION: A lower magnetic layer, an insulating layer, and an upper magnetic layer are successively formed on a substrate. An upper magnetic layer pattern (185) is formed by patterning the upper magnetic layer until the upper surface of the insulating layer is exposed. An element isolation pattern (220) is formed on the insulating layer and the lower magnetic layer, and an insulating pattern (175) and a lower magnetic pattern (165) are formed on a region in which the element isolation pattern is not formed by performing an oxidation process on the exposed upper surface of the insulating layer.

    Abstract translation: 目的:提供一种磁存储器件和磁存储器件的制造方法,通过使用绝缘层作为蚀刻停止膜来图案化上磁性图案,从而防止电气短路故障。 构成:在基板上依次形成下磁性层,绝缘层和上磁性层。 通过图案化上磁性层直到绝缘层的上表面露出形成上部磁性层图案(185)。 在绝缘层和下磁性层上形成元件隔离图案(220),在不通过执行元件隔离图案形成元件隔离图案的区域上形成绝缘图案(175)和下磁性图案(165) 在绝缘层的暴露的上表面上的氧化工艺。

    자기 터널 접합 구조체의 제조 방법 및 이를 이용하는 자기 메모리 소자의 제조 방법
    3.
    发明公开
    자기 터널 접합 구조체의 제조 방법 및 이를 이용하는 자기 메모리 소자의 제조 방법 无效
    用于形成磁隧道结结构的方法和使用其形成磁性随机存取存储器的方法

    公开(公告)号:KR1020120058113A

    公开(公告)日:2012-06-07

    申请号:KR1020100119756

    申请日:2010-11-29

    Abstract: PURPOSE: A method for manufacturing a magnetic tunnel junction structure and a method for manufacturing a magnetic memory device using the same are provided to prevent a short between a first magnetic film pattern and a second magnetic film pattern by forming a sidewall insulation pattern. CONSTITUTION: A magnetic tunnel junction layer(141) is formed by successively laminating a first magnetic layer(111), a tunnel insulation layer(121), and a second magnetic layer on a substrate. A mask pattern is formed on a preset area of the second magnetic layer. A magnetic tunnel junction film pattern and a sidewall insulation film pattern are formed by performing an etching and oxidizing process set several times.

    Abstract translation: 目的:提供一种用于制造磁性隧道结结构的方法和使用其的磁性存储器件的制造方法,以通过形成侧壁绝缘图案来防止第一磁性膜图案和第二磁性膜图案之间的短路。 构成:通过在基板上依次层叠第一磁性层(111),隧道绝缘层(121)和第二磁性层来形成磁性隧道结层(141)。 在第二磁性层的预设区域上形成掩模图案。 通过进行几次设定的蚀刻和氧化处理,形成磁隧道结膜图案和侧壁绝缘膜图案。

    자기 메모리 소자 및 이를 포함하는 메모리 카드 및 시스템
    7.
    发明公开
    자기 메모리 소자 및 이를 포함하는 메모리 카드 및 시스템 有权
    磁记忆体装置及存储卡及系统包括相同

    公开(公告)号:KR1020120009926A

    公开(公告)日:2012-02-02

    申请号:KR1020100071061

    申请日:2010-07-22

    CPC classification number: H01L27/228 G11C11/161 H01L43/08 H01L43/10 H01L43/12

    Abstract: PURPOSE: A magnetic memory element and a memory card and system including the same are provided to easily form a vertical magnetization layer by forming a plurality of seed layers for the vertical direction growth of an L10 construction material. CONSTITUTION: A substrate(10) comprises an element isolation film(12) limiting an active area(11). A gate structure(20) is located in the active area of the substrate. The gate structure comprises a gate isolation layer(21), a gate electrode layer(22), a capping layer(23), and a spacer(24). A first contact plug(25) and a second contact plug(26) having conductivity are located in the outside of the gate structure. A first intermediate dielectric layer(30) and a second intermediate dielectric layer(40) which covers the gate structure are successively located on the substrate.

