Abstract:
PURPOSE: A magnetic memory device and a manufacturing method of the magnetic memory device are provided to pattern an upper magnetic pattern by using an insulating layer as an etching stop film, thereby preventing the failure of an electrical short circuit. CONSTITUTION: A lower magnetic layer, an insulating layer, and an upper magnetic layer are successively formed on a substrate. An upper magnetic layer pattern (185) is formed by patterning the upper magnetic layer until the upper surface of the insulating layer is exposed. An element isolation pattern (220) is formed on the insulating layer and the lower magnetic layer, and an insulating pattern (175) and a lower magnetic pattern (165) are formed on a region in which the element isolation pattern is not formed by performing an oxidation process on the exposed upper surface of the insulating layer.
Abstract:
PURPOSE: A method for manufacturing a magnetic tunnel junction structure and a method for manufacturing a magnetic memory device using the same are provided to prevent a short between a first magnetic film pattern and a second magnetic film pattern by forming a sidewall insulation pattern. CONSTITUTION: A magnetic tunnel junction layer(141) is formed by successively laminating a first magnetic layer(111), a tunnel insulation layer(121), and a second magnetic layer on a substrate. A mask pattern is formed on a preset area of the second magnetic layer. A magnetic tunnel junction film pattern and a sidewall insulation film pattern are formed by performing an etching and oxidizing process set several times.
Abstract:
본 발명은 비휘발성 기억 소자와 그 형성방법을 제공한다. 이 소자는 반도체 기판 상에 형성된 하부 전극, 하부 전극 상에 형성된 상변화 물질 패턴, 상변화 물질 패턴 상에 형성된 접착 패턴, 및 접착 패턴 상에 형성된 상부 전극을 포함하되, 접착 패턴은 질소를 포함하는 도전체이다. 상변화 물질, 비휘발성 기억 소자, 금속 질화막, 조성비
Abstract:
PURPOSE: A magnetic memory element and a memory card and system including the same are provided to easily form a vertical magnetization layer by forming a plurality of seed layers for the vertical direction growth of an L10 construction material. CONSTITUTION: A substrate(10) comprises an element isolation film(12) limiting an active area(11). A gate structure(20) is located in the active area of the substrate. The gate structure comprises a gate isolation layer(21), a gate electrode layer(22), a capping layer(23), and a spacer(24). A first contact plug(25) and a second contact plug(26) having conductivity are located in the outside of the gate structure. A first intermediate dielectric layer(30) and a second intermediate dielectric layer(40) which covers the gate structure are successively located on the substrate.
Abstract:
PURPOSE: A non-volatile memory device including the phase shift material is provided to have the low set speed, the low reset current, and the long lifecycle by comprising Ge-Sb-Te phase shift material including the arsenic or the selenium. CONSTITUTION: A first interlayer insulation layer(120) is formed on a substrate(102). A second interlayer insulation layer(130) is formed on the first interlayer insulation layer. A bottom electrode(140) is formed inside the second interlayer insulation layer. A phase shift material layer(160) is formed on the bottom electrode. An upper electrode(170) is formed on the phase shift material layer.
Abstract:
PURPOSE: A non-volatile memory device including phase shift material is provided to have low drift coefficient and low reset current by comprising Sn-Sb-Te phase shift material. CONSTITUTION: A first interlayer insulation layer(120) covering a gate structure(110) is located on a substrate(102). A second interlayer insulation layer(130) is located on the first interlayer insulation layer. A bottom electrode(140) is locates inside the second interlayer insulation layer. A phase shift material layer(160) is located on the bottom electrode.
Abstract:
PURPOSE: A phase change memory device is provided to perform a multi level cell function by including phase material patterns with different electrical characteristics. CONSTITUTION: A phase change memory device includes a first electrode, a second electrode, a first phase change material pattern(65) and a second phase change material pattern(75). The first phase change material pattern and the second phase change material pattern are interposed between the first electrode and the second electrode. The first and second phase change material patterns. The first phase change material pattern and the second phase change material pattern have different widths.