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公开(公告)号：KR101686140B1
公开(公告)日：2016-12-14
申请号：KR1020100094318
申请日：2010-09-29
Applicant: 삼성전자주식회사
IPC: H01L23/13 , H01L23/60 , H01L23/31 , H01L23/498 , H01L23/00
CPC classification number: H01L23/60 , H01L23/13 , H01L23/3121 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/48235 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 반도체칩 패키지구조가제공된다. 본발명의일 실시예에따른반도체칩 패키지는, 기판, 기판의일면상에실장된반도체칩, 기판의타면상에형성된복수의전극패드, 및복수의전극패드중 제1 전극패드의일부및 제2 전극패드의일부와오버랩된정전기방전보호패드를포함한다.
Abstract translation: 提供半导体芯片封装的结构。 半导体芯片封装包括：基板; 安装在所述基板的第一表面上的半导体芯片; 与基板的第一表面不同的第二表面上的多个电极焊盘; 以及与所述多个电极焊盘中的第一电极焊盘的一部分和第二电极焊盘的一部分重叠的静电放电保护焊盘。
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公开(公告)号：KR101493869B1
公开(公告)日：2015-02-23
申请号：KR1020080095518
申请日：2008-09-29
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
Abstract: 방열 효과가 향상되며, 방열 부재들이 전자장치에 장기간 안정적으로 고정 유지될 수 있는 COF형 반도체 패키지가 개시된다. 상기 반도체 패키지는 유연성을 갖는 절연 기판과, 상기 절연 기판의 상부면에 배치된 반도체 소자와, 상기 절연 기판의 하부면에 배치된 방열 부재 및 상기 절연 기판의 하부면과 상기 방열 부재 사이를 접착시키는 접착 부재를 포함하며, 상기 절연 기판의 하부면과 상기 방열 부재 사이에는 외부 압력을 흡수할 수 있는 압력 흡수 영역이 형성되어 있다.
COF, 패키지, 방열, 분리, 섀시, 압력, 흡수-
公开(公告)号：KR1020140146875A
公开(公告)日：2014-12-29
申请号：KR1020130069738
申请日：2013-06-18
Applicant: 삼성전자주식회사
Inventor： 조경순
CPC classification number: H05K1/118 , G02F1/13452 , H05K1/189 , H05K2201/09409 , H05K2201/09709 , H05K2201/10128 , H01L27/3241 , G09F9/301 , G09G3/3208 , H05B31/50 , H05B33/04 , H05B33/06
Abstract: Provided is a display device. The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a direction. The panel bumps include first panel bumps which are separated from each other along a first row and second panel bumps which are separated from each other along a second row. Each of the second panel bumps are arranged between two adjacent first panel bumps. The panel lead bondings include a first panel lead bondings connected to the first panel bumps and second panel lead bondings connected to the second panel bumps. Each of the first panel lead bondings have a first part having a first thickness and a second part having a second thickness which is less than the first thickness. The second part is a part adjacent to the second panel bumps.
Abstract translation: 提供了一种显示装置。 显示装置包括：显示面板，包括多个面板凸块，连接到显示面板并具有安装芯片的柔性电路膜，以及连接显示面板和芯片的多个面板引线键合，并且在方向 。 面板凸块包括沿着第一排彼此分离的第一面板凸块和沿着第二排彼此分离的第二面板凸块。 每个第二面板凸块布置在两个相邻的第一面板凸块之间。 面板引线键合包括连接到第一面板凸块的第一面板引线键合和连接到第二面板凸块的第二面板引线键合。 每个第一面板引线键合具有第一部分和第二部分，第一部分具有第一厚度，第二部分具有小于第一厚度的第二厚度。 第二部分是与第二面板凸块相邻的部分。
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公开(公告)号：KR1020130123684A
公开(公告)日：2013-11-13
申请号：KR1020120047000
申请日：2012-05-03
Applicant: 삼성전자주식회사
IPC: H01L23/12
CPC classification number: H01L25/167 , H01L23/49827 , H01L23/4985 , H01L27/323 , H01L27/3276 , H01L27/3288 , H01L51/52 , H01L51/524 , H01L2251/5338 , H01L2924/0002 , H01L2924/00
Abstract: The present invention provides a device assembly including a chip-on-film. The device assembly includes a film package which includes a semiconductor chip, a panel board which is connected to one end of the film package, a display panel which is arranged on the panel board, and a circuit board which is connected to the other end of the film package. The film package includes a film substrate, a first wire which is arranged on the upper surface of the film substrate, and a second wire which is arranged on the lower surface of the film substrate.