    Abstract translation: 目的:提供一种磁存储元件及包括该磁存储元件的存储卡和系统,以通过形成用于L10结构材料的垂直方向生长的多个晶种层来容易地形成垂直磁化层。 构成:衬底(10)包括限制有源区(11)的元件隔离膜(12)。 栅极结构(20)位于衬底的有源区域中。 栅极结构包括栅极隔离层(21),栅电极层(22),覆盖层(23)和间隔物(24)。 具有导电性的第一接触插塞(25)和第二接触插塞(26)位于门结构的外部。 覆盖栅极结构的第一中间介电层(30)和第二中间介质层(40)依次位于基板上。

    상변화 물질을 포함하는 비휘발성 메모리 소자
    8.
    发明公开
    상변화 물질을 포함하는 비휘발성 메모리 소자 有权
    具有相变材料的非易失性存储器件

    公开(公告)号:KR1020110022250A

    公开(公告)日:2011-03-07

    申请号:KR1020090079767

    申请日:2009-08-27

    Abstract: PURPOSE: A non-volatile memory device including the phase shift material is provided to have the low set speed, the low reset current, and the long lifecycle by comprising Ge-Sb-Te phase shift material including the arsenic or the selenium. CONSTITUTION: A first interlayer insulation layer(120) is formed on a substrate(102). A second interlayer insulation layer(130) is formed on the first interlayer insulation layer. A bottom electrode(140) is formed inside the second interlayer insulation layer. A phase shift material layer(160) is formed on the bottom electrode. An upper electrode(170) is formed on the phase shift material layer.

    Abstract translation: 目的:通过包括砷或硒的Ge-Sb-Te相移材料,提供包括相移材料的非易失性存储器件以具有低设定速度,低复位电流和长寿命周期。 构成:在基板(102)上形成第一层间绝缘层(120)。 在第一层间绝缘层上形成第二层间绝缘层(130)。 底部电极(140)形成在第二层间绝缘层的内部。 在底部电极上形成相移材料层(160)。 在相移材料层上形成上电极(170)。

    상변화 물질을 포함하는 비휘발성 메모리 소자
    9.
    发明公开
    상변화 물질을 포함하는 비휘발성 메모리 소자 有权
    具有相变材料的非易失性存储器件

    公开(公告)号:KR1020110022249A

    公开(公告)日:2011-03-07

    申请号:KR1020090079766

    申请日:2009-08-27

    Abstract: PURPOSE: A non-volatile memory device including phase shift material is provided to have low drift coefficient and low reset current by comprising Sn-Sb-Te phase shift material. CONSTITUTION: A first interlayer insulation layer(120) covering a gate structure(110) is located on a substrate(102). A second interlayer insulation layer(130) is located on the first interlayer insulation layer. A bottom electrode(140) is locates inside the second interlayer insulation layer. A phase shift material layer(160) is located on the bottom electrode.

    Abstract translation: 目的:提供包括相移材料的非易失性存储器件,通过包含Sn-Sb-Te相移材料具有低漂移系数和低复位电流。 构成:覆盖栅极结构(110)的第一层间绝缘层(120)位于衬底(102)上。 第二层间绝缘层(130)位于第一层间绝缘层上。 底部电极(140)位于第二层间绝缘层的内部。 相移材料层(160)位于底部电极上。

    상변화 메모리 장치
    10.
    发明公开
    상변화 메모리 장치 无效
    相变存储器件

    公开(公告)号:KR1020090117103A

    公开(公告)日:2009-11-12

    申请号:KR1020080043005

    申请日:2008-05-08

    Abstract: PURPOSE: A phase change memory device is provided to perform a multi level cell function by including phase material patterns with different electrical characteristics. CONSTITUTION: A phase change memory device includes a first electrode, a second electrode, a first phase change material pattern(65) and a second phase change material pattern(75). The first phase change material pattern and the second phase change material pattern are interposed between the first electrode and the second electrode. The first and second phase change material patterns. The first phase change material pattern and the second phase change material pattern have different widths.

    Abstract translation: 目的:提供相变存储器件以通过包括具有不同电特性的相材料图案来执行多电平单元功能。 构成:相变存储器件包括第一电极,第二电极,第一相变材料图案(65)和第二相变材料图案(75)。 第一相变材料图案和第二相变材料图案介于第一电极和第二电极之间。 第一和第二相变材料图案。 第一相变材料图案和第二相变材料图案具有不同的宽度。

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