Abstract translation: 本发明提供了一种包括片上电影的装置组件。 该装置组件包括薄膜封装，其包括半导体芯片，连接到薄膜封装的一端的面板，布置在面板上的显示面板，以及电路板，其与另一端 电影包。 薄膜封装包括薄膜基板，布置在薄膜基板的上表面上的第一布线和布置在薄膜基板的下表面上的第二布线。
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公开(公告)号：KR1020130071140A
公开(公告)日：2013-06-28
申请号：KR1020110138490
申请日：2011-12-20
Applicant: 삼성전자주식회사
IPC: G02F1/1345
CPC classification number: H05K7/00 , H05K1/028 , H05K1/147 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10128
Abstract: PURPOSE: A tape wiring substrate and a chip on film package including the same are provided to reduce the stress applied to a line pattern by using at least one recess formed in the bending part of a base film. CONSTITUTION: A tape line board(130) includes a base film(110) and a line pattern(120). At least one recess(115) is formed on one surface of the base film. A chip mounting area for a semiconductor chip(140) is formed in the other surface of the base film. A line pattern is formed in the other surface of the base film and extended to the edge of the chip mounting area. A protection layer(160) covers the line pattern.
Abstract translation: 目的：提供一种带状布线基板和包括该带状布线基板的胶片封装，以通过使用形成在基膜的弯曲部分中的至少一个凹部来减小施加于线图案的应力。 构成：带状线路板（130）包括基膜（110）和线图案（120）。 在基膜的一个表面上形成至少一个凹部（115）。 在基膜的另一个表面上形成用于半导体芯片（140）的芯片安装区域。 在基膜的另一个表面上形成线延伸到芯片安装区域的边缘。 保护层（160）覆盖线图案。
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Patent Agency Ranking
公开(公告)号：KR1020100029629A
公开(公告)日：2010-03-17
申请号：KR1020080088469
申请日：2008-09-08
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
Abstract: PURPOSE: A tape package and a display device thereof are provided to decrease heat in a semiconductor chip by forming a bonding layer for heat-sink in one side which the semiconductor chip is arranged and the other side which is faced with the one side. CONSTITUTION: A tape package and a display device thereof comprise a base film(220), a wiring(230), a protective film(240), a semiconductor chip(250), and a bonding layer(280). The base film comprises an insulating film like polyimide or polyester. The wiring is arranged on the single-side of the base film. The protective film is formed on the single-side of the base film and the wirings so that one part of the wirings is exposed. The semiconductor chip is installed on the single-side of the base film and is touched with the exposed parts of the wirings. The bonding layer is arranged in the other side which is faced with the single-side of the base film.
Abstract translation: 目的：提供一种胶带包装及其显示装置，用于通过在半导体芯片布置的一侧形成散热用接合层和面向一侧的另一侧来减少半导体芯片中的热量。 构成：带式封装及其显示装置包括基膜（220），布线（230），保护膜（240），半导体芯片（250）和接合层（280）。 基膜包括绝缘膜，如聚酰亚胺或聚酯。 布线布置在基膜的单面上。 保护膜形成在基膜的单侧和布线上，使得一部分布线露出。 半导体芯片安装在基膜的单面上并与布线的暴露部分接触。 接合层布置在面对基膜的单侧的另一侧。
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公开(公告)号：KR1020100007514A
公开(公告)日：2010-01-22
申请号：KR1020080068170
申请日：2008-07-14
Applicant: 삼성전자주식회사
IPC: H05K3/12
CPC classification number: H05K3/207 , H05K1/0393 , H05K3/1216 , H05K3/386 , H05K2203/0113 , Y10T29/49002 , Y10T29/49128 , Y10T29/4913
Abstract: PURPOSE: A method of manufacturing a wiring substrate, a method of manufacturing a tape package and a method of manufacturing a display device are provided to reduce the thermal transformation of substrate and dimensional change of in manufacturing process. CONSTITUTION: The screen(120) having the opening for the wiring formation on the base plate(110) is attached. The conductive paste is spread in the opening for the wiring formation of screen. Substrate is arranged on the screen in which the conductive paste(124) is spread. The conductive paste is hardened and is attached to substrate. The base plate and screen are removed from substrate.
Abstract translation: 目的：提供一种制造布线基板的方法，制造带封装的方法和制造显示装置的方法，以减少基板的热转换和制造工艺的尺寸变化。 构成：安装有用于在基板（110）上形成布线的开口的屏幕（120）。 导电膏在屏幕的布线形成开口中扩展。 基板布置在其中传播导电浆料（124）的屏幕上。 导电膏被硬化并附着到基底上。 基板和屏幕从基板上取下。
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